KR100770852B1 - 화학 기계적 평탄화용 그루브형 연마 패드 - Google Patents

화학 기계적 평탄화용 그루브형 연마 패드 Download PDF

Info

Publication number
KR100770852B1
KR100770852B1 KR1020027016049A KR20027016049A KR100770852B1 KR 100770852 B1 KR100770852 B1 KR 100770852B1 KR 1020027016049 A KR1020027016049 A KR 1020027016049A KR 20027016049 A KR20027016049 A KR 20027016049A KR 100770852 B1 KR100770852 B1 KR 100770852B1
Authority
KR
South Korea
Prior art keywords
pad
groove
polishing
polishing pad
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020027016049A
Other languages
English (en)
Korean (ko)
Other versions
KR20030005405A (ko
Inventor
제임스데이빗비.
비쉬와네이썬애런
쿡리멜번
버크피터에이.
쉬드너데이빗
소조셉케이.
로버츠존브이.에이치.
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100770852(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20030005405A publication Critical patent/KR20030005405A/ko
Application granted granted Critical
Publication of KR100770852B1 publication Critical patent/KR100770852B1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020027016049A 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드 Ceased KR100770852B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US60/207,938 2000-05-27
US22209900P 2000-07-28 2000-07-28
US60/222,099 2000-07-28
PCT/US2001/016870 WO2001091972A1 (en) 2000-05-27 2001-05-24 Grooved polishing pads for chemical mechanical planarization

Publications (2)

Publication Number Publication Date
KR20030005405A KR20030005405A (ko) 2003-01-17
KR100770852B1 true KR100770852B1 (ko) 2007-10-26

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020027016049A Ceased KR100770852B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드
KR1020027015966A Ceased KR100571449B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020027015966A Ceased KR100571449B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드

Country Status (6)

Country Link
EP (2) EP1284841B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100770852B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW528646B (enExample)
WO (2) WO2001091971A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207710A (zh) * 2019-07-10 2021-01-12 Fns科技有限公司 用于抛光晶片的背面的高强度抛光垫

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097658B2 (ja) 1998-05-21 2000-10-10 松下電器産業株式会社 洗濯機
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
KR100666726B1 (ko) * 2002-12-28 2007-01-09 에스케이씨 주식회사 Cmp 공정용 컨디셔너 및 이들을 이용한 연마 방법
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7316605B1 (en) 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
KR101146966B1 (ko) 2007-02-01 2012-05-23 가부시키가이샤 구라레 연마 패드 및 연마 패드의 제조 방법
JP5415700B2 (ja) * 2007-02-01 2014-02-12 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP2008258574A (ja) * 2007-03-14 2008-10-23 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
CN102498549A (zh) * 2009-07-16 2012-06-13 嘉柏微电子材料股份公司 沟槽式化学机械抛光抛光垫
US8222145B2 (en) * 2009-09-24 2012-07-17 Dupont Air Products Nanomaterials, Llc Method and composition for chemical mechanical planarization of a metal-containing substrate
JP5426469B2 (ja) 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
CN104093525A (zh) * 2012-04-10 2014-10-08 旭硝子株式会社 玻璃基板的研磨方法
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
SG11201608219WA (en) * 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
TWI757410B (zh) * 2017-01-20 2022-03-11 美商應用材料股份有限公司 用於cmp應用的薄的塑膠拋光用具
EP3603968B1 (en) 2017-03-28 2023-09-13 AGC Inc. Use of a laminate in inkjet printing, printed matter and method for manufacturing same
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
US20210347006A1 (en) 2018-09-28 2021-11-11 Fujibo Holdings, Inc. Polishing pad and method for producing polished product
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
EP3996870A4 (en) * 2019-07-12 2023-08-02 CMC Materials, Inc. POLISHING PAD WITH POLYAMINE AND CYCLOHEXANDIMETHANOL CURING AGENTS
WO2022071205A1 (ja) 2020-09-30 2022-04-07 富士紡ホールディングス株式会社 研磨パッド、及び研磨加工物の製造方法
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN112480639B (zh) * 2020-12-09 2023-03-24 金旸（厦门）新材料科技有限公司 一种高效超韧导电pc材料及其制备方法
KR102561824B1 (ko) * 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569982A (en) 1984-02-02 1986-02-11 Bayer Aktiengesellschaft Process for the production of polyurea-elastomers and corresponding elastomers having an idealized segment structure
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128573A (ja) * 1984-07-18 1986-02-08 Mitsubishi Mining & Cement Co Ltd 研磨パツド及びその製造方法
US4568611A (en) * 1985-04-03 1986-02-04 Morton Thiokol, Inc. Polyester-polyurethane composition and use thereof
US5271964A (en) * 1991-06-26 1993-12-21 Minnesota Mining And Manufacturing Company Process for manufacturing abrasive tape
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5446085A (en) * 1993-06-15 1995-08-29 International Business Machines Corporation Polymeric compositions containing inorganic fillers and use thereof
JPH07138340A (ja) * 1993-11-15 1995-05-30 Epozoole:Kk 耐熱性の熱可塑性ポリウレタンエラストマー及びその製造法
US5580647A (en) * 1993-12-20 1996-12-03 Minnesota Mining And Manufacturing Company Abrasive articles incorporating addition polymerizable resins and reactive diluents
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3100905B2 (ja) * 1995-08-24 2000-10-23 松下電器産業株式会社 半導体基板の研磨方法及びその装置
JP3552845B2 (ja) * 1996-04-25 2004-08-11 株式会社ルネサステクノロジ 半導体装置の製造方法
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
EP0984846B1 (en) * 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
JPH10217112A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd Ｃｍｐ装置
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6165239A (en) * 1997-07-28 2000-12-26 3M Innovative Properties Company Aqueous sulfopolyurea colloidal dispersions, films and abrasive articles
WO1999007515A1 (en) * 1997-08-06 1999-02-18 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
JP2000061818A (ja) * 1998-08-26 2000-02-29 Nikon Corp 研磨パッド
EP1161322A4 (en) * 1999-01-21 2003-09-24 Rodel Inc IMPROVED POLISHING CUSHIONS AND RELATED METHODS
JP2000263423A (ja) * 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569982A (en) 1984-02-02 1986-02-11 Bayer Aktiengesellschaft Process for the production of polyurea-elastomers and corresponding elastomers having an idealized segment structure
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207710A (zh) * 2019-07-10 2021-01-12 Fns科技有限公司 用于抛光晶片的背面的高强度抛光垫
KR20210007124A (ko) * 2019-07-10 2021-01-20 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드

Also Published As

Publication number Publication date
TW528646B (en) 2003-04-21
JP6655848B2 (ja) 2020-02-26
JP2018117150A (ja) 2018-07-26
JP2014078723A (ja) 2014-05-01
JP5767280B2 (ja) 2015-08-19
EP1284841A1 (en) 2003-02-26
JP5993360B2 (ja) 2016-09-14
WO2001091971A1 (en) 2001-12-06
JP6141359B2 (ja) 2017-06-07
EP1284842A1 (en) 2003-02-26
WO2001091972A1 (en) 2001-12-06
DE60114183D1 (de) 2006-03-02
JP4615813B2 (ja) 2011-01-19
JP2004507077A (ja) 2004-03-04
JP2013239737A (ja) 2013-11-28
TW508284B (en) 2002-11-01
JP2004507076A (ja) 2004-03-04
JP4959901B2 (ja) 2012-06-27
JP2012023387A (ja) 2012-02-02
JP2017063211A (ja) 2017-03-30
DE60109601T2 (de) 2006-02-09
EP1284842B1 (en) 2005-10-19
KR20030005405A (ko) 2003-01-17
JP6375352B2 (ja) 2018-08-15
JP2015092610A (ja) 2015-05-14
JP5544381B2 (ja) 2014-07-09
EP1284841B1 (en) 2005-03-23
JP5584666B2 (ja) 2014-09-03
JP5016576B2 (ja) 2012-09-05
JP2012114454A (ja) 2012-06-14
DE60114183T2 (de) 2006-07-13
JP2018157220A (ja) 2018-10-04
JP2015188108A (ja) 2015-10-29
KR20030004421A (ko) 2003-01-14
DE60109601D1 (de) 2005-04-28
JP2009033193A (ja) 2009-02-12
KR100571449B1 (ko) 2006-04-17

Similar Documents

Publication Publication Date Title
KR100770852B1 (ko) 화학 기계적 평탄화용 그루브형 연마 패드
US6749485B1 (en) Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6736709B1 (en) Grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) Polishing pads for chemical mechanical planarization
US6860802B1 (en) Polishing pads for chemical mechanical planarization
US7186166B2 (en) Fiber embedded polishing pad
US6857941B2 (en) Multi-phase polishing pad
JP7607780B2 (ja) 研磨パッド
James CMP polishing pads
KR20250047156A (ko) 화학적 기계적 폴리싱 패드를 사용하여 폴리싱하는 방법

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20021126

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20060524

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20070330

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20070913

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20071022

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20071022

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20101020

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20110921

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20121009

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20121009

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20131001

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20131001

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20141006

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20141006

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20150918

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20150918

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20160921

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20160921

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20170919

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20170919

Start annual number: 11

End annual number: 11

PJ0204 Invalidation trial for patent

Patent event date: 20171115

Comment text: Request for Trial

Patent event code: PJ02042R01D

Patent event date: 20071022

Comment text: Registration of Establishment

Patent event code: PJ02041E01I

Appeal kind category: Invalidation

Request date: 20171115

Decision date: 20190114

Appeal identifier: 2017100003565

FPAY Annual fee payment

Payment date: 20180918

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20180918

Start annual number: 12

End annual number: 12

J301 Trial decision

Free format text: TRIAL NUMBER: 2017100003565; TRIAL DECISION FOR INVALIDATION REQUESTED 20171115

Effective date: 20190114

PJ1301 Trial decision

Patent event code: PJ13011S05D

Patent event date: 20190114

Comment text: Trial Decision on Invalidation (Patent, Utility Model, Industrial Design)

Appeal kind category: Invalidation

Request date: 20171115

Decision date: 20190114

Appeal identifier: 2017100003565

PJ2001 Appeal

Patent event date: 20190114

Comment text: Trial Decision on Invalidation (Patent, Utility Model, Industrial Design)

Patent event code: PJ20011S05I

Appeal kind category: Invalidation

Decision date: 20200522

Appeal identifier: 2019200002639

Request date: 20190318

PR1001 Payment of annual fee

Payment date: 20190917

Start annual number: 13

End annual number: 13

J202 Request for trial for correction [limitation]
PJ0202 Trial for correction

Comment text: Request for Trial

Patent event date: 20191203

Patent event code: PJ02022R01D

Comment text: Registration of Establishment

Patent event date: 20071022

Patent event code: PJ02021E01I

Appeal kind category: Correction

Decision date: 20191219

Request date: 20191203

Appeal identifier: 2019105000114

J202 Request for trial for correction [limitation]
PJ0202 Trial for correction

Comment text: Request for Trial

Patent event date: 20191205

Patent event code: PJ02022R01D

Comment text: Registration of Establishment

Patent event date: 20071022

Patent event code: PJ02021E01I

Appeal kind category: Correction

Decision date: 20200214

Request date: 20191205

Appeal identifier: 2019105000115

J121 Written withdrawal of request for trial
PJ1201 Withdrawal of trial

Patent event code: PJ12011R01D

Patent event date: 20191219

Comment text: Written Withdrawal of Request for Trial

Appeal identifier: 2019105000114

Request date: 20191203

Appeal kind category: Correction

Decision date: 20191219

J301 Trial decision

Free format text: TRIAL NUMBER: 2019105000115; TRIAL DECISION FOR CORRECTION REQUESTED 20191205

Effective date: 20200214

PJ1301 Trial decision

Patent event code: PJ13011S03D

Patent event date: 20200214

Comment text: Trial Decision on Correction (Patent, Utility Model)

Appeal kind category: Correction

Request date: 20191205

Decision date: 20200214

Appeal identifier: 2019105000115

J2X1 Appeal (before the patent court)

Free format text: TRIAL NUMBER: 2020205002055; CORRECTION

PJ2001 Appeal

Patent event date: 20200214

Comment text: Trial Decision on Correction (Patent, Utility Model)

Patent event code: PJ20011S03I

Patent event date: 20190114

Comment text: Trial Decision on Invalidation (Patent, Utility Model, Industrial Design)

Patent event code: PJ20011S05I

Appeal kind category: Correction

Decision date: 20200522

Appeal identifier: 2020205002055

Request date: 20200217

J302 Written judgement (patent court)

Free format text: TRIAL NUMBER: 2020205002055; JUDGMENT (PATENT COURT) FOR CORRECTION REQUESTED 20200217

Effective date: 20200522

PJ1302 Judgment (patent court)

Patent event date: 20200526

Comment text: Written Judgment (Patent Court)

Patent event code: PJ13021S01D

Request date: 20200217

Decision date: 20200522

Appeal identifier: 2020205002055

Appeal kind category: Correction

PC2102 Extinguishment

Termination category: Others

Termination date: 20200625

J302 Written judgement (patent court)

Free format text: TRIAL NUMBER: 2019200002639; JUDGMENT (PATENT COURT) FOR INVALIDATION REQUESTED 20190318

Effective date: 20200522

PJ1302 Judgment (patent court)

Patent event date: 20200624

Comment text: Written Judgment (Patent Court)

Patent event code: PJ13021S01D

Request date: 20190318

Decision date: 20200522

Appeal identifier: 2019200002639

Appeal kind category: Invalidation

PG1701 Publication of correction

Publication date: 20200702