JP2004526301A5 - - Google Patents
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- Publication number
- JP2004526301A5 JP2004526301A5 JP2002556923A JP2002556923A JP2004526301A5 JP 2004526301 A5 JP2004526301 A5 JP 2004526301A5 JP 2002556923 A JP2002556923 A JP 2002556923A JP 2002556923 A JP2002556923 A JP 2002556923A JP 2004526301 A5 JP2004526301 A5 JP 2004526301A5
- Authority
- JP
- Japan
- Prior art keywords
- polyethyleneimine
- insulating layer
- polishing composition
- barrier layer
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002873 Polyethylenimine Polymers 0.000 claims 8
- 238000005498 polishing Methods 0.000 claims 8
- 239000000203 mixture Substances 0.000 claims 7
- 230000004888 barrier function Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 125000005647 linker group Chemical group 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/759,583 US20020132560A1 (en) | 2001-01-12 | 2001-01-12 | Polishing method for selective chemical mechanical polishing of semiconductor substrates |
| US10/005,253 US6676718B2 (en) | 2001-01-12 | 2001-12-04 | Polishing of semiconductor substrates |
| PCT/US2002/000707 WO2002056351A2 (en) | 2001-01-12 | 2002-01-09 | Polishing of semiconductor substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004526301A JP2004526301A (ja) | 2004-08-26 |
| JP2004526301A5 true JP2004526301A5 (enExample) | 2005-12-22 |
| JP4000059B2 JP4000059B2 (ja) | 2007-10-31 |
Family
ID=26674130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002556923A Expired - Fee Related JP4000059B2 (ja) | 2001-01-12 | 2002-01-09 | 半導体基板の研磨 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6676718B2 (enExample) |
| EP (1) | EP1352418A2 (enExample) |
| JP (1) | JP4000059B2 (enExample) |
| TW (1) | TWI246532B (enExample) |
| WO (1) | WO2002056351A2 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6811680B2 (en) * | 2001-03-14 | 2004-11-02 | Applied Materials Inc. | Planarization of substrates using electrochemical mechanical polishing |
| US7416680B2 (en) * | 2001-10-12 | 2008-08-26 | International Business Machines Corporation | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate |
| US20040082274A1 (en) * | 2002-10-24 | 2004-04-29 | Yaojian Leng | Polishing slurry used for copper chemical mechanical polishing (CMP) process |
| US6916742B2 (en) * | 2003-02-27 | 2005-07-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Modular barrier removal polishing slurry |
| US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
| US7022255B2 (en) * | 2003-10-10 | 2006-04-04 | Dupont Air Products Nanomaterials Llc | Chemical-mechanical planarization composition with nitrogen containing polymer and method for use |
| US20050194562A1 (en) * | 2004-02-23 | 2005-09-08 | Lavoie Raymond L.Jr. | Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers |
| JP4532149B2 (ja) * | 2004-03-30 | 2010-08-25 | ニッタ・ハース株式会社 | シリコンウエハ研磨用組成物およびシリコンウエハの研磨方法 |
| US7504044B2 (en) * | 2004-11-05 | 2009-03-17 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| US7531105B2 (en) * | 2004-11-05 | 2009-05-12 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| US20060135045A1 (en) * | 2004-12-17 | 2006-06-22 | Jinru Bian | Polishing compositions for reducing erosion in semiconductor wafers |
| JP4918223B2 (ja) * | 2005-01-13 | 2012-04-18 | ニッタ・ハース株式会社 | シリコンウエハ研磨用組成物およびシリコンウエハの研磨方法 |
| US7179159B2 (en) * | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
| JP5121128B2 (ja) * | 2005-06-20 | 2013-01-16 | ニッタ・ハース株式会社 | 半導体研磨用組成物 |
| KR100813100B1 (ko) * | 2006-06-29 | 2008-03-17 | 성균관대학교산학협력단 | 실시간 확장 가능한 스테레오 매칭 시스템 및 방법 |
| US20100087065A1 (en) * | 2007-01-31 | 2010-04-08 | Advanced Technology Materials, Inc. | Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications |
| US7696095B2 (en) * | 2007-02-23 | 2010-04-13 | Ferro Corporation | Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide |
| JP5507909B2 (ja) * | 2009-07-14 | 2014-05-28 | 東京エレクトロン株式会社 | 成膜方法 |
| US9203030B2 (en) * | 2011-05-16 | 2015-12-01 | Georgia Tech Research Corporation | Recyclable organic solar cells on substrates comprising cellulose nanocrystals (CNC) |
| JP6001532B2 (ja) * | 2011-05-24 | 2016-10-05 | 株式会社クラレ | 化学機械研磨用エロージョン防止剤、化学機械研磨用スラリーおよび化学機械研磨方法 |
| US20180244955A1 (en) * | 2017-02-28 | 2018-08-30 | Versum Materials Us, Llc | Chemical Mechanical Planarization of Films Comprising Elemental Silicon |
| KR20220083728A (ko) * | 2019-10-15 | 2022-06-20 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 연마 조성물 및 이의 사용 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4867757A (en) | 1988-09-09 | 1989-09-19 | Nalco Chemical Company | Lapping slurry compositions with improved lap rate |
| JP2714411B2 (ja) | 1988-12-12 | 1998-02-16 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | ウェハーのファイン研摩用組成物 |
| JP2987171B2 (ja) * | 1990-06-01 | 1999-12-06 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | ウエハーのファイン研磨用濃縮組成物 |
| WO1996038262A1 (en) | 1995-06-01 | 1996-12-05 | Rodel, Inc. | Compositions for polishing silicon wafers and methods |
| US5614444A (en) | 1995-06-06 | 1997-03-25 | Sematech, Inc. | Method of using additives with silica-based slurries to enhance selectivity in metal CMP |
| US5676587A (en) | 1995-12-06 | 1997-10-14 | International Business Machines Corporation | Selective polish process for titanium, titanium nitride, tantalum and tantalum nitride |
| US5876490A (en) | 1996-12-09 | 1999-03-02 | International Business Machines Corporatin | Polish process and slurry for planarization |
| US5756398A (en) | 1997-03-17 | 1998-05-26 | Rodel, Inc. | Composition and method for polishing a composite comprising titanium |
| KR100581649B1 (ko) | 1998-06-10 | 2006-05-23 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 금속 ｃｍｐ에서 광택화를 위한 조성물 및 방법 |
| WO2000024842A1 (en) | 1998-10-23 | 2000-05-04 | Arch Specialty Chemicals, Inc. | A chemical mechanical polishing slurry system having an activator solution |
| US6083840A (en) | 1998-11-25 | 2000-07-04 | Arch Specialty Chemicals, Inc. | Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys |
| JP4053165B2 (ja) | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| US6503418B2 (en) | 1999-11-04 | 2003-01-07 | Advanced Micro Devices, Inc. | Ta barrier slurry containing an organic additive |
| JP2003516626A (ja) | 1999-12-07 | 2003-05-13 | キャボット マイクロエレクトロニクス コーポレイション | 化学的機械研磨方法 |
| US6524168B2 (en) * | 2000-06-15 | 2003-02-25 | Rodel Holdings, Inc | Composition and method for polishing semiconductors |
| FR2848219B1 (fr) | 2002-12-09 | 2006-12-01 | Centre Nat Rech Scient | Materiau composite utilisable comme revetement lubrifiant |
-
2001
- 2001-12-04 US US10/005,253 patent/US6676718B2/en not_active Expired - Lifetime
-
2002
- 2002-01-09 EP EP02718822A patent/EP1352418A2/en not_active Withdrawn
- 2002-01-09 WO PCT/US2002/000707 patent/WO2002056351A2/en not_active Ceased
- 2002-01-09 JP JP2002556923A patent/JP4000059B2/ja not_active Expired - Fee Related
- 2002-01-11 TW TW091100298A patent/TWI246532B/zh not_active IP Right Cessation