JP2004507076A5 - - Google Patents

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Publication number
JP2004507076A5
JP2004507076A5 JP2001587968A JP2001587968A JP2004507076A5 JP 2004507076 A5 JP2004507076 A5 JP 2004507076A5 JP 2001587968 A JP2001587968 A JP 2001587968A JP 2001587968 A JP2001587968 A JP 2001587968A JP 2004507076 A5 JP2004507076 A5 JP 2004507076A5
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JP
Japan
Prior art keywords
polishing
wafer
polishing pad
kel
layer
Prior art date
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Application number
JP2001587968A
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English (en)
Japanese (ja)
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JP4615813B2 (ja
JP2004507076A (ja
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Priority claimed from PCT/US2001/016869 external-priority patent/WO2001091971A1/en
Publication of JP2004507076A publication Critical patent/JP2004507076A/ja
Publication of JP2004507076A5 publication Critical patent/JP2004507076A5/ja
Application granted granted Critical
Publication of JP4615813B2 publication Critical patent/JP4615813B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001587968A 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド Expired - Lifetime JP4615813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28
PCT/US2001/016869 WO2001091971A1 (en) 2000-05-27 2001-05-24 Polishing pads for chemical mechanical planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008245811A Division JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド

Publications (3)

Publication Number Publication Date
JP2004507076A JP2004507076A (ja) 2004-03-04
JP2004507076A5 true JP2004507076A5 (enExample) 2006-01-05
JP4615813B2 JP4615813B2 (ja) 2011-01-19

Family

ID=26902748

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド

Family Applications After (10)

Application Number Title Priority Date Filing Date
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Country Status (6)

Country Link
EP (2) EP1284842B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100571449B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW508284B (enExample)
WO (2) WO2001091972A1 (enExample)

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US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
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TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
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JPWO2013153880A1 (ja) * 2012-04-10 2015-12-17 旭硝子株式会社 ガラス基板の研磨方法
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US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
KR102347711B1 (ko) * 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
KR102329099B1 (ko) * 2017-01-20 2021-11-19 어플라이드 머티어리얼스, 인코포레이티드 Cmp 응용들을 위한 얇은 플라스틱 연마 물품
JP6981467B2 (ja) 2017-03-28 2021-12-15 Ａｇｃ株式会社 積層体、印刷物およびその製造方法
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
CN112512747B (zh) 2018-09-28 2024-04-05 富士纺控股株式会社 研磨垫及研磨加工物的制造方法
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
KR102811921B1 (ko) 2020-09-30 2025-05-22 후지보 홀딩스 가부시키가이샤 연마 패드 및 연마 가공물의 제조 방법
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN112480639B (zh) * 2020-12-09 2023-03-24 金旸（厦门）新材料科技有限公司 一种高效超韧导电pc材料及其制备方法
KR102561824B1 (ko) * 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

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