JP2004506337A5 - - Google Patents

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Publication number
JP2004506337A5
JP2004506337A5 JP2002519139A JP2002519139A JP2004506337A5 JP 2004506337 A5 JP2004506337 A5 JP 2004506337A5 JP 2002519139 A JP2002519139 A JP 2002519139A JP 2002519139 A JP2002519139 A JP 2002519139A JP 2004506337 A5 JP2004506337 A5 JP 2004506337A5
Authority
JP
Japan
Prior art keywords
weight
wafer
rotating
polishing
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002519139A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004506337A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/025038 external-priority patent/WO2002014014A2/en
Publication of JP2004506337A publication Critical patent/JP2004506337A/ja
Publication of JP2004506337A5 publication Critical patent/JP2004506337A5/ja
Pending legal-status Critical Current

Links

JP2002519139A 2000-08-11 2001-08-09 金属基板の化学機械平坦化 Pending JP2004506337A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22433900P 2000-08-11 2000-08-11
US22746600P 2000-08-24 2000-08-24
PCT/US2001/025038 WO2002014014A2 (en) 2000-08-11 2001-08-09 Chemical mechanical planarization of metal substrates

Publications (2)

Publication Number Publication Date
JP2004506337A JP2004506337A (ja) 2004-02-26
JP2004506337A5 true JP2004506337A5 (enExample) 2005-03-17

Family

ID=26918631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002519139A Pending JP2004506337A (ja) 2000-08-11 2001-08-09 金属基板の化学機械平坦化

Country Status (6)

Country Link
US (1) US6602436B2 (enExample)
EP (1) EP1307319A2 (enExample)
JP (1) JP2004506337A (enExample)
KR (1) KR20030020977A (enExample)
TW (1) TW516119B (enExample)
WO (1) WO2002014014A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US6790768B2 (en) 2001-07-11 2004-09-14 Applied Materials Inc. Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
TW561541B (en) * 2001-10-09 2003-11-11 Hitachi Chemical Co Ltd Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP
JP3934388B2 (ja) * 2001-10-18 2007-06-20 株式会社ルネサステクノロジ 半導体装置の製造方法及び製造装置
CN1311009C (zh) * 2001-11-15 2007-04-18 三星电子株式会社 添加剂组合物、含有该添加剂组合物的淤浆组合物及使用该淤浆组合物抛光物体的方法
US6806193B2 (en) * 2003-01-15 2004-10-19 Texas Instruments Incorporated CMP in-situ conditioning with pad and retaining ring clean
US6843708B2 (en) * 2003-03-20 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of reducing defectivity during chemical mechanical planarization
US6843709B1 (en) 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for reducing slurry reflux
US20050164603A1 (en) * 2004-01-22 2005-07-28 House Colby J. Pivotable slurry arm
US7485028B2 (en) 2004-03-19 2009-02-03 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
KR100645957B1 (ko) * 2004-10-26 2006-11-14 삼성코닝 주식회사 Ｃｍｐ용 수성 슬러리 조성물
EP1994112B1 (en) * 2006-01-25 2018-09-19 LG Chem, Ltd. Cmp slurry and method for polishing semiconductor wafer using the same
JP2009033038A (ja) * 2007-07-30 2009-02-12 Elpida Memory Inc Ｃｍｐ装置及びｃｍｐによるウェハー研磨方法
US20100130013A1 (en) * 2008-11-24 2010-05-27 Applied Materials, Inc. Slurry composition for gst phase change memory materials polishing
JP5407748B2 (ja) * 2009-10-26 2014-02-05 株式会社Ｓｕｍｃｏ 半導体ウェーハの研磨方法
TWI664280B (zh) * 2016-10-11 2019-07-01 Fujifilm Electronic Materials U.S.A., Inc. 高溫cmp組成物及用於使用其之方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752628A (en) * 1987-05-15 1988-06-21 Nalco Chemical Company Concentrated lapping slurries
JP2714411B2 (ja) * 1988-12-12 1998-02-16 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー ウェハーのファイン研摩用組成物
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6022264A (en) 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
US5607718A (en) 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5391258A (en) 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5340370A (en) 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
WO1996025270A1 (en) 1995-02-15 1996-08-22 Advanced Micro Devices, Inc. Abrasive-free selective chemo-mechanical polish for tungsten
JP3076244B2 (ja) * 1996-06-04 2000-08-14 日本電気株式会社 多層配線の研磨方法
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US5652177A (en) 1996-08-22 1997-07-29 Chartered Semiconductor Manufacturing Pte Ltd Method for fabricating a planar field oxide region
US5972792A (en) 1996-10-18 1999-10-26 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
TW375556B (en) 1997-07-02 1999-12-01 Matsushita Electric Industrial Co Ltd Method of polishing the wafer and finishing the polishing pad
JP3371775B2 (ja) * 1997-10-31 2003-01-27 株式会社日立製作所 研磨方法
KR100581649B1 (ko) 1998-06-10 2006-05-23 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 금속 ｃｍｐ에서 광택화를 위한 조성물 및 방법
WO2000037217A1 (en) 1998-12-21 2000-06-29 Lam Research Corporation Method for cleaning an abrasive surface

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