JP2004506065A5 - - Google Patents
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- Publication number
- JP2004506065A5 JP2004506065A5 JP2002517702A JP2002517702A JP2004506065A5 JP 2004506065 A5 JP2004506065 A5 JP 2004506065A5 JP 2002517702 A JP2002517702 A JP 2002517702A JP 2002517702 A JP2002517702 A JP 2002517702A JP 2004506065 A5 JP2004506065 A5 JP 2004506065A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- adhesive
- magnetic
- electromagnetic
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 33
- 239000000853 adhesive Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 29
- 239000000203 mixture Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 11
- 230000005291 magnetic effect Effects 0.000 description 10
- 239000002105 nanoparticle Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 230000005670 electromagnetic radiation Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 239000006249 magnetic particle Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 239000004823 Reactive adhesive Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000005298 paramagnetic effect Effects 0.000 description 3
- QFJAZXGJBIMYLJ-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;ethane-1,2-diamine Chemical compound NCCN.OC(=O)C(O)C(O)C(O)=O QFJAZXGJBIMYLJ-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 2
- 229940087748 lithium sulfate Drugs 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 239000001472 potassium tartrate Substances 0.000 description 2
- 229940111695 potassium tartrate Drugs 0.000 description 2
- 235000011005 potassium tartrates Nutrition 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 2
- 239000001476 sodium potassium tartrate Substances 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 239000001433 sodium tartrate Substances 0.000 description 2
- 229960002167 sodium tartrate Drugs 0.000 description 2
- 235000011004 sodium tartrates Nutrition 0.000 description 2
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 2
- 239000011032 tourmaline Substances 0.000 description 2
- 229940070527 tourmaline Drugs 0.000 description 2
- 229910052613 tourmaline Inorganic materials 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 229920001944 Plastisol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- KQTVWCSONPJJPE-UHFFFAOYSA-N etridiazole Chemical compound CCOC1=NC(C(Cl)(Cl)Cl)=NS1 KQTVWCSONPJJPE-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000011415 microwave curing Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002907 paramagnetic material Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004999 plastisol Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000003707 silyl modified polymer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10037884.6 | 2000-08-03 | ||
| DE10037884A DE10037884A1 (de) | 2000-08-03 | 2000-08-03 | Verfahren zur beschleunigten Klebstoffaushärtung |
| PCT/EP2001/008600 WO2002012409A1 (de) | 2000-08-03 | 2001-07-25 | Verfahren zur beschleunigten klebstoffaushärtung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004506065A JP2004506065A (ja) | 2004-02-26 |
| JP2004506065A5 true JP2004506065A5 (enExample) | 2008-09-11 |
| JP5224630B2 JP5224630B2 (ja) | 2013-07-03 |
Family
ID=7651218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002517702A Expired - Fee Related JP5224630B2 (ja) | 2000-08-03 | 2001-07-25 | 接着剤の硬化促進方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7147742B2 (enExample) |
| EP (1) | EP1305376B1 (enExample) |
| JP (1) | JP5224630B2 (enExample) |
| AR (1) | AR030114A1 (enExample) |
| AT (1) | ATE277138T1 (enExample) |
| AU (1) | AU2001279785A1 (enExample) |
| DE (2) | DE10037884A1 (enExample) |
| ES (1) | ES2227248T3 (enExample) |
| WO (1) | WO2002012409A1 (enExample) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19924138A1 (de) | 1999-05-26 | 2000-11-30 | Henkel Kgaa | Lösbare Klebeverbindungen |
| DE19951599A1 (de) * | 1999-10-27 | 2001-05-23 | Henkel Kgaa | Verfahren zur adhesiven Trennung von Klebeverbunden |
| DE10037883A1 (de) * | 2000-08-03 | 2002-02-14 | Henkel Kgaa | Ferromagnetische Resonanzanregung und ihre Verwendung zur Erwärmung teilchengefüllter Substrate |
| DE10037884A1 (de) | 2000-08-03 | 2002-02-21 | Henkel Kgaa | Verfahren zur beschleunigten Klebstoffaushärtung |
| US7473715B2 (en) | 2001-05-02 | 2009-01-06 | Zephyros, Inc. | Two component (epoxy/amine) structural foam-in-place material |
| CA2467091C (en) * | 2001-11-13 | 2009-10-20 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Electromagnetic field curable adhesive compositions and assemblies which are able to be dissociated |
| DE10201190A1 (de) * | 2002-01-14 | 2003-07-31 | Henkel Kgaa | Thermische Aktivierung von Folien |
| DE10255893B4 (de) * | 2002-11-28 | 2006-06-29 | Institut für Physikalische Hochtechnologie e.V. | Verfahren und Vorrichtung zur Erwärmung eines eine Vielzahl magnetischer Teilchen enthaltenden Materials |
| AU2003900335A0 (en) * | 2003-01-22 | 2003-02-13 | Sirtex Medical Limited | Microparticles for selectively targeted hyperthermia |
| JP2004265728A (ja) * | 2003-02-28 | 2004-09-24 | Jst Mfg Co Ltd | 誘電体シート |
| DE10310722A1 (de) * | 2003-03-10 | 2004-09-23 | Tesa Ag | Elektrisch erwärmbare Haftklebemasse |
| US7125461B2 (en) | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7199165B2 (en) | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| DE102005017912A1 (de) * | 2005-04-18 | 2006-10-19 | Henkel Kgaa | Bei niedrigen Temperaturen mit Mikrowellen härtbare PU-Klebstoffe |
| US20060275564A1 (en) * | 2005-06-01 | 2006-12-07 | Michael Grah | Method of activating the shrink characteristic of a film |
| DE102006007563A1 (de) * | 2006-02-16 | 2007-08-30 | Röhm Gmbh | Verfahren zum Verkleben von Werkstoffen mit nanoskaligen superparamagnetischen Poly(meth)acrylatpolymeren |
| DE102006007564A1 (de) * | 2006-02-16 | 2007-08-30 | Röhm Gmbh | Nanoskalige superparamagnetische Poly(meth)acrylatpolymere |
| DE102006056660A1 (de) * | 2006-11-29 | 2008-06-05 | Henkel Kgaa | Formteile aus Schmelzklebstoffen |
| DE102007009124B4 (de) * | 2007-02-24 | 2011-11-03 | Evonik Degussa Gmbh | Induktionsgestützte Fertigungsverfahren |
| KR100882735B1 (ko) * | 2007-03-19 | 2009-02-06 | 도레이새한 주식회사 | 이방성 전도필름 및 이의 접착방법 |
| DE102007015261A1 (de) * | 2007-03-27 | 2008-10-02 | Aacure Aadhesives Gmbh | Reaktivmasse und Verfahren zur Aufbringung hierfür |
| DE102007028581A1 (de) * | 2007-06-19 | 2008-12-24 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung und Verfahren zum Fügen von Bauteilen mittels Klebens |
| US7984738B2 (en) * | 2007-06-26 | 2011-07-26 | Emabond Solutions Llc | Temperature controlled polymer composition for inductive control heating using electrical conductive and magnetic particles |
| KR20100099136A (ko) * | 2007-10-26 | 2010-09-10 | 다우 코닝 도레이 캄파니 리미티드 | 실리콘 고무 부재의 접착 방법 |
| WO2009119885A1 (ja) * | 2008-03-27 | 2009-10-01 | リンテック株式会社 | 接着剤組成物、接着シート及び接着成形品 |
| WO2009119883A1 (ja) * | 2008-03-27 | 2009-10-01 | リンテック株式会社 | 再剥離性接着シート |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| DE102009022584B4 (de) * | 2008-05-21 | 2014-02-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum stoffschlüssigen Verbinden von Teilen mit einem Klebstoff |
| US20110104470A1 (en) * | 2008-06-24 | 2011-05-05 | Anderson Wayne H | Method of forming a curable adhesive tape and an insulating layer on a conductive substrate |
| DE102009001356A1 (de) | 2008-10-31 | 2010-05-12 | Gkss-Forschungszentrum Geesthacht Gmbh | Artikel mit mindestens einem thermo-programmierbaren Schaltabschnitt für Anwendungen in Kontakt mit Materialien mit hohen Wärmeübergangszahlen |
| DE102009049027A1 (de) * | 2009-05-29 | 2011-04-21 | Glabete Ag | Befestigungsmittel und Verfahren zur Fixierung eines Gegenstands auf einer Unterlage |
| BRPI0924559A2 (pt) * | 2009-06-11 | 2019-09-24 | Saab Ab | estrutura de aeronave, aeronave e método de fabricação da dita estrutura de aeronave |
| DE102009028942A1 (de) * | 2009-08-27 | 2011-03-03 | Evonik Degussa Gmbh | Induktiv aushärtbare Klebstoffzusammensetzung |
| JP5606029B2 (ja) * | 2009-09-14 | 2014-10-15 | リンテック株式会社 | スライドレール用接着剤組成物、接着シート及びスライドレール固定方法 |
| GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
| DE102009046256A1 (de) * | 2009-10-30 | 2011-05-12 | Tesa Se | Verfahren zum Verkleben von hitzeaktiviert verklebbaren Flächenelementen |
| DE102009046263A1 (de) * | 2009-10-30 | 2011-05-12 | Tesa Se | Verfahren zum Verkleben von hitzeaktiviert verklebbaren dünnen Flächenelementen |
| KR20130020772A (ko) | 2010-03-04 | 2013-02-28 | 제피로스, 인크. | 구조적 복합 라미네이트 |
| AU2011269654A1 (en) * | 2010-06-23 | 2013-01-31 | Oem Nutech Pty Ltd | A coated laminate material and a method of fabricating therefor |
| TWI493009B (zh) * | 2011-09-27 | 2015-07-21 | Hon Hai Prec Ind Co Ltd | 紫外光固化膠及其點膠方法 |
| CN103031082B (zh) * | 2011-09-30 | 2016-08-10 | 鸿富锦精密工业（深圳）有限公司 | 紫外光固化胶及其点胶方法 |
| DE102011057003A1 (de) * | 2011-12-23 | 2013-06-27 | Rehau Ag + Co. | Verfahren zum Fügen von Kraftfahrzeug-Bauteilen |
| US9561621B2 (en) * | 2012-05-21 | 2017-02-07 | GM Global Technology Operations LLC | Method and apparatus to mitigate the bond-line read-out defect in adhesive-bonded composite panels |
| DE102012209513A1 (de) * | 2012-06-06 | 2013-12-12 | Osram Opto Semiconductors Gmbh | Verbinder, Verfahren zum Verbinden zweier Körper und elektronische Anordnung |
| BR112015006917A2 (pt) * | 2012-09-28 | 2019-12-10 | Dow Global Technologies Llc | composição, conector e processo para melhorar a ligação entre dois ou mais meios para transportar fluidos |
| DE102013100925A1 (de) * | 2013-01-30 | 2014-07-31 | Borgwarner Beru Systems Gmbh | Spule und Koronazündeinrichtung mit einer solchen Spule |
| DE102013003612A1 (de) * | 2013-03-01 | 2014-09-04 | Gerhard Fauner | Verfahren zum Härten und/oder Bauteil schonenden Lösen von Klebverbindungen im elektromagnetischen Feld |
| CN105102139B (zh) | 2013-03-15 | 2018-08-21 | 马勒国际有限公司 | 活塞装置用耐磨的抗磨涂层 |
| US20140363637A1 (en) | 2013-06-06 | 2014-12-11 | The Boeing Company | Heating Layer for Film Removal |
| US10577523B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Relating to thermosetting adhesive films |
| EP2975096B1 (en) | 2014-07-17 | 2021-11-17 | 3M Innovative Properties Company | Pressure sensitive adhesive assembly suitable for bonding to uneven substrates |
| EP2975097B1 (en) | 2014-07-17 | 2022-03-09 | 3M Innovative Properties Company | Pressure sensitive adhesive assembly comprising thermoplastic filler material |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| RU2708214C2 (ru) | 2015-02-02 | 2019-12-04 | Колопласт А/С | Устройство для стомы |
| CA2975075C (en) | 2015-02-09 | 2019-09-24 | Mitsubishi Heavy Industries, Ltd. | Adhesive and structure, and adhesion method |
| DE102015202415B4 (de) * | 2015-02-11 | 2021-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Klebstoff, Bauteil, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs, Verfahren zur verbesserten Verbindung zweier Bauteile mit dem Klebstoff und Verwendung des Klebstoffs |
| KR102261689B1 (ko) * | 2015-03-24 | 2021-06-07 | 주식회사 엘지화학 | 접착제 조성물, 이를 포함하는 접착 필름, 이를 포함하는 유기전자장치 및 상기 유기전자장치의 제조 방법 |
| US11160681B2 (en) | 2015-04-10 | 2021-11-02 | Coloplast A/S | Ostomy device |
| EP4049840B1 (en) | 2015-07-06 | 2026-01-28 | Zephyros Inc. | Heat bonding of low energy surface substrates |
| EP3159386B1 (en) | 2015-10-23 | 2021-08-25 | 3M Innovative Properties Company | Thermally post-curable pressure sensitive adhesive |
| EP3170876A1 (en) * | 2015-11-17 | 2017-05-24 | 3M Innovative Properties Company | Post-curable precursor of an acrylic-based pressure-sensitive adhesive |
| WO2017134282A1 (en) * | 2016-02-05 | 2017-08-10 | Technische Universität München | Joining of components by means of energetically activated reactive particles |
| DE102017107677B4 (de) | 2016-04-12 | 2026-02-26 | Pictiva Displays International Limited | Verfahren zum Herstellen eines organischen, lichtemittierenden Bauelementes und organisches, lichtemittierendes Bauelement |
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- 2001-07-25 AT AT01958019T patent/ATE277138T1/de active
- 2001-07-25 AU AU2001279785A patent/AU2001279785A1/en not_active Abandoned
- 2001-07-25 US US10/343,297 patent/US7147742B2/en not_active Expired - Fee Related
- 2001-07-25 DE DE50103784T patent/DE50103784D1/de not_active Expired - Lifetime
- 2001-07-25 ES ES01958019T patent/ES2227248T3/es not_active Expired - Lifetime
- 2001-07-25 JP JP2002517702A patent/JP5224630B2/ja not_active Expired - Fee Related
- 2001-08-03 AR ARP010103709A patent/AR030114A1/es not_active Application Discontinuation
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