WO2005017923A1 - 絶縁被覆導電粒子 - Google Patents
絶縁被覆導電粒子 Download PDFInfo
- Publication number
- WO2005017923A1 WO2005017923A1 PCT/JP2004/008024 JP2004008024W WO2005017923A1 WO 2005017923 A1 WO2005017923 A1 WO 2005017923A1 JP 2004008024 W JP2004008024 W JP 2004008024W WO 2005017923 A1 WO2005017923 A1 WO 2005017923A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulating
- insulating resin
- conductive particles
- coated
- resin layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Definitions
- the present invention relates to insulating coated conductive particles used for an anisotropic conductive adhesive.
- the conductive particles used in the anisotropic conductive adhesive include metal particles such as nickel, and conductive particles such as metal particles provided with a metal layer on the surface of resin particles. Insulated conductive particles coated with a thermoplastic insulating resin to prevent short circuit between them are widely used.
- Patent Document 1 JP-A-5-217617
- Patent Document 2 JP-A-5-70750
- the insulating coated conductive particles may be coated in some cases. If the insulating resin layer swells, dissolves, or deforms with the solvent used during manufacturing, there is a problem. In such a case, the conduction reliability of the anisotropic conductive adhesive was also adversely affected.
- the insulating resin layer may be made of a thermosetting insulating resin composition.
- the connection insulating resin layer cannot be sufficiently removed from between the opposed electrodes to be connected, and as a result, sufficient conduction reliability cannot be obtained.
- An object of the present invention is to make it possible to simultaneously impart excellent solvent resistance and conduction reliability to insulating coated conductive particles suitable for conductive particles of an anisotropic conductive adhesive.
- the present inventor has provided an insulating resin layer made of an insulating resin having a carboxyl group on the surface of a conductive particle, and formed the insulating resin layer with a polyfunctional aziridine compound having two or more aziridine groups.
- the surface treatment causes the carboxy group of the insulating resin layer to react with the aziridine group of the aziridine compound.
- the present inventors have found that the reliability can be improved, and completed the present invention.
- the present invention is an insulating-coated conductive particle in which the surface of the conductive particle is coated with an insulating resin layer made of an insulating resin having a carboxyl group, wherein the insulating resin layer is polyfunctional.
- insulating-coated conductive particles which are surface-treated with an aziridine compound.
- the present invention is characterized in that the insulating resin layer of the conductive particles covered with the insulating resin layer made of an insulating resin having a carboxyl group is subjected to a surface treatment with a polyfunctional aziridinic compound.
- the present invention provides an anisotropic conductive adhesive characterized in that the above-mentioned insulating coated conductive particles are dispersed in an insulating adhesive.
- the insulative coated conductive particles of the present invention are insulatively coated conductive particles in which the surface of the conductive particles is coated with an insulating resin layer.
- an insulating resin having a carboxyl group is used as the insulating resin constituting the insulating resin layer covering the conductive particles.
- an insulating resin having a carboxy group include a monomer having a carboxy group, preferably an insulating resin having one unit of acrylic acid monomer / monomer unit of methacrylic acid, such as an acrylic acid styrene copolymer ( PP—2000S, Dainippon Ink and Chemicals, Inc .; acid value 5 mgK ⁇ H / g or less, carboxylic acid-modified styrene′dibutylbenzene copolymer (SX8742A, manufactured by JSR Corporation), acid value about 3.5 mgKOH / g ) And the like.
- OmgKOH / g more preferably 0.5-5 mgK ⁇ H / g.
- the insulating-coated conductive particles of the present invention cover the surface of the conductive particles with an insulating resin layer made of an insulating resin having a carboxyl group.
- the insulating resin layer of the insulating coated conductive particles must be removed from between the connected parts during the thermocompression bonding process. Therefore, the insulating resin layer itself needs to be thermoplastic under heat treatment conditions.
- thermoplastic resin is swelled and rinsed by an organic solvent in some cases causes a problem in solvent resistance.
- carboxyl group easily reacts with the epoxy group of an epoxy resin widely used as an adhesive component of the anisotropic conductive adhesive, there is a possibility that the storage stability of the anisotropic conductive adhesive is reduced.
- the surface of the insulating resin layer of the insulating coated conductive particles is treated with a polyfunctional aziridine conjugate having two or more aziridine groups.
- the carboxyl group of the insulating resin is reacted with the aziridine group of the polyfunctional aziridine compound.
- the reaction can be usually carried out by spraying a solution of a polyfunctional aziridine compound (for example, an ethanol solution) on the surface of the insulating resin layer and drying by heating at 80 to 140 ° C.
- conductive particles coated with an insulating resin are added to a solution of a polyfunctional aziridine compound (for example, an ethanol solution), dispersed by stirring, and heated and stirred at 30-80 ° C in this state to react. it can.
- a polyfunctional aziridine compound for example, an ethanol solution
- the solvent resistance of the insulating coated conductive particles can be improved without impairing the thermoplasticity of the insulating resin layer, and the force is free.
- the carboxyl group can be eliminated, the storage stability of the anisotropic conductive adhesive can be improved even if an epoxy resin is used as the adhesive component.
- the preferred number of aziridine groups in the polyfunctional aziridine compound is at least two in terms of crosslinkability.
- Specific examples of such a polyfunctional aziridine compound include, for example, trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylolmethane-tri- ⁇
- Aziridinylpropionate, ⁇ , ⁇ —hexamethylene—1,6-bis—1-aziridinecar Boxyamide can be mentioned. Among them, trimethylolpropane-tri- ⁇ -aziridinylpropionate is preferred from the viewpoint of reactivity.
- the amount of the polyfunctional aziridine compound used can be appropriately determined according to the number of aziridine groups in the aziridine compound, the carboxyl group equivalent of the insulating resin, the required degree of solvent resistance, and the like.
- the conductive particles used in the insulating coated conductive particles of the present invention those having the same configuration as that used in the conventional anisotropic conductive adhesive can be used.
- solder particles, nickel particles, resin particles coated with metal (nickel, gold, etc.), and particles obtained by insulatingly coating these particles can be used.
- nickel gold plated resin particles having good conduction reliability can be preferably used.
- the average particle size of the conductive particles used in the present invention is preferably 210 ⁇ m, because if it is too small, conduction reliability decreases, and if it is too large, insulation reliability decreases.
- the insulating-coated conductive particles of the present invention are obtained by disposing a polyfunctional aziridine compound on the surface of an insulating resin layer of conductive particles coated with an insulating resin layer comprising an insulating resin having a carboxyl group; By heating, it can be produced by reacting the carboxyl group of the insulating resin with the aziridine group of the aziridine compound. More specifically, the surface of the conductive particles is coated with an insulating resin by a conventional method, and a solution of a polyfunctional aziridine compound (for example, an ethanol solution) is sprayed on the surface, and dried and heated at 80 to 140 ° C. Can be made to react. The reaction can be carried out by adding conductive particles coated with an insulating resin to a solution of a polyfunctional aziridine compound and heating the mixture at 30 to 80 ° C with stirring. In this case, the treated particles may be filtered off after the reaction.
- a polyfunctional aziridine compound for example, an ethanol solution
- the insulating coated conductive particles of the present invention can be preferably used as conductive particles of an anisotropic conductive adhesive.
- Such an anisotropic conductive adhesive is produced by uniformly mixing an insulating coated conductive particle with an insulating adhesive, which is an adhesive component, together with an organic solvent or an inorganic filler, if necessary, by a conventional method. be able to.
- This anisotropic conductive adhesive can be made into a paste or a film by an ordinary method.
- insulating adhesive used in the anisotropic conductive adhesive a known insulating adhesive can be used.
- a polymerizable component such as a liquid epoxy resin and an imidazole-based hardening agent can be used.
- a thermosetting liquid insulating adhesive composed of a curing agent component such as a modified amine curing agent, an atalylate resin having a polymerizable double bond and a liquid insulating adhesive composed of a curing catalyst, acrylic, SBR, Liquid rubber adhesives made of thermoplastic resins such as SIS and polyurethane, rubber resins and the like can be used.
- the insulating resin of the insulating coated conductive particles uses a carboxyl group as the insulating resin and the epoxy resin is used as the insulating adhesive, the vicinity of the surface of the insulating resin is cross-linked with the polyfunctional aziridine compound. Storage stability is good.
- the anisotropic conductive adhesive may contain various additives, for example, a thickener, a surfactant and the like, if necessary.
- the anisotropic conductive adhesive containing the insulating coated conductive particles of the present invention can be preferably used when various electronic components are joined to a wiring board.
- a solution prepared by dissolving 5 parts by weight of trimethylolpropane-tri- ⁇ -aziridinylpropionate (95) in 95 parts by weight of ethanol was sprayed evenly on the insulating-coated conductive particles obtained in Comparative Example 1, A crosslinking reaction was carried out by heating and drying at 100 ° C. to obtain insulating coated conductive particles of Example 1.
- Example 2 except that tetramethylolmethane -tri- ⁇ -aziridinylpropionate ( ⁇ ) was used instead of trimethylolpropane-tri- ⁇ - aziridinylpropionate ( ⁇ ).
- insulating coated conductive particles of Example 3 were obtained.
- Example 4 Examples except that trimethylolpropane-tri- ⁇ -aziridinylpropionate ( ⁇ ) was replaced by ⁇ , ⁇ -hexamethylene-1,6-bis-1-aziridinecarboxamide (HDU) In the same manner as in 2, the insulating-coated conductive particles of Example 4 were obtained.
- ⁇ trimethylolpropane-tri- ⁇ -aziridinylpropionate
- HDU ⁇ -hexamethylene-1,6-bis-1-aziridinecarboxamide
- the settled insulating coated conductive particles are dried, the obtained dried insulating coated conductive particles are filled between a pair of copper electrodes ( ⁇ 6 mm ⁇ 125 ⁇ m), and a voltage is applied between the electrodes. The leaked voltage (withstand voltage) was measured. Table 1 shows the obtained results.
- a phenoxy resin (YP50, Toto Kasei Co., Ltd.), 30 parts by weight of an epoxy resin (YL980, Japan Epoxy Resin; epoxy equivalent: 185 g / eq), an epoxy-dispersed imidazole-based curing agent (HX3941HP, Asahi Kasei Corporation)
- conductive particles conductive particles of Example 14 or Comparative Example 1
- an adhesive composition consisting of 40 parts by weight of toluene and 40 parts by weight of ethyl acetate has been subjected to peeling treatment.
- the insulating coated conductive particles of Examples 14 to 14 were more resistant to any solvent than the insulating coated conductive particles of Comparative Example 1 which was not surface-treated with an aziridine compound. Excellent in solvent properties and withstand voltage. Therefore, conduction reliability is also improved. In addition, good storage stability can be expected with a very low incidence of short circuits.
- the insulating coated conductive particles of the present invention are excellent in solvent resistance and voltage resistance, have improved conduction reliability, and are expected to have good storage stability with a very low occurrence rate of short circuits. Since it can be expected, it is useful as conductive particles of an anisotropic conductive adhesive.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800236540A CN1836295B (zh) | 2003-08-19 | 2004-06-09 | 绝缘被覆导电粒子、其制备方法及各向异性导电粘合剂 |
US10/565,477 US7846547B2 (en) | 2003-08-19 | 2004-06-09 | Insulation-coated conductive particle |
EP04745699.1A EP1657725B1 (en) | 2003-08-19 | 2004-06-09 | Insulation-coated electroconductive particles |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-295666 | 2003-08-19 | ||
JP2003295666A JP4539813B2 (ja) | 2003-08-19 | 2003-08-19 | 絶縁被覆導電粒子 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005017923A1 true WO2005017923A1 (ja) | 2005-02-24 |
Family
ID=34191120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/008024 WO2005017923A1 (ja) | 2003-08-19 | 2004-06-09 | 絶縁被覆導電粒子 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7846547B2 (ja) |
EP (1) | EP1657725B1 (ja) |
JP (1) | JP4539813B2 (ja) |
KR (1) | KR100845875B1 (ja) |
CN (1) | CN1836295B (ja) |
TW (1) | TWI248090B (ja) |
WO (1) | WO2005017923A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010086665A (ja) * | 2008-09-29 | 2010-04-15 | Sekisui Chem Co Ltd | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5099284B2 (ja) * | 2005-02-24 | 2012-12-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性接続シート材料 |
KR100722493B1 (ko) * | 2005-09-02 | 2007-05-28 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름 |
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
JP5402804B2 (ja) * | 2010-04-12 | 2014-01-29 | デクセリアルズ株式会社 | 発光装置の製造方法 |
US20130146816A1 (en) * | 2010-04-19 | 2013-06-13 | Trillion Science Inc. | One part epoxy resin including acrylic block copolymer |
JP5365816B2 (ja) * | 2011-07-27 | 2013-12-11 | デクセリアルズ株式会社 | 絶縁被覆導電粒子 |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
CN105295760A (zh) * | 2015-10-23 | 2016-02-03 | 浙江欧仁新材料有限公司 | 一种各向异性导电双面胶 |
JP7430610B2 (ja) | 2020-08-31 | 2024-02-13 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189103A (ja) * | 1983-04-11 | 1984-10-26 | Nippon Shokubai Kagaku Kogyo Co Ltd | 吸水剤 |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
JPH0930112A (ja) * | 1995-07-20 | 1997-02-04 | Mitsubishi Paper Mills Ltd | インクジェット被記録材 |
JPH11241054A (ja) * | 1997-10-28 | 1999-09-07 | Sony Chem Corp | 異方導電性接着剤および接着用膜 |
DE10016041A1 (de) * | 2000-03-31 | 2001-10-04 | Stockhausen Chem Fab Gmbh | Pulverförmige an der Oberfläche vernetzte Polymerisate |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3985920A (en) * | 1972-08-18 | 1976-10-12 | Sybron Corporation | Adhesive coating of vinyl polymers and copolymers and method of making same |
JPH0559338A (ja) * | 1991-08-30 | 1993-03-09 | Sekisui Chem Co Ltd | 粘着剤組成物、粘着加工品および粘着加工品の製造方法 |
JPH0570750A (ja) | 1991-09-10 | 1993-03-23 | Fujitsu Ltd | 導電性接着剤 |
JP2836337B2 (ja) | 1992-02-04 | 1998-12-14 | 日立化成工業株式会社 | 異方導電性樹脂フィルム状接着剤 |
US5466567A (en) * | 1994-10-28 | 1995-11-14 | Eastman Kodak Company | Imaging element comprising an electrically-conductive layer containing conductive fine particles, a film-forming hydrophilic colloid and pre-crosslinked gelatin particles |
JPH08302321A (ja) * | 1995-04-28 | 1996-11-19 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物 |
US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
EP0996321B1 (en) | 1998-10-22 | 2007-05-16 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
JP2000169800A (ja) * | 1998-12-11 | 2000-06-20 | Sekisui Chem Co Ltd | 両面粘着シートの製造方法 |
JP3529647B2 (ja) | 1998-12-22 | 2004-05-24 | 小橋工業株式会社 | 畦塗り機 |
US6646022B2 (en) * | 2000-07-05 | 2003-11-11 | Mitsubishi Rayon Co., Ltd. | Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof |
US7252883B2 (en) * | 2000-10-23 | 2007-08-07 | Sekisui Chemical Co., Ltd. | Coated particles |
JP4372380B2 (ja) * | 2001-10-30 | 2009-11-25 | 三星エスディアイ株式会社 | ポリマー電解質及びリチウム二次電池並びにリチウム二次電池の製造方法 |
US7008979B2 (en) * | 2002-04-30 | 2006-03-07 | Hydromer, Inc. | Coating composition for multiple hydrophilic applications |
-
2003
- 2003-08-19 JP JP2003295666A patent/JP4539813B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-09 KR KR1020067001107A patent/KR100845875B1/ko active IP Right Grant
- 2004-06-09 CN CN2004800236540A patent/CN1836295B/zh active Active
- 2004-06-09 WO PCT/JP2004/008024 patent/WO2005017923A1/ja active Search and Examination
- 2004-06-09 EP EP04745699.1A patent/EP1657725B1/en active Active
- 2004-06-09 US US10/565,477 patent/US7846547B2/en active Active
- 2004-06-11 TW TW093116806A patent/TWI248090B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189103A (ja) * | 1983-04-11 | 1984-10-26 | Nippon Shokubai Kagaku Kogyo Co Ltd | 吸水剤 |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
JPH0930112A (ja) * | 1995-07-20 | 1997-02-04 | Mitsubishi Paper Mills Ltd | インクジェット被記録材 |
JPH11241054A (ja) * | 1997-10-28 | 1999-09-07 | Sony Chem Corp | 異方導電性接着剤および接着用膜 |
DE10016041A1 (de) * | 2000-03-31 | 2001-10-04 | Stockhausen Chem Fab Gmbh | Pulverförmige an der Oberfläche vernetzte Polymerisate |
Non-Patent Citations (2)
Title |
---|
See also references of EP1657725A4 * |
TAKECHI M. ET AL.: "Dodensei film ni yoru flip chip jiss gijutsu", DENSHI ZAIRYO, 2001 NEN 5 GATSUGO BESSATSU, 2001, pages 130 - 133, XP002984968 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010086665A (ja) * | 2008-09-29 | 2010-04-15 | Sekisui Chem Co Ltd | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
Also Published As
Publication number | Publication date |
---|---|
TWI248090B (en) | 2006-01-21 |
CN1836295A (zh) | 2006-09-20 |
EP1657725B1 (en) | 2013-04-17 |
KR100845875B1 (ko) | 2008-07-14 |
EP1657725A4 (en) | 2012-07-18 |
CN1836295B (zh) | 2011-08-31 |
JP2005063904A (ja) | 2005-03-10 |
TW200509144A (en) | 2005-03-01 |
EP1657725A1 (en) | 2006-05-17 |
KR20060059255A (ko) | 2006-06-01 |
US20060261315A1 (en) | 2006-11-23 |
US7846547B2 (en) | 2010-12-07 |
JP4539813B2 (ja) | 2010-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5099284B2 (ja) | 異方性接続シート材料 | |
JP5151902B2 (ja) | 異方導電性フィルム | |
JP5126233B2 (ja) | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物 | |
KR102345942B1 (ko) | 접착제 조성물 | |
WO2005017923A1 (ja) | 絶縁被覆導電粒子 | |
JPH083081B2 (ja) | 回路接続用接着剤組成物 | |
JP2006525641A (ja) | 異方性導電接続用絶縁導電性粒子、その製造方法及びこれを用いた製品 | |
JP3711842B2 (ja) | 異方性導電接続材料及び接続構造体 | |
JPH09143252A (ja) | 回路用接続部材 | |
JP4265140B2 (ja) | 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体 | |
JP4888482B2 (ja) | 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体 | |
JP5177439B2 (ja) | 絶縁被覆導電粒子 | |
JP2005194413A (ja) | 回路接続用接着フィルム及び回路接続構造体 | |
JP2894093B2 (ja) | 接着剤組成物及び積層フィルム | |
WO2017047671A1 (ja) | 接続材料 | |
JP2011114037A (ja) | 回路接続材料及び接続体 | |
JP5796232B2 (ja) | 導電性粒子、異方性導電材料及び接続構造体 | |
JP2009161684A (ja) | 回路接続用接着剤組成物、この接着剤組成物用いた回路部材の接続構造及び回路部材の接続方法 | |
JP5365816B2 (ja) | 絶縁被覆導電粒子 | |
JP4702566B2 (ja) | 接続材料 | |
JPH08315884A (ja) | 回路用接続部材 | |
JP2007305994A (ja) | 回路用接続部材及び回路板 | |
JPH11154687A (ja) | 回路板 | |
JP6231256B2 (ja) | 異方性導電接着剤、及び電子部品の接続方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200480023654.0 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020067001107 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004745699 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006261315 Country of ref document: US Ref document number: 10565477 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 2004745699 Country of ref document: EP |
|
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWP | Wipo information: published in national office |
Ref document number: 10565477 Country of ref document: US |