JP2004311966A5 - - Google Patents
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- Publication number
- JP2004311966A5 JP2004311966A5 JP2004067778A JP2004067778A JP2004311966A5 JP 2004311966 A5 JP2004311966 A5 JP 2004311966A5 JP 2004067778 A JP2004067778 A JP 2004067778A JP 2004067778 A JP2004067778 A JP 2004067778A JP 2004311966 A5 JP2004311966 A5 JP 2004311966A5
- Authority
- JP
- Japan
- Prior art keywords
- load lock
- unit
- chamber
- lock chamber
- exposure processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 6
- 238000001816 cooling Methods 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 5
- 230000007423 decrease Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000003068 static effect Effects 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 238000007791 dehumidification Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000008030 elimination Effects 0.000 claims 1
- 238000003379 elimination reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004067778A JP4468021B2 (ja) | 2003-03-25 | 2004-03-10 | ロードロックシステム及び露光処理システム並びにデバイスの製造方法 |
| US10/809,021 US7276097B2 (en) | 2003-03-25 | 2004-03-24 | Load-lock system, exposure processing system, and device manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003081733 | 2003-03-25 | ||
| JP2004067778A JP4468021B2 (ja) | 2003-03-25 | 2004-03-10 | ロードロックシステム及び露光処理システム並びにデバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004311966A JP2004311966A (ja) | 2004-11-04 |
| JP2004311966A5 true JP2004311966A5 (enExample) | 2007-04-26 |
| JP4468021B2 JP4468021B2 (ja) | 2010-05-26 |
Family
ID=33478156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004067778A Expired - Fee Related JP4468021B2 (ja) | 2003-03-25 | 2004-03-10 | ロードロックシステム及び露光処理システム並びにデバイスの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7276097B2 (enExample) |
| JP (1) | JP4468021B2 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4208844B2 (ja) * | 2005-01-14 | 2009-01-14 | 富士通マイクロエレクトロニクス株式会社 | 露光装置及びその制御方法 |
| JP4518986B2 (ja) | 2005-03-17 | 2010-08-04 | 東京エレクトロン株式会社 | 大気搬送室、被処理体の処理後搬送方法、プログラム及び記憶媒体 |
| DE102005017164A1 (de) * | 2005-04-14 | 2006-10-19 | Leica Microsystems Semiconductor Gmbh | Einrichtung zum Handhaben scheibenförmiger Objekte |
| JP2007142337A (ja) * | 2005-11-22 | 2007-06-07 | Canon Inc | ロードロック装置、デバイス製造装置及びデバイス製造方法 |
| US20080067368A1 (en) * | 2006-04-19 | 2008-03-20 | Mks Instruments Inc | Ionizing system for vacuum process and metrology equipment |
| KR20100100743A (ko) * | 2007-12-18 | 2010-09-15 | 스미토모덴키고교가부시키가이샤 | 처리 방법 및 반도체 장치의 제조 방법 |
| US9117870B2 (en) * | 2008-03-27 | 2015-08-25 | Lam Research Corporation | High throughput cleaner chamber |
| JPWO2010047060A1 (ja) * | 2008-10-24 | 2012-03-22 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| JP5225815B2 (ja) * | 2008-11-19 | 2013-07-03 | 東京エレクトロン株式会社 | インターフェイス装置、基板を搬送する方法及びコンピュータ可読記憶媒体 |
| US8562272B2 (en) * | 2010-02-16 | 2013-10-22 | Lam Research Corporation | Substrate load and unload mechanisms for high throughput |
| US8893642B2 (en) | 2010-03-24 | 2014-11-25 | Lam Research Corporation | Airflow management for low particulate count in a process tool |
| US8282698B2 (en) * | 2010-03-24 | 2012-10-09 | Lam Research Corporation | Reduction of particle contamination produced by moving mechanisms in a process tool |
| JP5597433B2 (ja) * | 2010-04-16 | 2014-10-01 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| US8693856B2 (en) | 2010-09-03 | 2014-04-08 | Kla-Tencor Corporation | Apparatus and methods for vacuum-compatible substrate thermal management |
| CN102279533B (zh) * | 2011-08-17 | 2013-06-12 | 中国科学院光电技术研究所 | 一种光刻机机中的输片双稳态水平锁紧装置 |
| JP5453490B2 (ja) | 2011-12-21 | 2014-03-26 | 財團法人工業技術研究院 | 除湿と離脱装置及びシステム |
| JP2013239696A (ja) * | 2012-04-16 | 2013-11-28 | Amada Co Ltd | ファイバレーザ発振器,ファイバレーザ加工装置,及びファイバレーザ発振器の除湿方法 |
| US8919210B2 (en) | 2012-11-27 | 2014-12-30 | Life Technologies Corporation | Load cell lockouts and related fluid dispensing systems |
| CN104870907B (zh) * | 2012-12-28 | 2016-07-06 | 大金工业株式会社 | 除湿系统 |
| US10295591B2 (en) * | 2013-01-02 | 2019-05-21 | Texas Instruments Incorporated | Method and device for testing wafers |
| CN109671643B (zh) | 2013-08-12 | 2023-11-28 | 应用材料公司 | 具有工厂接口环境控制的基板处理系统、装置和方法 |
| US9272315B2 (en) * | 2013-10-11 | 2016-03-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Mechanisms for controlling gas flow in enclosure |
| KR101682473B1 (ko) * | 2013-10-18 | 2016-12-05 | 삼성전자주식회사 | 사이드 스토리지 및 이를 구비하는 반도체 소자 제조 설비 |
| JP6188600B2 (ja) * | 2014-02-21 | 2017-08-30 | 三菱電機株式会社 | ガス分析装置およびガス分析方法 |
| US10359743B2 (en) | 2014-11-25 | 2019-07-23 | Applied Materials, Inc. | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
| JP7031131B2 (ja) * | 2017-03-22 | 2022-03-08 | Tdk株式会社 | Efem及びefemのガス置換方法 |
| CN109962000B (zh) * | 2017-12-25 | 2022-09-30 | 中微半导体设备(上海)股份有限公司 | 一种可减少污染颗粒的等离子体处理装置及其方法 |
| US10763134B2 (en) * | 2018-02-27 | 2020-09-01 | Applied Materials, Inc. | Substrate processing apparatus and methods with factory interface chamber filter purge |
| US11749537B2 (en) * | 2018-10-26 | 2023-09-05 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for operating equipment front end modules |
| US11694915B2 (en) * | 2018-12-19 | 2023-07-04 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Transferring device of semiconductor manufacturing and method of cleaning transferring chamber of the transferring device |
| US12278124B2 (en) * | 2021-10-28 | 2025-04-15 | Applied Materials, Inc. | Model-based controlled load lock pumping scheme |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04277025A (ja) | 1991-03-06 | 1992-10-02 | Hitachi Ltd | 真空処理装置 |
| US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
| US5943230A (en) * | 1996-12-19 | 1999-08-24 | Applied Materials, Inc. | Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system |
| US5914493A (en) * | 1997-02-21 | 1999-06-22 | Nikon Corporation | Charged-particle-beam exposure apparatus and methods with substrate-temperature control |
| US6199388B1 (en) * | 1999-03-10 | 2001-03-13 | Semco Incorporated | System and method for controlling temperature and humidity |
| JP2001118904A (ja) * | 1999-10-19 | 2001-04-27 | Canon Inc | ロードロック室を備えた基板処理装置および被処理基板の搬送方法 |
| JP3676983B2 (ja) * | 2000-03-29 | 2005-07-27 | 株式会社日立国際電気 | 半導体製造方法、基板処理方法、及び半導体製造装置 |
| US6448537B1 (en) * | 2000-12-11 | 2002-09-10 | Eric Anton Nering | Single-wafer process chamber thermal convection processes |
| JP2003031639A (ja) | 2001-07-17 | 2003-01-31 | Canon Inc | 基板処理装置、基板の搬送方法及び露光装置 |
| JP2003045947A (ja) * | 2001-07-27 | 2003-02-14 | Canon Inc | 基板処理装置及び露光装置 |
-
2004
- 2004-03-10 JP JP2004067778A patent/JP4468021B2/ja not_active Expired - Fee Related
- 2004-03-24 US US10/809,021 patent/US7276097B2/en not_active Expired - Fee Related
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