JP4468021B2 - ロードロックシステム及び露光処理システム並びにデバイスの製造方法 - Google Patents

ロードロックシステム及び露光処理システム並びにデバイスの製造方法 Download PDF

Info

Publication number
JP4468021B2
JP4468021B2 JP2004067778A JP2004067778A JP4468021B2 JP 4468021 B2 JP4468021 B2 JP 4468021B2 JP 2004067778 A JP2004067778 A JP 2004067778A JP 2004067778 A JP2004067778 A JP 2004067778A JP 4468021 B2 JP4468021 B2 JP 4468021B2
Authority
JP
Japan
Prior art keywords
load lock
unit
lock chamber
gas
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004067778A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004311966A5 (enExample
JP2004311966A (ja
Inventor
良 江渡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004067778A priority Critical patent/JP4468021B2/ja
Priority to US10/809,021 priority patent/US7276097B2/en
Publication of JP2004311966A publication Critical patent/JP2004311966A/ja
Publication of JP2004311966A5 publication Critical patent/JP2004311966A5/ja
Application granted granted Critical
Publication of JP4468021B2 publication Critical patent/JP4468021B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26—Drying gases or vapours
    • B01D53/265—Drying gases or vapours by refrigeration (condensation)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004067778A 2003-03-25 2004-03-10 ロードロックシステム及び露光処理システム並びにデバイスの製造方法 Expired - Fee Related JP4468021B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004067778A JP4468021B2 (ja) 2003-03-25 2004-03-10 ロードロックシステム及び露光処理システム並びにデバイスの製造方法
US10/809,021 US7276097B2 (en) 2003-03-25 2004-03-24 Load-lock system, exposure processing system, and device manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003081733 2003-03-25
JP2004067778A JP4468021B2 (ja) 2003-03-25 2004-03-10 ロードロックシステム及び露光処理システム並びにデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2004311966A JP2004311966A (ja) 2004-11-04
JP2004311966A5 JP2004311966A5 (enExample) 2007-04-26
JP4468021B2 true JP4468021B2 (ja) 2010-05-26

Family

ID=33478156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004067778A Expired - Fee Related JP4468021B2 (ja) 2003-03-25 2004-03-10 ロードロックシステム及び露光処理システム並びにデバイスの製造方法

Country Status (2)

Country Link
US (1) US7276097B2 (enExample)
JP (1) JP4468021B2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4208844B2 (ja) * 2005-01-14 2009-01-14 富士通マイクロエレクトロニクス株式会社 露光装置及びその制御方法
JP4518986B2 (ja) 2005-03-17 2010-08-04 東京エレクトロン株式会社 大気搬送室、被処理体の処理後搬送方法、プログラム及び記憶媒体
DE102005017164A1 (de) * 2005-04-14 2006-10-19 Leica Microsystems Semiconductor Gmbh Einrichtung zum Handhaben scheibenförmiger Objekte
JP2007142337A (ja) * 2005-11-22 2007-06-07 Canon Inc ロードロック装置、デバイス製造装置及びデバイス製造方法
US20080067368A1 (en) * 2006-04-19 2008-03-20 Mks Instruments Inc Ionizing system for vacuum process and metrology equipment
KR20100100743A (ko) * 2007-12-18 2010-09-15 스미토모덴키고교가부시키가이샤 처리 방법 및 반도체 장치의 제조 방법
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
JPWO2010047060A1 (ja) * 2008-10-24 2012-03-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP5225815B2 (ja) * 2008-11-19 2013-07-03 東京エレクトロン株式会社 インターフェイス装置、基板を搬送する方法及びコンピュータ可読記憶媒体
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
JP5597433B2 (ja) * 2010-04-16 2014-10-01 株式会社日立ハイテクノロジーズ 真空処理装置
US8693856B2 (en) 2010-09-03 2014-04-08 Kla-Tencor Corporation Apparatus and methods for vacuum-compatible substrate thermal management
CN102279533B (zh) * 2011-08-17 2013-06-12 中国科学院光电技术研究所 一种光刻机机中的输片双稳态水平锁紧装置
JP5453490B2 (ja) 2011-12-21 2014-03-26 財團法人工業技術研究院 除湿と離脱装置及びシステム
JP2013239696A (ja) * 2012-04-16 2013-11-28 Amada Co Ltd ファイバレーザ発振器，ファイバレーザ加工装置，及びファイバレーザ発振器の除湿方法
US8919210B2 (en) 2012-11-27 2014-12-30 Life Technologies Corporation Load cell lockouts and related fluid dispensing systems
CN104870907B (zh) * 2012-12-28 2016-07-06 大金工业株式会社 除湿系统
US10295591B2 (en) * 2013-01-02 2019-05-21 Texas Instruments Incorporated Method and device for testing wafers
CN109671643B (zh) 2013-08-12 2023-11-28 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法
US9272315B2 (en) * 2013-10-11 2016-03-01 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for controlling gas flow in enclosure
KR101682473B1 (ko) * 2013-10-18 2016-12-05 삼성전자주식회사 사이드 스토리지 및 이를 구비하는 반도체 소자 제조 설비
JP6188600B2 (ja) * 2014-02-21 2017-08-30 三菱電機株式会社 ガス分析装置およびガス分析方法
US10359743B2 (en) 2014-11-25 2019-07-23 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
JP7031131B2 (ja) * 2017-03-22 2022-03-08 Tdk株式会社 Ｅｆｅｍ及びｅｆｅｍのガス置換方法
CN109962000B (zh) * 2017-12-25 2022-09-30 中微半导体设备(上海)股份有限公司 一种可减少污染颗粒的等离子体处理装置及其方法
US10763134B2 (en) * 2018-02-27 2020-09-01 Applied Materials, Inc. Substrate processing apparatus and methods with factory interface chamber filter purge
US11749537B2 (en) * 2018-10-26 2023-09-05 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating equipment front end modules
US11694915B2 (en) * 2018-12-19 2023-07-04 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Transferring device of semiconductor manufacturing and method of cleaning transferring chamber of the transferring device
US12278124B2 (en) * 2021-10-28 2025-04-15 Applied Materials, Inc. Model-based controlled load lock pumping scheme

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04277025A (ja) 1991-03-06 1992-10-02 Hitachi Ltd 真空処理装置
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6199388B1 (en) * 1999-03-10 2001-03-13 Semco Incorporated System and method for controlling temperature and humidity
JP2001118904A (ja) * 1999-10-19 2001-04-27 Canon Inc ロードロック室を備えた基板処理装置および被処理基板の搬送方法
JP3676983B2 (ja) * 2000-03-29 2005-07-27 株式会社日立国際電気 半導体製造方法、基板処理方法、及び半導体製造装置
US6448537B1 (en) * 2000-12-11 2002-09-10 Eric Anton Nering Single-wafer process chamber thermal convection processes
JP2003031639A (ja) 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置

Also Published As

Publication number Publication date
US7276097B2 (en) 2007-10-02
JP2004311966A (ja) 2004-11-04
US20040187452A1 (en) 2004-09-30

Similar Documents

Publication Publication Date Title
JP4468021B2 (ja) ロードロックシステム及び露光処理システム並びにデバイスの製造方法
JP4560182B2 (ja) 減圧処理装置、半導体製造装置およびデバイス製造方法
CN100477103C (zh) 大气输送室和被处理体的处理后输送法
JP3218425B2 (ja) 処理方法及び処理装置
EP1026549B1 (en) Processing system adapted for semiconductor device manufacture
US6585430B2 (en) System and method for coating and developing
CN108695206B (zh) 基板搬送装置和基板搬送方法
US7145629B2 (en) Exposure technique
JP3590328B2 (ja) 塗布現像処理方法及び塗布現像処理システム
JP2002158153A (ja) 露光装置およびペリクル空間内ガス置換方法
JP2004273762A (ja) 処理方法及びシステム
US20040018650A1 (en) Substrate processing apparatus
US7148955B2 (en) Temperature adjusting system and exposure apparatus incorporating the same
US6406553B1 (en) Method to reduce contaminants from semiconductor wafers
JP2003059894A (ja) 基板処理装置
US7415985B2 (en) Substrate cleaning and drying apparatus
JP3559219B2 (ja) 塗布現像処理システム及び塗布現像処理方法
JP2009032809A (ja) 基板処理装置、基板処理方法及び基板処理装置のクリーニング方法
JPWO2002053267A1 (ja) ファンフィルタユニット及びその製造方法、露光装置、並びにデバイス製造方法
JP2009087992A (ja) プラズマ処理装置
JP2008066635A (ja) 容器内をパージガスによりパージする装置
JP2001237163A (ja) 光学装置、不活性ガスの制御方法、密閉空間の雰囲気制御装置およびデバイス製造方法
JP3517180B2 (ja) 塗布現像処理システム
JPH11188329A (ja) 処理装置
JP3038285B2 (ja) 減圧処理装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070312

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070312

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091118

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091204

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100219

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100224

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130305

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140305

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees