JP2004282072A5 - - Google Patents

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Publication number
JP2004282072A5
JP2004282072A5 JP2004070540A JP2004070540A JP2004282072A5 JP 2004282072 A5 JP2004282072 A5 JP 2004282072A5 JP 2004070540 A JP2004070540 A JP 2004070540A JP 2004070540 A JP2004070540 A JP 2004070540A JP 2004282072 A5 JP2004282072 A5 JP 2004282072A5
Authority
JP
Japan
Prior art keywords
input
substrate
main surface
interposer
output contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004070540A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004282072A (ja
JP5568205B2 (ja
Filing date
Publication date
Priority claimed from US10/388,997 external-priority patent/US6819001B2/en
Application filed filed Critical
Publication of JP2004282072A publication Critical patent/JP2004282072A/ja
Publication of JP2004282072A5 publication Critical patent/JP2004282072A5/ja
Application granted granted Critical
Publication of JP5568205B2 publication Critical patent/JP5568205B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004070540A 2003-03-14 2004-03-12 インタポーザ、インタポーザパッケージ、及びそれらを使用したデバイス組立体 Expired - Lifetime JP5568205B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/388,997 US6819001B2 (en) 2003-03-14 2003-03-14 Interposer, interposer package and device assembly employing the same
US10/388,997 2003-03-14

Publications (3)

Publication Number Publication Date
JP2004282072A JP2004282072A (ja) 2004-10-07
JP2004282072A5 true JP2004282072A5 (enExample) 2007-04-19
JP5568205B2 JP5568205B2 (ja) 2014-08-06

Family

ID=32962177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004070540A Expired - Lifetime JP5568205B2 (ja) 2003-03-14 2004-03-12 インタポーザ、インタポーザパッケージ、及びそれらを使用したデバイス組立体

Country Status (6)

Country Link
US (1) US6819001B2 (enExample)
JP (1) JP5568205B2 (enExample)
CN (1) CN100454532C (enExample)
DE (1) DE102004012595A1 (enExample)
IL (1) IL160581A0 (enExample)
NL (1) NL1025639C2 (enExample)

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US20060091538A1 (en) * 2004-11-04 2006-05-04 Kabadi Ashok N Low profile and tight pad-pitch land-grid-array (LGA) socket
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
WO2006075283A2 (en) * 2005-01-11 2006-07-20 Koninklijke Philips Electronics, N.V. Redistribution interconnect for microbeamformer(s) and a medical ultrasound system
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CN101193711B (zh) * 2005-06-07 2010-12-29 皇家飞利浦电子股份有限公司 用于超声传感器组件的多器件衬块
JP4507101B2 (ja) 2005-06-30 2010-07-21 エルピーダメモリ株式会社 半導体記憶装置及びその製造方法
JP2007139912A (ja) * 2005-11-15 2007-06-07 Sharp Corp 駆動素子実装表示装置
JP4744360B2 (ja) * 2006-05-22 2011-08-10 富士通株式会社 半導体装置
TWI326908B (en) * 2006-09-11 2010-07-01 Ind Tech Res Inst Packaging structure and fabricating method thereof
US20080068815A1 (en) * 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
US7518226B2 (en) * 2007-02-06 2009-04-14 Stats Chippac Ltd. Integrated circuit packaging system with interposer
KR101387701B1 (ko) * 2007-08-01 2014-04-23 삼성전자주식회사 반도체 패키지 및 이의 제조방법
KR101623880B1 (ko) * 2008-09-24 2016-05-25 삼성전자주식회사 반도체 패키지
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US7936060B2 (en) * 2009-04-29 2011-05-03 International Business Machines Corporation Reworkable electronic device assembly and method
US20110180317A1 (en) * 2009-09-11 2011-07-28 Eiji Takahashi Electronic component package, method for producing the same and interposer
US8008121B2 (en) 2009-11-04 2011-08-30 Stats Chippac, Ltd. Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
US8405229B2 (en) * 2009-11-30 2013-03-26 Endicott Interconnect Technologies, Inc. Electronic package including high density interposer and circuitized substrate assembly utilizing same
US8363418B2 (en) 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
US9013041B2 (en) * 2011-12-28 2015-04-21 Broadcom Corporation Semiconductor package with ultra-thin interposer without through-semiconductor vias
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
US20140264938A1 (en) * 2013-03-14 2014-09-18 Douglas R. Hackler, Sr. Flexible Interconnect
KR20160036667A (ko) 2013-09-27 2016-04-04 인텔 코포레이션 양면 다이 패키지
JP2015082524A (ja) * 2013-10-21 2015-04-27 ソニー株式会社 配線基板、半導体装置
US9613857B2 (en) * 2014-10-30 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection structure and method
US11309192B2 (en) 2018-06-05 2022-04-19 Intel Corporation Integrated circuit package supports
DE102020206769B3 (de) * 2020-05-29 2021-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Mikroelektronische anordnung und verfahren zur herstellung derselben
CN114698242A (zh) * 2022-03-29 2022-07-01 维沃移动通信有限公司 Fpc和电子设备

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