NL1025639C2 - Interposer, interposerbehuizing en inrichtingssamenstel, dat deze interposer en interposerbehuizing toepast. - Google Patents

Interposer, interposerbehuizing en inrichtingssamenstel, dat deze interposer en interposerbehuizing toepast. Download PDF

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Publication number
NL1025639C2
NL1025639C2 NL1025639A NL1025639A NL1025639C2 NL 1025639 C2 NL1025639 C2 NL 1025639C2 NL 1025639 A NL1025639 A NL 1025639A NL 1025639 A NL1025639 A NL 1025639A NL 1025639 C2 NL1025639 C2 NL 1025639C2
Authority
NL
Netherlands
Prior art keywords
interposer
input
substrate
output contacts
output
Prior art date
Application number
NL1025639A
Other languages
English (en)
Dutch (nl)
Other versions
NL1025639A1 (nl
Inventor
James Wilson Rose
William Edward Burdick Jr
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL1025639A1 publication Critical patent/NL1025639A1/nl
Application granted granted Critical
Publication of NL1025639C2 publication Critical patent/NL1025639C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
NL1025639A 2003-03-14 2004-03-04 Interposer, interposerbehuizing en inrichtingssamenstel, dat deze interposer en interposerbehuizing toepast. NL1025639C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38899703 2003-03-14
US10/388,997 US6819001B2 (en) 2003-03-14 2003-03-14 Interposer, interposer package and device assembly employing the same

Publications (2)

Publication Number Publication Date
NL1025639A1 NL1025639A1 (nl) 2004-09-16
NL1025639C2 true NL1025639C2 (nl) 2005-05-26

Family

ID=32962177

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1025639A NL1025639C2 (nl) 2003-03-14 2004-03-04 Interposer, interposerbehuizing en inrichtingssamenstel, dat deze interposer en interposerbehuizing toepast.

Country Status (6)

Country Link
US (1) US6819001B2 (enExample)
JP (1) JP5568205B2 (enExample)
CN (1) CN100454532C (enExample)
DE (1) DE102004012595A1 (enExample)
IL (1) IL160581A0 (enExample)
NL (1) NL1025639C2 (enExample)

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US6990176B2 (en) 2003-10-30 2006-01-24 General Electric Company Methods and apparatus for tileable sensor array
US7242073B2 (en) * 2003-12-23 2007-07-10 Intel Corporation Capacitor having an anodic metal oxide substrate
US7019346B2 (en) * 2003-12-23 2006-03-28 Intel Corporation Capacitor having an anodic metal oxide substrate
US20060091538A1 (en) * 2004-11-04 2006-05-04 Kabadi Ashok N Low profile and tight pad-pitch land-grid-array (LGA) socket
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
CN101102853B (zh) * 2005-01-11 2010-12-08 皇家飞利浦电子股份有限公司 用于(多个)微束形成器的重分布互连和医学超声系统
KR100652397B1 (ko) * 2005-01-17 2006-12-01 삼성전자주식회사 매개 인쇄회로기판을 사용하는 적층형 반도체 패키지
CN101193711B (zh) * 2005-06-07 2010-12-29 皇家飞利浦电子股份有限公司 用于超声传感器组件的多器件衬块
JP4507101B2 (ja) 2005-06-30 2010-07-21 エルピーダメモリ株式会社 半導体記憶装置及びその製造方法
JP2007139912A (ja) * 2005-11-15 2007-06-07 Sharp Corp 駆動素子実装表示装置
JP4744360B2 (ja) * 2006-05-22 2011-08-10 富士通株式会社 半導体装置
TWI326908B (en) * 2006-09-11 2010-07-01 Ind Tech Res Inst Packaging structure and fabricating method thereof
US20080068815A1 (en) * 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
US7518226B2 (en) * 2007-02-06 2009-04-14 Stats Chippac Ltd. Integrated circuit packaging system with interposer
KR101387701B1 (ko) * 2007-08-01 2014-04-23 삼성전자주식회사 반도체 패키지 및 이의 제조방법
KR101623880B1 (ko) * 2008-09-24 2016-05-25 삼성전자주식회사 반도체 패키지
US7973272B2 (en) * 2009-03-09 2011-07-05 Bae Systems Information And Electronic Systems Integration, Inc. Interface techniques for coupling a microchannel plate to a readout circuit
US7923290B2 (en) * 2009-03-27 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system having dual sided connection and method of manufacture thereof
US7936060B2 (en) * 2009-04-29 2011-05-03 International Business Machines Corporation Reworkable electronic device assembly and method
US20110180317A1 (en) * 2009-09-11 2011-07-28 Eiji Takahashi Electronic component package, method for producing the same and interposer
US8008121B2 (en) * 2009-11-04 2011-08-30 Stats Chippac, Ltd. Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
US8405229B2 (en) * 2009-11-30 2013-03-26 Endicott Interconnect Technologies, Inc. Electronic package including high density interposer and circuitized substrate assembly utilizing same
US8363418B2 (en) 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
US9013041B2 (en) * 2011-12-28 2015-04-21 Broadcom Corporation Semiconductor package with ultra-thin interposer without through-semiconductor vias
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
US20140264938A1 (en) * 2013-03-14 2014-09-18 Douglas R. Hackler, Sr. Flexible Interconnect
WO2015047350A1 (en) * 2013-09-27 2015-04-02 Intel Corporation Dual-sided die packages
JP2015082524A (ja) * 2013-10-21 2015-04-27 ソニー株式会社 配線基板、半導体装置
US9613857B2 (en) * 2014-10-30 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection structure and method
US11309192B2 (en) * 2018-06-05 2022-04-19 Intel Corporation Integrated circuit package supports
DE102020206769B3 (de) * 2020-05-29 2021-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Mikroelektronische anordnung und verfahren zur herstellung derselben
US11804428B2 (en) * 2020-11-13 2023-10-31 Qualcomm Incorporated Mixed pad size and pad design
CN114698242A (zh) * 2022-03-29 2022-07-01 维沃移动通信有限公司 Fpc和电子设备

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US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
EP0997942A2 (en) * 1998-10-30 2000-05-03 Shinko Electric Industries Co. Ltd. Chip Size Semiconductor Package and process for producing it
DE10142116A1 (de) * 2001-08-30 2002-11-14 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung
US20020182771A1 (en) * 2000-08-31 2002-12-05 Salman Akram Carrier for wafer-scale package, wafer-scale package including the carrier, and methods

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US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
EP0997942A2 (en) * 1998-10-30 2000-05-03 Shinko Electric Industries Co. Ltd. Chip Size Semiconductor Package and process for producing it
US20020182771A1 (en) * 2000-08-31 2002-12-05 Salman Akram Carrier for wafer-scale package, wafer-scale package including the carrier, and methods
DE10142116A1 (de) * 2001-08-30 2002-11-14 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
IL160581A0 (en) 2004-07-25
NL1025639A1 (nl) 2004-09-16
DE102004012595A1 (de) 2004-10-28
US20040178484A1 (en) 2004-09-16
CN1531081A (zh) 2004-09-22
US6819001B2 (en) 2004-11-16
CN100454532C (zh) 2009-01-21
JP2004282072A (ja) 2004-10-07
JP5568205B2 (ja) 2014-08-06

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AD1A A request for search or an international type search has been filed
RD2N Patents in respect of which a decision has been taken or a report has been made (novelty report)

Effective date: 20050119

PD2B A search report has been drawn up
V1 Lapsed because of non-payment of the annual fee

Effective date: 20131001