JP5568205B2 - インタポーザ、インタポーザパッケージ、及びそれらを使用したデバイス組立体 - Google Patents
インタポーザ、インタポーザパッケージ、及びそれらを使用したデバイス組立体 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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Description
110 インタポーザパッケージ
120 インタポーザ
122 第1の入力/出力接点
124 ビア
126 第2の入力/出力接点
130 カプセル
132 差込み可能接点
140 デバイス
142 入力/出力パッド
150 ハンダ付け
Claims (7)
- 半導体物質で形成されたデバイス基板と、該デバイス基板の底面に設けられた入力/出力パッド(142)を有するデバイス(140、210、310、410)と、
半導体物質で形成されたインタポーザ基板と、前記インタポーザ基板の第1のメイン表面上に置かれた第1の入力/出力接点(122、340、360)と、該インタポーザ基板の第2のメイン表面上に置かれた第2の入力/出力接点(126、330、415)と、
前記第2の入力/出力接点(126、330、415)に電気的に接続された導電性フィンガとを有するインタポーザ(120、200、300、400)と、
前記導電性フィンガが着脱可能に受け入れる入力/出力手段を備えた構成要素(220)とを含み、
前記第2の入力/出力接点が、前記第1の入力/出力接点に電気的に接続(124、320)されており、
前記導電性フィンガが、前記インタポーザ基板と平行な方向に移動可能であり、前記構成要素(220)の前記入力/出力手段を受け入れる、スプリングを備え、
前記インタポーザ基板の第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、それに対して前記インタポーザ(120、200、300、400)を取り付けようとしている前記デバイス(140、210、310、410)の前記入力/出力パッド(142)にハンダ付けにより取り付けるためのものであり、
前記インタポーザ基板が前記デバイス基板の材料と一致する半導体物質で製作されており、
前記第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、前記インタポーザ基板の第2のメイン表面上に置かれた前記第2の入力/出力接点(126、330、415)よりも小さいピッチを有することを特徴とする構造体。 - 前記インタポーザ基板の第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、それに対して前記インタポーザを取り付けようとしている前記デバイス(140、210、310、410)の入力/出力パッド(142)と対応する形状サイズを有することを特徴とする、請求項1に記載の構造体。
- 前記デバイス(140、210、310、410)が、x、y表面区域を有する集積回路ベアチップを含み、前記インタポーザ(120、200、300、400)が、前記集積回路ベアチップのx、y表面区域と同じサイズにされた表面区域を有することを特徴とする、請求項1に記載の構造体。
- 前記集積回路ベアチップ(140、210、310、410)が、第1の集積回路チップを含み、前記構成要素(220)が、第2の集積回路チップを含み、前記インタポーザ(120、200、300、400)が、前記第1の集積回路チップと前記第2の集積回路チップとの間の電気的接続を可能にすることを特徴とする、請求項3に記載の構造体。
- 前記半導体物質が、シリコン、炭化ケイ素、及びガリウム砒素の少なくとも1つを含むことを特徴とする、請求項1に記載の構造体。
- 半導体物質で形成されたデバイス基板と、その底面上に置かれた入力/出力パッド(142)を有する集積回路デバイス(140、210、310、410)と、
半導体物質で形成されたインタポーザ基板と、前記インタポーザ基板の第1のメイン表面上に置かれた第1の入力/出力接点(122、340、360)と、該インタポーザ基板の第2のメイン表面上に置かれかつ前記第1の入力/出力接点に電気的に接続(124、320)された第2の入力/出力接点(126、330、415)と、前記第2の入力/出力接点(126、330、415)に電気的に接続された導電性フィンガとを有するインタポーザ(120、200、300、400)と、
前記導電性フィンガが着脱可能に受け入れる入力/出力手段を備えた構成要素(220)とを含み、
前記導電性フィンガが、前記インタポーザ基板と平行な方向に移動可能であり、前記構成要素(220)の前記入力/出力手段を受け入れる、スプリングを備え、
前記インタポーザ基板の第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、ハンダ付けにより前記集積回路デバイス(140、210、310、410)の入力/出力パッド(142)に電気的に取り付けられ、
前記インタポーザ基板が前記デバイス基板の材料と一致する半導体物質で製作されており、
前記第1の入力/出力接点(122、340、360)を、前記インタポーザ基板の前記第2の入力/出力接点(126、330、415)に接続する電気的相互接続手段を更に有し、該電気的相互接続手段は前記インタポーザ基板の前記半導体物質から電気的に絶縁されており、
前記第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、前記インタポーザ基板の第2のメイン表面上に置かれた前記第2の入力/出力接点(126、330、415)よりも小さいピッチを有していることを特徴とする構造体(100)。 - 半導体物質で形成されたデバイス基板を有するデバイス(140、210、310、410)の前記デバイス基板の底面に設けられた入力/出力パッド(142)に接触させるための方法であって、
半導体物質で形成されたインタポーザ基板と、前記インタポーザ基板の第1のメイン表面上に置かれた第1の入力/出力接点(122、340、360)と、該インタポーザ基板の第2のメイン表面上に置かれかつそれに対して前記第1の入力/出力接点が電気的に接続(124、320)された第2の入力/出力接点(126、330、415)と、前記第2の入力/出力接点(126、330、415)に電気的に接続された導電性フィンガとを含むインタポーザ(120、200、300、400)を準備する段階と、
前記インタポーザ(120、200、300、400)の第1の入力/出力接点(122、340、360)をハンダ付けによりデバイス(140、210、310、410)の入力/出力パッド(142)に電気的に接続することにより、該インタポーザ(120、200、300、400)を該デバイスに対して電気的に接続する段階と、
構成要素(220)の入力/出力手段を前記導電性フィンガに電気接続することにより、前記インタポーザ(120、200、300、400)を前記構成要素(220)に対して電気的に接続する段階と、
を含み、
前記導電性フィンガが、前記インタポーザ基板と平行な方向に移動可能であり、前記構成要素(220)の前記入力/出力手段を着脱可能に受け入れる、スプリングを備え、
前記第1のメイン表面上に置かれた前記第1の入力/出力接点(122、340、360)が、前記インタポーザ基板の第2のメイン表面上に置かれた前記第2の入力/出力接点(126、330、415)よりも小さいピッチを有し、
前記インタポーザ基板が前記デバイス基板の材料と一致する半導体物質で製作されている
ことを特徴とする方法。
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US10/388,997 | 2003-03-14 | ||
US10/388,997 US6819001B2 (en) | 2003-03-14 | 2003-03-14 | Interposer, interposer package and device assembly employing the same |
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JP2004282072A5 JP2004282072A5 (ja) | 2007-04-19 |
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JP (1) | JP5568205B2 (ja) |
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DE (1) | DE102004012595A1 (ja) |
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CN1531081A (zh) | 2004-09-22 |
NL1025639C2 (nl) | 2005-05-26 |
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US20040178484A1 (en) | 2004-09-16 |
CN100454532C (zh) | 2009-01-21 |
NL1025639A1 (nl) | 2004-09-16 |
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