JP2004072093A - 半導体試験データ解析システム - Google Patents
半導体試験データ解析システム Download PDFInfo
- Publication number
- JP2004072093A JP2004072093A JP2003187735A JP2003187735A JP2004072093A JP 2004072093 A JP2004072093 A JP 2004072093A JP 2003187735 A JP2003187735 A JP 2003187735A JP 2003187735 A JP2003187735 A JP 2003187735A JP 2004072093 A JP2004072093 A JP 2004072093A
- Authority
- JP
- Japan
- Prior art keywords
- analysis
- data
- information
- test data
- semiconductor test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/186,171 US6898545B2 (en) | 2002-06-28 | 2002-06-28 | Semiconductor test data analysis system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004072093A true JP2004072093A (ja) | 2004-03-04 |
| JP2004072093A5 JP2004072093A5 (enExample) | 2006-08-17 |
Family
ID=29718020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003187735A Pending JP2004072093A (ja) | 2002-06-28 | 2003-06-30 | 半導体試験データ解析システム |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6898545B2 (enExample) |
| EP (1) | EP1376144A3 (enExample) |
| JP (1) | JP2004072093A (enExample) |
| TW (1) | TWI292540B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007018930A (ja) * | 2005-07-08 | 2007-01-25 | Hitachi High-Technologies Corp | 半導体検査装置 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7143370B1 (en) * | 2003-06-11 | 2006-11-28 | Advanced Micro Devices, Inc. | Parameter linking system for data visualization in integrated circuit technology development |
| TWI401580B (zh) * | 2004-11-30 | 2013-07-11 | 尼康股份有限公司 | A component processing system, an information display method, and a recorded recording medium, an exposure apparatus, a measurement and inspection apparatus |
| US7200523B1 (en) * | 2005-11-30 | 2007-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for filtering statistical process data to enhance process performance |
| US20100076724A1 (en) * | 2008-09-23 | 2010-03-25 | Harold Lee Brown | Method for capturing and analyzing test result data |
| US20140277467A1 (en) | 2013-03-14 | 2014-09-18 | Spinal Stabilization Technologies, Llc | Prosthetic Spinal Disk Nucleus |
| CN104077271B (zh) * | 2013-03-27 | 2018-06-05 | 珠海全志科技股份有限公司 | 晶圆图数据的处理方法及系统 |
| WO2015049734A1 (ja) * | 2013-10-02 | 2015-04-09 | 株式会社日立製作所 | 検索システム及び検索方法 |
| US10786360B2 (en) | 2014-11-04 | 2020-09-29 | Spinal Stabilization Technologies Llc | Percutaneous implantable nuclear prosthesis |
| CN106999286B (zh) | 2014-11-04 | 2019-08-16 | 脊柱稳定技术有限责任公司 | 可经皮植入的髓核假体 |
| US10204188B2 (en) * | 2015-03-13 | 2019-02-12 | Samsung Electronics Co., Ltd. | Systems, methods and computer program products for analyzing performance of semiconductor devices |
| ES2774513T3 (es) | 2015-09-01 | 2020-07-21 | Spinal Stabilization Tech Llc | Prótesis nuclear implantable |
| JP2020004070A (ja) * | 2018-06-28 | 2020-01-09 | ルネサスエレクトロニクス株式会社 | 半導体製品品質管理サーバ、半導体装置、および半導体製品品質管理システム |
| AU2019384660B2 (en) | 2018-09-04 | 2025-03-27 | Spinal Stabilization Technologies, Llc | Implantable nuclear prosthesis, kits, and related methods |
| US11475052B1 (en) * | 2019-11-08 | 2022-10-18 | Tableau Software, Inc. | Using visual cues to validate object models of database tables |
| CN114297052B (zh) * | 2021-12-13 | 2025-03-21 | 上海金仕达软件科技股份有限公司 | 测试数据生成方法及装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07234188A (ja) * | 1994-02-23 | 1995-09-05 | Hitachi Ltd | データ解析システム |
| JP2000269107A (ja) * | 1999-03-15 | 2000-09-29 | Toshiba Corp | 半導体製造工程のデータ解析システム |
| JP2001521249A (ja) * | 1997-10-27 | 2001-11-06 | ケイエルエイ−テンコー コーポレイション | 生産分析において分類及び属性を拡張するソフトウエアシステム及び方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5371851A (en) * | 1989-04-26 | 1994-12-06 | Credence Systems Corporation | Graphical data base editor |
| JP2941308B2 (ja) * | 1989-07-12 | 1999-08-25 | 株式会社日立製作所 | 検査システムおよび電子デバイスの製造方法 |
| JPH07501906A (ja) * | 1992-06-02 | 1995-02-23 | アジレント・テクノロジーズ・インク | マルチレベル相互接続技術のためのコンピュータ支援設計方法及び装置 |
| JP2616413B2 (ja) * | 1993-11-22 | 1997-06-04 | 日本電気株式会社 | リペアデータの編集装置およびリペアデータの編集方法 |
| US5761417A (en) * | 1994-09-08 | 1998-06-02 | International Business Machines Corporation | Video data streamer having scheduler for scheduling read request for individual data buffers associated with output ports of communication node to one storage node |
| JP3364390B2 (ja) * | 1995-12-30 | 2003-01-08 | 東京エレクトロン株式会社 | 検査装置 |
| US20020109734A1 (en) * | 1997-10-10 | 2002-08-15 | Satoshi Umezu | GUI processing system for performing an operation of an application which controls testing equipment |
| US6097887A (en) | 1997-10-27 | 2000-08-01 | Kla-Tencor Corporation | Software system and method for graphically building customized recipe flowcharts |
| US6128759A (en) * | 1998-03-20 | 2000-10-03 | Teradyne, Inc. | Flexible test environment for automatic test equipment |
| US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
| US6292766B1 (en) * | 1998-12-18 | 2001-09-18 | Vlsi Technology, Inc. | Simulation tool input file generator for interface circuitry |
| US6319737B1 (en) * | 1999-08-10 | 2001-11-20 | Advanced Micro Devices, Inc. | Method and apparatus for characterizing a semiconductor device |
| US6681351B1 (en) * | 1999-10-12 | 2004-01-20 | Teradyne, Inc. | Easy to program automatic test equipment |
| US6707474B1 (en) * | 1999-10-29 | 2004-03-16 | Agilent Technologies, Inc. | System and method for manipulating relationships among signals and buses of a signal measurement system on a graphical user interface |
| JP3660561B2 (ja) * | 1999-11-10 | 2005-06-15 | 株式会社東芝 | 半導体集積回路の故障解析装置 |
| JP3447638B2 (ja) * | 1999-12-24 | 2003-09-16 | 日本電気株式会社 | 半導体装置のテスト方法及びシステム並びに記録媒体 |
| JP2001306999A (ja) * | 2000-02-18 | 2001-11-02 | Fujitsu Ltd | データ解析装置およびデータ解析方法 |
| JP2002071762A (ja) * | 2000-06-13 | 2002-03-12 | Advantest Corp | 半導体試験装置及びそのモニタ装置 |
| CA2321346A1 (en) * | 2000-09-28 | 2002-03-28 | Stephen K. Sunter | Method, system and program product for testing and/or diagnosing circuits using embedded test controller access data |
| KR100374636B1 (ko) * | 2000-10-18 | 2003-03-04 | 삼성전자주식회사 | 결함 테스트 및 분석 회로를 구비하는 반도체 장치 및 결함 분석 방법 |
| JP2002163900A (ja) * | 2000-11-22 | 2002-06-07 | Hitachi Ltd | 半導体ウエハ、半導体チップ、半導体装置および半導体装置の製造方法 |
| US6711522B2 (en) * | 2001-04-25 | 2004-03-23 | Fujitsu Limited | Data analysis apparatus, data analysis method, and computer products |
| WO2003026001A2 (en) * | 2001-09-18 | 2003-03-27 | Applied Materials, Inc. | Integrated equipment set for forming an interconnect on a substrate |
| US7043696B2 (en) * | 2002-01-15 | 2006-05-09 | National Instruments Corporation | Graphical program system having a single graphical user interface shared by a plurality of graphical programs |
-
2002
- 2002-06-28 US US10/186,171 patent/US6898545B2/en not_active Expired - Fee Related
-
2003
- 2003-06-27 EP EP03254101A patent/EP1376144A3/en not_active Withdrawn
- 2003-06-27 TW TW092117608A patent/TWI292540B/zh not_active IP Right Cessation
- 2003-06-30 JP JP2003187735A patent/JP2004072093A/ja active Pending
-
2005
- 2005-01-04 US US11/028,823 patent/US7035752B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07234188A (ja) * | 1994-02-23 | 1995-09-05 | Hitachi Ltd | データ解析システム |
| JP2001521249A (ja) * | 1997-10-27 | 2001-11-06 | ケイエルエイ−テンコー コーポレイション | 生産分析において分類及び属性を拡張するソフトウエアシステム及び方法 |
| JP2000269107A (ja) * | 1999-03-15 | 2000-09-29 | Toshiba Corp | 半導体製造工程のデータ解析システム |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007018930A (ja) * | 2005-07-08 | 2007-01-25 | Hitachi High-Technologies Corp | 半導体検査装置 |
| US7916926B2 (en) | 2005-07-08 | 2011-03-29 | Hitachi High-Technologies Corporation | Semiconductor inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US6898545B2 (en) | 2005-05-24 |
| US20050119852A1 (en) | 2005-06-02 |
| EP1376144A2 (en) | 2004-01-02 |
| EP1376144A3 (en) | 2006-01-18 |
| TW200406692A (en) | 2004-05-01 |
| US20040002829A1 (en) | 2004-01-01 |
| TWI292540B (en) | 2008-01-11 |
| US7035752B2 (en) | 2006-04-25 |
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Legal Events
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060630 |
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