TWI292540B - Semiconductor test data analysis system, method for displaying therein, and method for analyzing semiconductor test data implemented therein - Google Patents
Semiconductor test data analysis system, method for displaying therein, and method for analyzing semiconductor test data implemented therein Download PDFInfo
- Publication number
- TWI292540B TWI292540B TW092117608A TW92117608A TWI292540B TW I292540 B TWI292540 B TW I292540B TW 092117608 A TW092117608 A TW 092117608A TW 92117608 A TW92117608 A TW 92117608A TW I292540 B TWI292540 B TW I292540B
- Authority
- TW
- Taiwan
- Prior art keywords
- analysis
- data
- job
- image
- information
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/186,171 US6898545B2 (en) | 2002-06-28 | 2002-06-28 | Semiconductor test data analysis system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200406692A TW200406692A (en) | 2004-05-01 |
| TWI292540B true TWI292540B (en) | 2008-01-11 |
Family
ID=29718020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092117608A TWI292540B (en) | 2002-06-28 | 2003-06-27 | Semiconductor test data analysis system, method for displaying therein, and method for analyzing semiconductor test data implemented therein |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6898545B2 (enExample) |
| EP (1) | EP1376144A3 (enExample) |
| JP (1) | JP2004072093A (enExample) |
| TW (1) | TWI292540B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7143370B1 (en) * | 2003-06-11 | 2006-11-28 | Advanced Micro Devices, Inc. | Parameter linking system for data visualization in integrated circuit technology development |
| EP1818972A4 (en) * | 2004-11-30 | 2009-06-03 | Nikon Corp | DEVICE PROCESSING SYSTEM, INFORMATION DISPLAY PROCEDURE, PROGRAM AND RECORDING MEDIUM |
| JP4537277B2 (ja) * | 2005-07-08 | 2010-09-01 | 株式会社日立ハイテクノロジーズ | 半導体検査装置 |
| US7200523B1 (en) * | 2005-11-30 | 2007-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for filtering statistical process data to enhance process performance |
| US20100076724A1 (en) * | 2008-09-23 | 2010-03-25 | Harold Lee Brown | Method for capturing and analyzing test result data |
| US20140277467A1 (en) | 2013-03-14 | 2014-09-18 | Spinal Stabilization Technologies, Llc | Prosthetic Spinal Disk Nucleus |
| CN104077271B (zh) * | 2013-03-27 | 2018-06-05 | 珠海全志科技股份有限公司 | 晶圆图数据的处理方法及系统 |
| US20160217192A1 (en) * | 2013-10-02 | 2016-07-28 | Hitachi, Ltd. | Search system and search method |
| US10786360B2 (en) | 2014-11-04 | 2020-09-29 | Spinal Stabilization Technologies Llc | Percutaneous implantable nuclear prosthesis |
| WO2016073568A1 (en) | 2014-11-04 | 2016-05-12 | Spinal Stabilization Technologies Llc | Percutaneous implantable nuclear prosthesis |
| US10204188B2 (en) * | 2015-03-13 | 2019-02-12 | Samsung Electronics Co., Ltd. | Systems, methods and computer program products for analyzing performance of semiconductor devices |
| EP3344156B1 (en) | 2015-09-01 | 2020-01-08 | Spinal Stabilization Technologies LLC | Implantable nuclear prosthesis |
| JP2020004070A (ja) * | 2018-06-28 | 2020-01-09 | ルネサスエレクトロニクス株式会社 | 半導体製品品質管理サーバ、半導体装置、および半導体製品品質管理システム |
| JP7457712B2 (ja) | 2018-09-04 | 2024-03-28 | スパイナル スタビライゼーション テクノロジーズ リミテッド ライアビリティ カンパニー | 植込み可能な髄核補綴物、キット、および関連する方法 |
| US11475052B1 (en) | 2019-11-08 | 2022-10-18 | Tableau Software, Inc. | Using visual cues to validate object models of database tables |
| CN114297052B (zh) * | 2021-12-13 | 2025-03-21 | 上海金仕达软件科技股份有限公司 | 测试数据生成方法及装置 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5371851A (en) * | 1989-04-26 | 1994-12-06 | Credence Systems Corporation | Graphical data base editor |
| JP2941308B2 (ja) * | 1989-07-12 | 1999-08-25 | 株式会社日立製作所 | 検査システムおよび電子デバイスの製造方法 |
| DE69325770T2 (de) * | 1992-06-02 | 1999-11-18 | Hewlett-Packard Co., Palo Alto | Verfahren zum rechnergestützten entwurf für mehrschichtverbindungen-technologien |
| JP2616413B2 (ja) * | 1993-11-22 | 1997-06-04 | 日本電気株式会社 | リペアデータの編集装置およびリペアデータの編集方法 |
| JPH07234188A (ja) * | 1994-02-23 | 1995-09-05 | Hitachi Ltd | データ解析システム |
| US5761417A (en) * | 1994-09-08 | 1998-06-02 | International Business Machines Corporation | Video data streamer having scheduler for scheduling read request for individual data buffers associated with output ports of communication node to one storage node |
| JP3364390B2 (ja) * | 1995-12-30 | 2003-01-08 | 東京エレクトロン株式会社 | 検査装置 |
| US20020109734A1 (en) * | 1997-10-10 | 2002-08-15 | Satoshi Umezu | GUI processing system for performing an operation of an application which controls testing equipment |
| WO1999022311A1 (en) | 1997-10-27 | 1999-05-06 | Kla-Tencor Corporation | Software system and method for graphically building customized recipe flowcharts |
| US6097887A (en) | 1997-10-27 | 2000-08-01 | Kla-Tencor Corporation | Software system and method for graphically building customized recipe flowcharts |
| US6128759A (en) * | 1998-03-20 | 2000-10-03 | Teradyne, Inc. | Flexible test environment for automatic test equipment |
| US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
| US6292766B1 (en) * | 1998-12-18 | 2001-09-18 | Vlsi Technology, Inc. | Simulation tool input file generator for interface circuitry |
| JP2000269107A (ja) * | 1999-03-15 | 2000-09-29 | Toshiba Corp | 半導体製造工程のデータ解析システム |
| US6319737B1 (en) * | 1999-08-10 | 2001-11-20 | Advanced Micro Devices, Inc. | Method and apparatus for characterizing a semiconductor device |
| US6681351B1 (en) * | 1999-10-12 | 2004-01-20 | Teradyne, Inc. | Easy to program automatic test equipment |
| US6707474B1 (en) * | 1999-10-29 | 2004-03-16 | Agilent Technologies, Inc. | System and method for manipulating relationships among signals and buses of a signal measurement system on a graphical user interface |
| JP3660561B2 (ja) * | 1999-11-10 | 2005-06-15 | 株式会社東芝 | 半導体集積回路の故障解析装置 |
| JP3447638B2 (ja) * | 1999-12-24 | 2003-09-16 | 日本電気株式会社 | 半導体装置のテスト方法及びシステム並びに記録媒体 |
| JP2001306999A (ja) * | 2000-02-18 | 2001-11-02 | Fujitsu Ltd | データ解析装置およびデータ解析方法 |
| JP2002071762A (ja) * | 2000-06-13 | 2002-03-12 | Advantest Corp | 半導体試験装置及びそのモニタ装置 |
| CA2321346A1 (en) * | 2000-09-28 | 2002-03-28 | Stephen K. Sunter | Method, system and program product for testing and/or diagnosing circuits using embedded test controller access data |
| KR100374636B1 (ko) * | 2000-10-18 | 2003-03-04 | 삼성전자주식회사 | 결함 테스트 및 분석 회로를 구비하는 반도체 장치 및 결함 분석 방법 |
| JP2002163900A (ja) * | 2000-11-22 | 2002-06-07 | Hitachi Ltd | 半導体ウエハ、半導体チップ、半導体装置および半導体装置の製造方法 |
| US6711522B2 (en) * | 2001-04-25 | 2004-03-23 | Fujitsu Limited | Data analysis apparatus, data analysis method, and computer products |
| AU2002341677A1 (en) * | 2001-09-18 | 2003-04-01 | Applied Materials, Inc. | Integrated equipment set for forming an interconnect on a substrate |
| US7043696B2 (en) * | 2002-01-15 | 2006-05-09 | National Instruments Corporation | Graphical program system having a single graphical user interface shared by a plurality of graphical programs |
-
2002
- 2002-06-28 US US10/186,171 patent/US6898545B2/en not_active Expired - Fee Related
-
2003
- 2003-06-27 EP EP03254101A patent/EP1376144A3/en not_active Withdrawn
- 2003-06-27 TW TW092117608A patent/TWI292540B/zh not_active IP Right Cessation
- 2003-06-30 JP JP2003187735A patent/JP2004072093A/ja active Pending
-
2005
- 2005-01-04 US US11/028,823 patent/US7035752B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1376144A2 (en) | 2004-01-02 |
| EP1376144A3 (en) | 2006-01-18 |
| US20050119852A1 (en) | 2005-06-02 |
| US6898545B2 (en) | 2005-05-24 |
| TW200406692A (en) | 2004-05-01 |
| US7035752B2 (en) | 2006-04-25 |
| US20040002829A1 (en) | 2004-01-01 |
| JP2004072093A (ja) | 2004-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |