JP2004034319A - 積層板の切断方法及びその切断方法に使用するハーフカット装置 - Google Patents

積層板の切断方法及びその切断方法に使用するハーフカット装置 Download PDF

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Publication number
JP2004034319A
JP2004034319A JP2002190355A JP2002190355A JP2004034319A JP 2004034319 A JP2004034319 A JP 2004034319A JP 2002190355 A JP2002190355 A JP 2002190355A JP 2002190355 A JP2002190355 A JP 2002190355A JP 2004034319 A JP2004034319 A JP 2004034319A
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JP
Japan
Prior art keywords
cutting
cut
laminated
laminated plate
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002190355A
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English (en)
Japanese (ja)
Other versions
JP2004034319A5 (zh
Inventor
Hisashi Yasota
八十田　寿
Takashi Tsuchida
土田　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UHT Corp
Original Assignee
UHT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UHT Corp filed Critical UHT Corp
Priority to JP2002190355A priority Critical patent/JP2004034319A/ja
Priority to TW092117047A priority patent/TWI232797B/zh
Priority to CNB031484778A priority patent/CN1280074C/zh
Priority to KR1020030042313A priority patent/KR100621453B1/ko
Publication of JP2004034319A publication Critical patent/JP2004034319A/ja
Publication of JP2004034319A5 publication Critical patent/JP2004034319A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
JP2002190355A 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置 Pending JP2004034319A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002190355A JP2004034319A (ja) 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置
TW092117047A TWI232797B (en) 2002-06-28 2003-06-24 Process for cutting laminate boards and half-cutting device used in the process
CNB031484778A CN1280074C (zh) 2002-06-28 2003-06-27 层叠板的切断方法及该切断方法所使用的半切装置
KR1020030042313A KR100621453B1 (ko) 2002-06-28 2003-06-27 적층판의 절단방법 및 그 절단방법에 사용하는 하프커트장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002190355A JP2004034319A (ja) 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置

Publications (2)

Publication Number Publication Date
JP2004034319A true JP2004034319A (ja) 2004-02-05
JP2004034319A5 JP2004034319A5 (zh) 2005-05-26

Family

ID=31700292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002190355A Pending JP2004034319A (ja) 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置

Country Status (4)

Country Link
JP (1) JP2004034319A (zh)
KR (1) KR100621453B1 (zh)
CN (1) CN1280074C (zh)
TW (1) TWI232797B (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006181704A (ja) * 2004-12-28 2006-07-13 Uht Corp 切断加工方法及び切断加工装置並びにその切断加工装置に使用するワーク支持構造
JP2009274322A (ja) * 2008-05-14 2009-11-26 Univ Of Fukui 異形湾曲押出成形品の製造方法およびその製造装置
CN102438399A (zh) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
KR101317876B1 (ko) * 2010-12-13 2013-10-16 미쓰보시 다이야몬도 고교 가부시키가이샤 접합 기판의 분단 방법
CN105618857A (zh) * 2016-03-28 2016-06-01 胜宏科技（惠州）股份有限公司 一种pcb内斜边制作方法
KR101711451B1 (ko) * 2015-10-05 2017-03-02 양승철 나이프 가공에 의한 프리커팅라인 형성장치
CN108135087A (zh) * 2018-02-05 2018-06-08 江西景旺精密电路有限公司 一种多层pcb大板层压后自动分板的方法
CN113400383A (zh) * 2021-07-09 2021-09-17 石华 一种改性沥青防水卷材生产工艺

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101160021B (zh) * 2007-10-31 2010-11-10 无锡凯尔科技有限公司 印刷线路板拼板的整板裁切装置及其裁切方法
KR20110119663A (ko) * 2008-12-23 2011-11-02 트렐레보르그 루보레 에이비 다층 플레이트 구조를 통해 부분적으로 절삭 라인을 형성하는 방법
CN104028824B (zh) * 2014-06-16 2017-02-15 惠州华阳通用电子有限公司 一种剪断式pcb分板机
CN105174180B (zh) * 2015-09-24 2018-05-01 山东新华医疗器械股份有限公司 塑料安瓿旋转式割缝机构
CN105818177A (zh) * 2016-04-29 2016-08-03 英拓自动化机械（深圳）有限公司 电路板裁切刀具及其裁切电路板的方法
JP6177412B1 (ja) * 2016-11-22 2017-08-09 株式会社ソディック 積層造形装置
CN108040431B (zh) * 2017-12-11 2020-01-07 吉安满坤科技股份有限公司 一种沉铜前锣槽的加工方法
IT201800003287A1 (it) * 2018-03-05 2019-09-05 V Shapes S R L Stazione di incisione per macchina confezionatrice e relativo metodo di incisione
TWI659790B (zh) * 2018-10-24 2019-05-21 得力富企業股份有限公司 Multiple half cutting tool set
CN114670271A (zh) * 2022-04-06 2022-06-28 林州致远电子科技有限公司 一种pcb覆铜板加工切割一体机

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006181704A (ja) * 2004-12-28 2006-07-13 Uht Corp 切断加工方法及び切断加工装置並びにその切断加工装置に使用するワーク支持構造
KR101310693B1 (ko) * 2004-12-28 2013-09-25 유에이치티 가부시키가이샤 절단가공장치
JP2009274322A (ja) * 2008-05-14 2009-11-26 Univ Of Fukui 異形湾曲押出成形品の製造方法およびその製造装置
KR101317876B1 (ko) * 2010-12-13 2013-10-16 미쓰보시 다이야몬도 고교 가부시키가이샤 접합 기판의 분단 방법
CN102438399A (zh) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
CN102438399B (zh) * 2011-09-30 2014-08-06 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
KR101711451B1 (ko) * 2015-10-05 2017-03-02 양승철 나이프 가공에 의한 프리커팅라인 형성장치
CN105618857A (zh) * 2016-03-28 2016-06-01 胜宏科技（惠州）股份有限公司 一种pcb内斜边制作方法
CN108135087A (zh) * 2018-02-05 2018-06-08 江西景旺精密电路有限公司 一种多层pcb大板层压后自动分板的方法
CN113400383A (zh) * 2021-07-09 2021-09-17 石华 一种改性沥青防水卷材生产工艺

Also Published As

Publication number Publication date
CN1280074C (zh) 2006-10-18
KR100621453B1 (ko) 2006-09-13
KR20040002757A (ko) 2004-01-07
TW200402354A (en) 2004-02-16
TWI232797B (en) 2005-05-21
CN1480304A (zh) 2004-03-10

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