JP2004022936A - 半導体ウエーハの分割方法および分割装置 - Google Patents

半導体ウエーハの分割方法および分割装置 Download PDF

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Publication number
JP2004022936A
JP2004022936A JP2002178182A JP2002178182A JP2004022936A JP 2004022936 A JP2004022936 A JP 2004022936A JP 2002178182 A JP2002178182 A JP 2002178182A JP 2002178182 A JP2002178182 A JP 2002178182A JP 2004022936 A JP2004022936 A JP 2004022936A
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JP
Japan
Prior art keywords
semiconductor wafer
street
laser beam
dividing
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002178182A
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English (en)
Japanese (ja)
Other versions
JP2004022936A5 (https=
Inventor
Yusuke Nagai
永井　祐介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2002178182A priority Critical patent/JP2004022936A/ja
Priority to AU2003242168A priority patent/AU2003242168A1/en
Priority to US10/485,776 priority patent/US20050054179A1/en
Priority to EP03730872A priority patent/EP1422750B1/en
Priority to PCT/JP2003/007326 priority patent/WO2004001827A1/ja
Priority to DE60333533T priority patent/DE60333533D1/de
Priority to KR10-2004-7002054A priority patent/KR20050009272A/ko
Publication of JP2004022936A publication Critical patent/JP2004022936A/ja
Publication of JP2004022936A5 publication Critical patent/JP2004022936A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K23/00—Alumino-thermic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2002178182A 2002-06-19 2002-06-19 半導体ウエーハの分割方法および分割装置 Pending JP2004022936A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002178182A JP2004022936A (ja) 2002-06-19 2002-06-19 半導体ウエーハの分割方法および分割装置
AU2003242168A AU2003242168A1 (en) 2002-06-19 2003-06-10 Method and apparatus for splitting semiconducor wafer
US10/485,776 US20050054179A1 (en) 2002-06-19 2003-06-10 Method and apparatus for splitting semiconductor wafer
EP03730872A EP1422750B1 (en) 2002-06-19 2003-06-10 Method and apparatus for splitting semiconducor wafer
PCT/JP2003/007326 WO2004001827A1 (ja) 2002-06-19 2003-06-10 半導体ウエーハの分割方法および分割装置
DE60333533T DE60333533D1 (de) 2002-06-19 2003-06-10 Verfahren und vorrichtung zum splitten eines halbleiter-wafers
KR10-2004-7002054A KR20050009272A (ko) 2002-06-19 2003-06-10 반도체 웨이퍼의 분할방법 및 분할장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002178182A JP2004022936A (ja) 2002-06-19 2002-06-19 半導体ウエーハの分割方法および分割装置

Publications (2)

Publication Number Publication Date
JP2004022936A true JP2004022936A (ja) 2004-01-22
JP2004022936A5 JP2004022936A5 (https=) 2004-12-24

Family

ID=29996510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002178182A Pending JP2004022936A (ja) 2002-06-19 2002-06-19 半導体ウエーハの分割方法および分割装置

Country Status (7)

Country Link
US (1) US20050054179A1 (https=)
EP (1) EP1422750B1 (https=)
JP (1) JP2004022936A (https=)
KR (1) KR20050009272A (https=)
AU (1) AU2003242168A1 (https=)
DE (1) DE60333533D1 (https=)
WO (1) WO2004001827A1 (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238246A (ja) * 2004-02-24 2005-09-08 Towa Corp 切断装置及び切断方法
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP2005353935A (ja) * 2004-06-14 2005-12-22 Disco Abrasive Syst Ltd ウエーハの加工方法
WO2006051861A1 (ja) * 2004-11-12 2006-05-18 Hamamatsu Photonics K.K. レーザ加工方法
JP2006173462A (ja) * 2004-12-17 2006-06-29 Disco Abrasive Syst Ltd ウェーハの加工装置
JP2008109015A (ja) * 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd ウエーハの分割方法および分割装置
JP2010064125A (ja) * 2008-09-12 2010-03-25 Disco Abrasive Syst Ltd レーザー加工装置
DE102017222478A1 (de) 2016-12-13 2018-06-14 Disco Corporation Laserbearbeitungsvorrichtung
DE102017222477A1 (de) 2016-12-13 2018-06-14 Disco Corporation Laserbearbeitungsvorrichtung
JP2018107330A (ja) * 2016-12-27 2018-07-05 株式会社ディスコ パッケージデバイスチップの製造方法及び加工装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US20060091126A1 (en) * 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
JP4354262B2 (ja) * 2003-12-08 2009-10-28 株式会社ディスコ レーザー加工された変質層の確認方法
JP2006059839A (ja) * 2004-08-17 2006-03-02 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
KR20060115046A (ko) * 2005-05-04 2006-11-08 주식회사 젯텍 웨이퍼의 분할 방법 및 장치
JP4694900B2 (ja) * 2005-06-28 2011-06-08 株式会社ディスコ レーザー加工方法
WO2007055010A1 (ja) * 2005-11-10 2007-05-18 Renesas Technology Corp. 半導体装置の製造方法および半導体装置
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing
KR100825798B1 (ko) * 2006-12-29 2008-04-28 삼성전자주식회사 다이싱 방법
SG148902A1 (en) * 2007-07-09 2009-01-29 Generic Power Pte Ltd Die ejector with illuminating unit
US8455332B2 (en) * 2009-05-01 2013-06-04 Bridgelux, Inc. Method and apparatus for manufacturing LED devices using laser scribing
KR20120016931A (ko) * 2010-08-17 2012-02-27 (주)큐엠씨 기판가공장치 및 기판가공방법
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP6328513B2 (ja) * 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法
JP7083654B2 (ja) * 2018-02-05 2022-06-13 株式会社ディスコ 分割予定ラインの検出方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114347A (en) * 1977-12-07 1978-10-05 Toshiba Corp Working method for semiconductor device
JPS5553437A (en) * 1978-10-14 1980-04-18 Mitsubishi Electric Corp Semiconductor wafer dividing method and its apparatus
JPH0775955A (ja) * 1993-06-17 1995-03-20 Disco Abrasive Syst Ltd 精密切削装置
JP3816147B2 (ja) * 1996-06-07 2006-08-30 ローム株式会社 基板分割方法
JP3813692B2 (ja) * 1997-05-28 2006-08-23 株式会社ディスコ ダイシング装置における半導体ウェーハ内部の特殊なパターンの検出方法
US6271102B1 (en) * 1998-02-27 2001-08-07 International Business Machines Corporation Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
JP3816253B2 (ja) * 1999-01-19 2006-08-30 富士通株式会社 半導体装置の製造方法
US6309943B1 (en) * 2000-04-25 2001-10-30 Amkor Technology, Inc. Precision marking and singulation method
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
WO2002024396A1 (en) * 2000-09-20 2002-03-28 Electro Scientific Industries, Inc. Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
US6720522B2 (en) * 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
US6399463B1 (en) * 2001-03-01 2002-06-04 Amkor Technology, Inc. Method of singulation using laser cutting

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238246A (ja) * 2004-02-24 2005-09-08 Towa Corp 切断装置及び切断方法
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP2005353935A (ja) * 2004-06-14 2005-12-22 Disco Abrasive Syst Ltd ウエーハの加工方法
US7939430B2 (en) 2004-11-12 2011-05-10 Hamamatsu Photonics K.K. Laser processing method
WO2006051861A1 (ja) * 2004-11-12 2006-05-18 Hamamatsu Photonics K.K. レーザ加工方法
JP2006140354A (ja) * 2004-11-12 2006-06-01 Hamamatsu Photonics Kk レーザ加工方法
KR101283294B1 (ko) * 2004-11-12 2013-07-11 하마마츠 포토닉스 가부시키가이샤 레이저 가공 방법
JP2006173462A (ja) * 2004-12-17 2006-06-29 Disco Abrasive Syst Ltd ウェーハの加工装置
US7687373B2 (en) 2006-10-27 2010-03-30 Disco Corporation Wafer dividing method and apparatus
JP2008109015A (ja) * 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd ウエーハの分割方法および分割装置
JP2010064125A (ja) * 2008-09-12 2010-03-25 Disco Abrasive Syst Ltd レーザー加工装置
KR20180068286A (ko) 2016-12-13 2018-06-21 가부시기가이샤 디스코 레이저 가공 장치
DE102017222477A1 (de) 2016-12-13 2018-06-14 Disco Corporation Laserbearbeitungsvorrichtung
KR20180068285A (ko) 2016-12-13 2018-06-21 가부시기가이샤 디스코 레이저 가공 장치
DE102017222478A1 (de) 2016-12-13 2018-06-14 Disco Corporation Laserbearbeitungsvorrichtung
CN108213725A (zh) * 2016-12-13 2018-06-29 株式会社迪思科 激光加工装置
US10695862B2 (en) 2016-12-13 2020-06-30 Disco Corporation Laser processing apparatus
US10717155B2 (en) 2016-12-13 2020-07-21 Disco Corporation Laser processing apparatus
CN108213725B (zh) * 2016-12-13 2021-07-09 株式会社迪思科 激光加工装置
DE102017222478B4 (de) 2016-12-13 2022-06-02 Disco Corporation Laserbearbeitungsvorrichtung
JP2018107330A (ja) * 2016-12-27 2018-07-05 株式会社ディスコ パッケージデバイスチップの製造方法及び加工装置

Also Published As

Publication number Publication date
US20050054179A1 (en) 2005-03-10
EP1422750B1 (en) 2010-07-28
WO2004001827A1 (ja) 2003-12-31
AU2003242168A1 (en) 2004-01-06
DE60333533D1 (de) 2010-09-09
KR20050009272A (ko) 2005-01-24
EP1422750A1 (en) 2004-05-26
EP1422750A4 (en) 2006-05-03

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