JPS53114347A - Working method for semiconductor device - Google Patents

Working method for semiconductor device

Info

Publication number
JPS53114347A
JPS53114347A JP14608677A JP14608677A JPS53114347A JP S53114347 A JPS53114347 A JP S53114347A JP 14608677 A JP14608677 A JP 14608677A JP 14608677 A JP14608677 A JP 14608677A JP S53114347 A JPS53114347 A JP S53114347A
Authority
JP
Japan
Prior art keywords
semiconductor device
working method
pellets
split
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14608677A
Other languages
Japanese (ja)
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14608677A priority Critical patent/JPS53114347A/en
Publication of JPS53114347A publication Critical patent/JPS53114347A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To split-work an opaque semiconductor substrate into pellets by irradiating laser beams upon it from the reverse surface of the element-formation surface of it.
JP14608677A 1977-12-07 1977-12-07 Working method for semiconductor device Pending JPS53114347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14608677A JPS53114347A (en) 1977-12-07 1977-12-07 Working method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14608677A JPS53114347A (en) 1977-12-07 1977-12-07 Working method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53114347A true JPS53114347A (en) 1978-10-05

Family

ID=15399800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14608677A Pending JPS53114347A (en) 1977-12-07 1977-12-07 Working method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53114347A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001827A1 (en) * 2002-06-19 2003-12-31 Disco Corporation Method and apparatus for splitting semiconducor wafer
JP2004343008A (en) * 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd Workpiece dividing method utilizing laser beam
JP2004349623A (en) * 2003-05-26 2004-12-09 Disco Abrasive Syst Ltd Partitioning method of nonmetallic substrate
JP2005086160A (en) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd Method of working wafer
JP2005150537A (en) * 2003-11-18 2005-06-09 Disco Abrasive Syst Ltd Method and device for working plate-shaped object
JP2006140355A (en) * 2004-11-12 2006-06-01 Hamamatsu Photonics Kk Laser processing method and semiconductor chip
DE102004029093B4 (en) * 2003-06-26 2010-11-25 Disco Corp. Semiconductor wafer dividing method using a laser beam
DE102004043475B4 (en) * 2003-09-11 2011-01-20 Disco Corp. Wafer processing method
JP2011161477A (en) * 2010-02-09 2011-08-25 Disco Abrasive Syst Ltd Ablation machining method
CN102398113A (en) * 2010-09-13 2012-04-04 株式会社迪思科 Laser beam processing device
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838978A (en) * 1971-09-20 1973-06-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838978A (en) * 1971-09-20 1973-06-08

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method
WO2004001827A1 (en) * 2002-06-19 2003-12-31 Disco Corporation Method and apparatus for splitting semiconducor wafer
JP2004343008A (en) * 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd Workpiece dividing method utilizing laser beam
JP4494728B2 (en) * 2003-05-26 2010-06-30 株式会社ディスコ Non-metallic substrate division method
JP2004349623A (en) * 2003-05-26 2004-12-09 Disco Abrasive Syst Ltd Partitioning method of nonmetallic substrate
DE102004029093B4 (en) * 2003-06-26 2010-11-25 Disco Corp. Semiconductor wafer dividing method using a laser beam
JP2005086160A (en) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd Method of working wafer
DE102004043475B4 (en) * 2003-09-11 2011-01-20 Disco Corp. Wafer processing method
DE102004043474B4 (en) * 2003-09-11 2011-07-07 Disco Corp. Wafer processing method
JP2005150537A (en) * 2003-11-18 2005-06-09 Disco Abrasive Syst Ltd Method and device for working plate-shaped object
JP2006140355A (en) * 2004-11-12 2006-06-01 Hamamatsu Photonics Kk Laser processing method and semiconductor chip
US8143141B2 (en) 2004-11-12 2012-03-27 Hamamatsu Photonics K.K. Laser beam machining method and semiconductor chip
JP2011161477A (en) * 2010-02-09 2011-08-25 Disco Abrasive Syst Ltd Ablation machining method
CN102398113A (en) * 2010-09-13 2012-04-04 株式会社迪思科 Laser beam processing device

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