CN102398113A - Laser beam processing device - Google Patents

Abstract

The present invention provides a laser processing device capable of efficiently removing a portion to be processed of a functional layer formed on a transparent substrate from a transparent substrate. This laser processing device is provided with: a jet plate (2) non-contactly supporting a solar cell substrate (8) having a functional layer (82) laminated on a glass substrate (81); a laser beam irradiation member ( 5); the laser oscillator (53) that oscillates the laser beam; and the objective lens (51), the objective lens (51) makes the oscillating laser beam align the transparent substrate (81) with the focus point from the transparent substrate (81) side to the transparent substrate (81) and The laser beam is focused on the interface of the functional layer (82), and the laser processing device processes and feeds the solar cell substrate (8) relative to the laser beam irradiation member (5).

Description

Laser processing device

technical field

The present invention relates to a laser processing device, and more specifically, to a laser processing device for processing a functional layer formed on a transparent substrate with a laser.

Background technique

For example, a solar cell substrate has functional layers in which a transparent electrode layer, a solar cell layer, and a back electrode layer are sequentially laminated on a transparent substrate such as a glass substrate. In the manufacturing process of such a solar cell substrate, it is necessary to form a plurality of separation grooves (processing lines) in the functional layer for the purpose of insulation treatment.

As a processing technique for such a solar cell substrate, a method for forming each processing line with high precision so that adjacent processing lines do not intersect each other is known (for example, refer to Patent Document 1). In the manufacturing process of such a solar cell substrate, the laser processing apparatus for removing the functional layer is configured to directly irradiate the functional layer with a laser beam.

Patent Document 1: Japanese Patent Laid-Open No. 2004-170455

However, in the above-mentioned laser processing apparatus, the functional layer is directly irradiated with a laser beam. In order to evaporate all the parts from the surface of the functional layer to the interface with the glass substrate at a high temperature, very high energy is required. There is a possibility of breaking a glass substrate. Therefore, it is necessary to finely adjust the intensity of the laser beam of the laser processing apparatus, etc., and there is a problem that the portion to be processed of the functional layer cannot be efficiently removed from the glass substrate.

Contents of the invention

The present invention has been made in view of the above, and an object of the present invention is to provide a laser processing apparatus capable of efficiently removing from a transparent substrate a portion to be processed of a functional layer formed on a transparent substrate.

According to the present invention, there is provided a laser processing apparatus comprising: a non-contact support member for non-contact support of a workpiece composed of a transparent substrate and a functional film laminated on the transparent substrate; an irradiating member that irradiates a laser beam to a workpiece supported by the non-contact supporting member, the laser beam irradiating member having a laser oscillator that oscillates a laser beam, and an objective lens condensing the laser beam oscillated from the laser oscillator so that the condensed point is aligned with the interface between the transparent substrate and the functional film from the side of the transparent substrate; processing feed member, the processing feed means for processing and feeding a workpiece relative to the laser beam irradiating means; and a processing waste attracting means for heating the functional film by irradiation of the laser beam from the laser beam irradiating means The chip suction member is arranged on the side of the functional film of the workpiece so as to face the objective lens.

According to the present invention, the part to be processed of the functional layer formed on the transparent substrate can be efficiently removed from the transparent substrate.

Description of drawings

FIG. 1 is a perspective view showing a laser processing apparatus according to a first embodiment of the present invention.

Fig. 2 is a sectional view taken along line II-II of Fig. 1 .

3 is a plan view of main parts showing the upper surface of the stand of the laser processing apparatus according to the first embodiment.

4-1 is an explanatory cross-sectional view showing a state where laser beam irradiation is started from the glass substrate side of the solar cell substrate.

4-2 is an explanatory cross-sectional view showing a state where a functional layer of a solar cell substrate is removed at a portion to be processed.

5 is a perspective view showing a laser processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a VI-VI sectional view of FIG. 5 .

Label description

1: stand;

2: jet board;

5: The laser beam irradiates the component;

6: machining chips attracting member;

7: Processing feed components;

8: Solar cell substrate;

51: objective lens;

53: Laser oscillator.

Detailed ways

Next, laser processing apparatuses according to embodiments of the present invention will be described with reference to the drawings. However, it should be noted that the drawings are only schematic, and the thickness of the components and the substrate and the ratio of other dimensions are different from the actual situation. In addition, the relationship and the ratio of the mutual dimension also contain the part which differs among drawings.

(first embodiment)

1 to 3 show the configuration of a laser processing apparatus 100 according to the first embodiment of the present invention. In this embodiment, a solar cell substrate 8 is used as a workpiece. In the solar cell substrate 8 , a functional layer 82 is formed on a glass substrate 81 which is a transparent substrate. The case where the laser processing apparatus 100 of this embodiment is applied to remove the functional layer 82 along the planned processing line of the solar cell substrate 8 to form separation grooves will be described, but the workpiece is not limited to the solar cell substrate.

As shown in FIG. 1 , the laser processing device 100 of the present embodiment is roughly composed of the following parts: a table-shaped stand 1; an air jet plate 2 as a supporting member, the air jet plate 2 is arranged on the stand 1, to support the solar cell substrate 8 in a non-contact manner; the processing chip attracting member mounting frame 4; the laser beam irradiation member 5; the processing chip attracting member 6; and the processing feeding member 7 for conveying in the x direction The solar cell substrate 8 floated by blowing air on the blowing plate 2 .

As shown in FIGS. 1 and 2 , the platform 1 is a substantially box-shaped body having a cuboid shape with a top plate 1A. On both sides of the upper surface of the top plate 1A in the y direction, a pair of guide rails 11 extend parallel to each other in the x direction. Between each pair of guide rails 11 , 11 , ball screws 31 are respectively arranged along the x direction. At one end portion of the ball screw 31 in the x direction, the motor 3 for driving the ball screw 31 to rotate is provided on the upper surface 1A. In addition, the other end portion of the ball screw 31 in the x direction is rotatably supported by a rotary bearing 32 . In addition, the rotary bearing 32 supports the ball screw 31 so as not to be displaced in the x direction.

As shown in FIG. 2 , a moving block 72 is screwed to the ball screw 31 , and the moving block 72 moves as the ball screw 31 rotates. The moving block 72 is fixed to the support arm 71 . The support arms 71 are formed to support both sides in the y direction of the solar cell substrate 8 supported by the jet plate 2 in a non-contact manner. Front and rear support portions 73 protruding inward in the y-direction are formed at both end portions of the support arm 71 in the x-direction.

As shown in FIG. 3 , a slit 1B is formed at the center of the top plate 1A of the gantry 1 over substantially the entire width in the y direction, and the laser beam irradiation member 5 including the objective lens 51 is disposed in the slit 1B.

In addition, as shown in FIGS. 1 and 2 , jet plate 2 disposed on top plate 1A of stand 1 has a width approximately equal to the width in the y direction of solar cell substrate 8 supported in a non-contact manner. In addition, the length of the jet plate 2 in the x direction is set to be about twice the length of the solar cell substrate 8 in the x direction in the present embodiment. As shown in FIGS. 1 and 3 , a slit 22 whose length extends over substantially the entire width in the y-direction is formed at the central portion in the x-direction of the jet plate 2 . The slit 22 is arranged so as to substantially overlap the slit 1B formed in the top plate 1A of the stand 1 . Therefore, the laser beam irradiation member 5 is disposed in a slit space that communicates the slit 1B formed in the top plate 1A of the stage 1 and the slit 22 of the jet plate 2 .

As shown in FIGS. 1 and 2 , the interior of the air injection plate 2 is hollow, and a large number of air injection holes 21 are substantially evenly arranged on the upper plate 2A. Then, air is supplied at a predetermined pressure into the inner space of the air injection plate 2 from an air supply device (not shown) so that the air is ejected from each air injection hole 21 at a predetermined pressure.

As shown in FIG. 2 , the laser beam irradiating member 5 is set so that when the solar cell substrate 8 is supported by the jet plate 2 in a non-contact manner with the glass substrate 81 facing downward, the single beam in the figure formed by the objective lens 51 The condensing point of the laser beam shown by the dashed-dotted line is located in the vicinity of the interface between the glass substrate 81 and the functional layer 82 . In addition, as shown in FIG. 2 , each laser beam irradiation member 5 is connected to a laser oscillator 53 via an optical fiber 52 .

In addition, the laser beam irradiation member 5 is formed to be movable in the y direction in the communicating slit space between the slit 1B and the slit 22 described above by an unillustrated slide drive mechanism. In addition, in this first embodiment, as shown in FIGS. 1 and 3 , two laser beam irradiation members 5 are provided. In addition, the two laser beam irradiating members 5 may be configured to be separately driven by a separate slide drive mechanism (not shown), or may be configured to integrally maintain a predetermined distance between the two laser beam irradiating members 5 . to drive.

As shown in FIG. 1 , the chip suction member mounting frame 4 is constituted by a pair of pillar portions 41 extending from the side of the stand 1 on the side of the slit 1B formed in the top plate 1A of the stand 1 . erected; and a first beam portion 42 and a second beam portion 43 spanning between upper portions of the pillar portions 41 . Between the first beam portion 42 and the second beam portion 43 is provided an attraction member slide drive mechanism (not shown).

As shown in FIGS. 1 and 2 , the machining chip suction member 6 includes: a cover portion 61 that opens downward to suck from the lower opening; The upper part of the mounting portion 62 is integrally provided in communication with the cover portion 61 , and the mounting portion 62 is slidably driven in the y direction by an unillustrated attraction member sliding drive mechanism provided between the first beam portion 42 and the second beam portion 43 . Moreover, the attachment part 62 is connected so that it may communicate with the suction device which is not shown in figure. In addition, a flexible tube or the like may be used as a means for communicating the attaching portion 62 with an unillustrated suction device. In addition, the suction member slide drive mechanism (not shown) is set so that the sliding operation of the machining waste suction member 6 and the slide drive of the laser beam irradiation member 5 are performed in synchronization.

Next, the function and operation of the laser processing apparatus 100 according to the first embodiment configured as above will be described.

First, air at a predetermined pressure is supplied into the air injection plate 2 , and the air at a predetermined pressure is ejected from each air injection hole 21 . Next, as shown in FIG. 1 , the solar cell substrate 8 is arranged between the support arms 71 of the pair of processing feed members 7 provided on both sides in the y direction so that the glass substrate 81 is located on the lower side. As a result, solar cell substrate 8 floats up to a predetermined height by the pressure of the air. Here, since a large number of gas injection holes 21 are uniformly arranged under the solar cell substrate 8 , it is possible to prevent the solar cell substrate 8 from being warped or tilted.

At this time, the front and rear support portions 73 , 73 of the moving support arm 71 abut against the ends in the front and rear direction (x direction) of both sides of the solar cell substrate 8 . Therefore, when the drive motor 3 is rotated to move the support arm 71 in the x direction together with the moving block 72 , the solar cell substrate 8 does not vibrate between the support arm 71 and the support arm 71 . In addition, when arranging or taking out the solar cell substrate 8 between the support arms 71 , for example, a robot or a conveying means such as a conveyor system can be used.

And, when processing the scheduled processing portion (scheduled processing line) S of the solar cell substrate 8 along the y direction, the processing feeding member 7 is used to perform position control so that the scheduled processing portion S of the solar cell substrate 8 is positioned at the gas injection plate 2 above the slit 22. Next, the laser beam irradiation member 5 and the machining waste suction member 6 are synchronously moved in the y direction while they are in operation. When processing other scheduled processing parts S along the y direction, the processing feeding member 7 is controlled so that the next processing scheduled processing part S is located above the slit 22 .

Further, when processing the planned processing portion S of the solar cell substrate 8 in the x direction, first, the positions of the laser beam irradiation member 5 and the processing chip suction member 6 are adjusted to the positions of the processing scheduled portion S in the x direction. Then, by moving the machining feed member 7 in the x direction at a predetermined speed, machining of the portion S to be machined along the x direction can be performed. By performing the processing in the x direction and the y direction in this way, the separation processing of the functional layer 82 of the solar cell substrate 8 is completed.

After the processing by the laser processing apparatus 10 is completed, the solar cell substrate 8 is carried out by the reverse operation to that of carrying in and arranging the solar cell substrate 8 . In addition, the arrangement position and the carrying-out position of the solar cell substrate 8 may be the same position or different positions.

In this embodiment, the laser beam is irradiated from the side of the glass substrate 81 (shown by a single dotted line), and the laser beam is focused near the interface between the glass substrate 81 and the functional layer 82. Therefore, first, as shown in FIG. 4- 1, the portion of the functional layer 82 in the portion S to be processed that is in contact with the glass substrate 81 rapidly expands and vaporizes, and a cavity portion 82A with a relatively high pressure is formed instantaneously. In addition, the thickness of the functional layer 82 formed on the solar cell substrate 8 is, for example, about 2 to 3 μm.

Next, it is not necessary to heat the entire portion S of the functional layer 82 to be processed with a laser beam. As shown in FIG. At this time, since the machining waste 82B is sucked by the machining waste suction member 6, the machining of the portion S to be machined can be advanced efficiently without splashing the machining waste 82B. In this way, in this embodiment, the entire portion to be processed S of the functional layer 82 does not need to be heated with a laser beam, so energy-saving processing can be performed, and the amount of heating is small, so there is no need to worry about damaging the glass substrate 81 . In addition, since it is not necessary to evaporate all the functional layer 82 of the portion S to be processed, high-speed processing can be performed. Furthermore, according to the present embodiment, laser light with low output can also be used.

The laser processing apparatus 100 according to the present embodiment has been described above. In the present embodiment, a part of the functional layer 82 (part to be processed S) of the solar cell substrate 8 can be efficiently removed from the glass substrate 81 . In particular, in this embodiment, since two pairs of the laser beam irradiation member 5 and the processing waste suction member 6 are provided, the processing speed of one solar cell substrate 8 can be increased.

In addition, in this embodiment, since the solar cell substrate 8 is supported non-contact by jetting air from a large number of jet holes 21 uniformly formed in the jet plate 2 , it is possible to prevent the solar cell substrate 8 from being warped and tilted. Therefore, the irradiation position of the laser beam spot is more accurate, and high-precision processing can be performed.

(second embodiment)

Next, 100 A of laser processing apparatuses concerning 2nd Embodiment of this invention are demonstrated using FIG.5 and FIG.6.

The laser processing apparatus 100A according to this embodiment is characterized in that an upper side air injection plate 9 having a rectangular shape shorter in the x direction than the air injection plate 2 is provided above the air injection plate 2 . In addition, the other configurations of the laser processing apparatus 100A according to this embodiment are substantially the same as those of the laser processing apparatus 100 according to the above-mentioned first embodiment, and the same reference numerals are assigned to the same parts, and descriptions of the configurations are omitted.

As shown in FIG. 6 , the upper air injection plate 9 has substantially the same structure as the air injection plate 2 arranged on the lower side, and an air injection hole 91 is formed in a lower plate 9A of the upper air injection plate 9 . In addition, the upper air injection plate 9 is set to be shorter in the x direction than the air injection plate 2 , and as shown in FIG. 5 , the upper air injection plate 9 is aligned with one end in the x direction. In addition, as shown in FIG. 5 , in the present embodiment, the position where the solar cell substrate 8 is loaded into the laser processing apparatus 100A is disposed close to the other end in the x direction, and the processing feeding member 7 is disposed at this position. In this state, the loading and unloading of the solar cell substrate 8 is performed.

In addition, as shown in FIG. 6 , the upper air jet plate 9 is attached to the main body of the laser processing apparatus 100A so as to maintain a predetermined interval (space size for inserting the solar cell substrate 8 ) in parallel with the air jet plate 2 disposed on the lower side. side. As shown in FIG. 5 , with the upper jet plate 9 arranged in this way, a slit 92 is formed at a position of the upper jet plate 9 corresponding to the laser beam irradiation member 5 disposed on the side of the jet plate 2 . In addition, the upper air injection plate 9 is set such that the rectangular portions on both sides in the x direction sandwiching the slit 92 have substantially the same size. In addition, each rectangular portion of the upper jet plate 9 on both sides sandwiching the slit 92 is set to a size that completely covers the solar cell substrate 8 in plan view. In the present embodiment, since it is necessary to insert the chip suction member 6A into the slit 92 of the upper air injection plate 9 , the diameter of the cover portion 61A is set to be relatively small.

According to the laser processing apparatus 100A according to the present embodiment, in addition to the effects of the first embodiment described above, even if the solar cell substrate 8 floating on the air jet plate 2 is originally warped, it is possible to use the upper air jet plate from above. 9 is pressed with air of uniform pressure, and the warpage of the solar cell substrate 8 is corrected for processing. Thereby, the converging point of the laser beam irradiated to the solar cell substrate 8 can be accurately positioned at the interface between the glass substrate 81 and the functional layer 82 , and processing can be reliably performed.

(Other implementations)

As mentioned above, although embodiment of this invention was described, this invention is not limited by the description and drawing of a part of disclosure of the said embodiment. Various alternative embodiments, examples, and applied techniques will be apparent to those skilled in the art from this disclosure.

For example, in the above-mentioned first embodiment and second embodiment, the solar cell substrate 8 is used as the workpiece for description, but for example, it is also possible to use the organic EL display panel, inorganic EL display panel, plasma display, electroluminescent display Laser processing of various workpieces with functional layers formed on the surface of transparent substrates such as panels.

In the above-mentioned first and second embodiments, the substantially box-shaped stand 1 is used, but it is not limited to this, and any structure can be arranged as long as a support structure for supporting the solar cell substrate 8 in a non-contact manner can be arranged.

In the above-mentioned first and second embodiments, the air jet plate 2 is used, but the invention is not limited thereto, and any structure can be used as long as the air jet can be uniformly jetted to the solar cell substrate 8 .

In the above-mentioned first and second embodiments, the optical fiber 52 is used, but of course, a structure in which the laser beam is transmitted to the objective lens 51 through a reflection mirror may also be adopted.

In the above-mentioned first and second embodiments, the chip suction member 6 is provided on the chip suction member mounting frame 4. However, as long as the chip suction member 6 is moved in the y direction, it is of course not possible to A structure for installing the machining chip suction member mounting frame 4 is provided.

In the above-mentioned first and second embodiments, two pairs of laser beam irradiation members 5 and machining chip suction members 6 are used, but there may be one pair, or three or more pairs.

In the above-mentioned first and second embodiments, the laser beam irradiation member 5 is arranged on the lower side, and the processing chip suction member 6 is arranged on the upper side, but conversely, the laser beam irradiation member 5 is arranged on the upper side. Arranging the chip suction member 6 on the lower side is also the scope of application of the present invention. In addition, in this case, processing may be performed by arranging the solar cell substrate 8 so that the functional layer 82 faces downward.

In the above-mentioned first and second embodiments, the support arms 71 were exemplified to support the front and rear support parts 73 on both sides of the solar cell substrate in the y direction, but they may be formed using pins or the like. A structure for clamping the solar cell substrate 8 .

Industrial availability

As described above, the laser processing apparatus according to the present invention is useful in the field of processing workpieces having transparent substrates, and is particularly suitable for the field of processing solar cell substrates.

Claims (3)

1. A laser processing device, characterized in that, The laser processing device has: a non-contact support member that supports a workpiece in a non-contact manner, the workpiece being composed of a transparent substrate and a functional film laminated on the transparent substrate; a laser beam irradiating member for irradiating a laser beam to a workpiece supported by the non-contact supporting member, the laser beam irradiating member having a laser oscillator and an objective lens, the laser oscillator oscillates a laser beam, and The objective lens condenses the laser beam oscillated from the laser oscillator so that the condensed point is aligned with the interface between the transparent substrate and the functional film from the side of the transparent substrate; a processing feeding member that processes and feeds a workpiece relatively to the laser beam irradiation member; and a machining waste attracting member for attracting machining waste generated when the functional film is heated by irradiation of the laser beam from the laser beam irradiation unit, the machining waste attracting member is opposed to the objective lens It is arranged on the side of the functional film of the workpiece. 2. The laser processing apparatus according to claim 1, wherein, The non-contact supporting member includes a first air injection plate disposed below the workpiece, the first air injection plate has a plurality of air injection holes, and the first air injection plate supports the workpiece by air ejected from the air injection holes. described artifacts. 3. The laser processing device according to claim 2, wherein, The non-contact support member further includes a second air injection plate disposed above the workpiece, and the second air injection plate has a plurality of air injection holes opening toward the workpiece.

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