SG148902A1 - Die ejector with illuminating unit - Google Patents

Die ejector with illuminating unit

Info

Publication number
SG148902A1
SG148902A1 SG200705113-9A SG2007051139A SG148902A1 SG 148902 A1 SG148902 A1 SG 148902A1 SG 2007051139 A SG2007051139 A SG 2007051139A SG 148902 A1 SG148902 A1 SG 148902A1
Authority
SG
Singapore
Prior art keywords
ejector
die
wafer
illuminating unit
die ejector
Prior art date
Application number
SG200705113-9A
Inventor
Puah Yong Joo
Brunner Johann Joset
Original Assignee
Generic Power Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generic Power Pte Ltd filed Critical Generic Power Pte Ltd
Priority to SG200705113-9A priority Critical patent/SG148902A1/en
Priority to PCT/SG2008/000241 priority patent/WO2009008839A1/en
Publication of SG148902A1 publication Critical patent/SG148902A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Abstract

DIE EJECTOR WITH ILLUMINATING UNIT The invention provides a die ejector (300) and a method for die alignment and ejection using said die ejector (300) during semiconductor packaging process. The die ejector (300) comprises an ejector housing (320), a needle holder (340), a plurality of ejector needles (360), and an illuminating unit (370). The illuminating unit (370), attached to the ejector housing (320), comprises a plurality of light sources (372) and a light reflective coating (374). The light emitted by the light sources (372) is directed by the light reflective coating (374) towards the lower side of a wafer (307) disposed on an adhesive film (303) above a wafer table (304). The image of the illuminated wafer (307) is captured by a vision inspection unit (480) located above the wafer (307), and is used for adjusting the position and orientation of the wafer before die ejection.
SG200705113-9A 2007-07-09 2007-07-09 Die ejector with illuminating unit SG148902A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit
PCT/SG2008/000241 WO2009008839A1 (en) 2007-07-09 2008-07-08 Die ejector with illuminating unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit

Publications (1)

Publication Number Publication Date
SG148902A1 true SG148902A1 (en) 2009-01-29

Family

ID=40228855

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit

Country Status (2)

Country Link
SG (1) SG148902A1 (en)
WO (1) WO2009008839A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101471773B1 (en) * 2013-06-25 2014-12-10 세메스 주식회사 Apparatus for ejecting a die
ES2832373T3 (en) 2014-09-26 2021-06-10 Ovivo Inc Algae-activated sewage digestion

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125641A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus
JP2800396B2 (en) * 1990-10-09 1998-09-21 松下電器産業株式会社 Chip observation device
JP2004022936A (en) * 2002-06-19 2004-01-22 Disco Abrasive Syst Ltd Semiconductor-wafer dividing method and semiconductor-wafer dividing apparatus
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing

Also Published As

Publication number Publication date
WO2009008839A1 (en) 2009-01-15

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