KR20050009272A - 반도체 웨이퍼의 분할방법 및 분할장치 - Google Patents

반도체 웨이퍼의 분할방법 및 분할장치 Download PDF

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Publication number
KR20050009272A
KR20050009272A KR10-2004-7002054A KR20047002054A KR20050009272A KR 20050009272 A KR20050009272 A KR 20050009272A KR 20047002054 A KR20047002054 A KR 20047002054A KR 20050009272 A KR20050009272 A KR 20050009272A
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
laser beam
street
screw rod
chuck table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7002054A
Other languages
English (en)
Korean (ko)
Inventor
나가이유스케
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20050009272A publication Critical patent/KR20050009272A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K23/00—Alumino-thermic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
KR10-2004-7002054A 2002-06-19 2003-06-10 반도체 웨이퍼의 분할방법 및 분할장치 Ceased KR20050009272A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00178182 2002-06-19
JP2002178182A JP2004022936A (ja) 2002-06-19 2002-06-19 半導体ウエーハの分割方法および分割装置
PCT/JP2003/007326 WO2004001827A1 (ja) 2002-06-19 2003-06-10 半導体ウエーハの分割方法および分割装置

Publications (1)

Publication Number Publication Date
KR20050009272A true KR20050009272A (ko) 2005-01-24

Family

ID=29996510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7002054A Ceased KR20050009272A (ko) 2002-06-19 2003-06-10 반도체 웨이퍼의 분할방법 및 분할장치

Country Status (7)

Country Link
US (1) US20050054179A1 (https=)
EP (1) EP1422750B1 (https=)
JP (1) JP2004022936A (https=)
KR (1) KR20050009272A (https=)
AU (1) AU2003242168A1 (https=)
DE (1) DE60333533D1 (https=)
WO (1) WO2004001827A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060115046A (ko) * 2005-05-04 2006-11-08 주식회사 젯텍 웨이퍼의 분할 방법 및 장치
KR100825798B1 (ko) * 2006-12-29 2008-04-28 삼성전자주식회사 다이싱 방법
KR20120016931A (ko) * 2010-08-17 2012-02-27 (주)큐엠씨 기판가공장치 및 기판가공방법
KR101223203B1 (ko) * 2005-06-28 2013-01-17 가부시기가이샤 디스코 레이저 가공방법

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US20060091126A1 (en) * 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
JP4354262B2 (ja) * 2003-12-08 2009-10-28 株式会社ディスコ レーザー加工された変質層の確認方法
JP2005238246A (ja) * 2004-02-24 2005-09-08 Towa Corp 切断装置及び切断方法
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP4890746B2 (ja) * 2004-06-14 2012-03-07 株式会社ディスコ ウエーハの加工方法
JP2006059839A (ja) * 2004-08-17 2006-03-02 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
JP4781661B2 (ja) * 2004-11-12 2011-09-28 浜松ホトニクス株式会社 レーザ加工方法
JP2006173462A (ja) * 2004-12-17 2006-06-29 Disco Abrasive Syst Ltd ウェーハの加工装置
WO2007055010A1 (ja) * 2005-11-10 2007-05-18 Renesas Technology Corp. 半導体装置の製造方法および半導体装置
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing
JP2008109015A (ja) * 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd ウエーハの分割方法および分割装置
SG148902A1 (en) * 2007-07-09 2009-01-29 Generic Power Pte Ltd Die ejector with illuminating unit
JP2010064125A (ja) * 2008-09-12 2010-03-25 Disco Abrasive Syst Ltd レーザー加工装置
US8455332B2 (en) * 2009-05-01 2013-06-04 Bridgelux, Inc. Method and apparatus for manufacturing LED devices using laser scribing
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP6328513B2 (ja) * 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法
JP2018094596A (ja) 2016-12-13 2018-06-21 株式会社ディスコ レーザー加工装置
JP6767253B2 (ja) * 2016-12-13 2020-10-14 株式会社ディスコ レーザー加工装置
JP6773554B2 (ja) * 2016-12-27 2020-10-21 株式会社ディスコ パッケージデバイスチップの製造方法及び加工装置
JP7083654B2 (ja) * 2018-02-05 2022-06-13 株式会社ディスコ 分割予定ラインの検出方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114347A (en) * 1977-12-07 1978-10-05 Toshiba Corp Working method for semiconductor device
JPS5553437A (en) * 1978-10-14 1980-04-18 Mitsubishi Electric Corp Semiconductor wafer dividing method and its apparatus
JPH0775955A (ja) * 1993-06-17 1995-03-20 Disco Abrasive Syst Ltd 精密切削装置
JP3816147B2 (ja) * 1996-06-07 2006-08-30 ローム株式会社 基板分割方法
JP3813692B2 (ja) * 1997-05-28 2006-08-23 株式会社ディスコ ダイシング装置における半導体ウェーハ内部の特殊なパターンの検出方法
US6271102B1 (en) * 1998-02-27 2001-08-07 International Business Machines Corporation Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
JP3816253B2 (ja) * 1999-01-19 2006-08-30 富士通株式会社 半導体装置の製造方法
US6309943B1 (en) * 2000-04-25 2001-10-30 Amkor Technology, Inc. Precision marking and singulation method
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
WO2002024396A1 (en) * 2000-09-20 2002-03-28 Electro Scientific Industries, Inc. Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
US6720522B2 (en) * 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
US6399463B1 (en) * 2001-03-01 2002-06-04 Amkor Technology, Inc. Method of singulation using laser cutting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060115046A (ko) * 2005-05-04 2006-11-08 주식회사 젯텍 웨이퍼의 분할 방법 및 장치
KR101223203B1 (ko) * 2005-06-28 2013-01-17 가부시기가이샤 디스코 레이저 가공방법
KR100825798B1 (ko) * 2006-12-29 2008-04-28 삼성전자주식회사 다이싱 방법
KR20120016931A (ko) * 2010-08-17 2012-02-27 (주)큐엠씨 기판가공장치 및 기판가공방법

Also Published As

Publication number Publication date
US20050054179A1 (en) 2005-03-10
EP1422750B1 (en) 2010-07-28
WO2004001827A1 (ja) 2003-12-31
AU2003242168A1 (en) 2004-01-06
DE60333533D1 (de) 2010-09-09
EP1422750A1 (en) 2004-05-26
JP2004022936A (ja) 2004-01-22
EP1422750A4 (en) 2006-05-03

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