JP2003530464A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003530464A5 JP2003530464A5 JP2001575466A JP2001575466A JP2003530464A5 JP 2003530464 A5 JP2003530464 A5 JP 2003530464A5 JP 2001575466 A JP2001575466 A JP 2001575466A JP 2001575466 A JP2001575466 A JP 2001575466A JP 2003530464 A5 JP2003530464 A5 JP 2003530464A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric constant
- low dielectric
- constant material
- material according
- reactive group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 description 23
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- ZICQBHNGXDOVJF-UHFFFAOYSA-N diamantane Chemical compound C1C2C3CC(C4)CC2C2C4C3CC1C2 ZICQBHNGXDOVJF-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000012212 insulator Substances 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- -1 arylene ether Chemical compound 0.000 description 2
- 238000006352 cycloaddition reaction Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 238000005698 Diels-Alder reaction Methods 0.000 description 1
- PLGPSDNOLCVGSS-UHFFFAOYSA-N Tetraphenylcyclopentadienone Chemical compound O=C1C(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)C(C=2C=CC=CC=2)=C1C1=CC=CC=C1 PLGPSDNOLCVGSS-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000012039 electrophile Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/545,058 US6509415B1 (en) | 2000-04-07 | 2000-04-07 | Low dielectric constant organic dielectrics based on cage-like structures |
| US09/545,058 | 2000-04-07 | ||
| PCT/US2001/011273 WO2001078110A2 (en) | 2000-04-07 | 2001-04-06 | Low dielectric constant organic dielectrics based on cage-like structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003530464A JP2003530464A (ja) | 2003-10-14 |
| JP2003530464A5 true JP2003530464A5 (enExample) | 2008-05-08 |
| JP4795607B2 JP4795607B2 (ja) | 2011-10-19 |
Family
ID=24174726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001575466A Expired - Fee Related JP4795607B2 (ja) | 2000-04-07 | 2001-04-06 | ケージ様構造を主体とする低誘電定数有機誘電体 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6509415B1 (enExample) |
| EP (1) | EP1274755B1 (enExample) |
| JP (1) | JP4795607B2 (enExample) |
| KR (1) | KR100823777B1 (enExample) |
| CN (1) | CN1227276C (enExample) |
| AT (1) | ATE386758T1 (enExample) |
| AU (1) | AU2001255248A1 (enExample) |
| DE (1) | DE60132883T2 (enExample) |
| HK (1) | HK1054398A1 (enExample) |
| WO (1) | WO2001078110A2 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020022708A1 (en) * | 2000-07-19 | 2002-02-21 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
| US6783589B2 (en) * | 2001-01-19 | 2004-08-31 | Chevron U.S.A. Inc. | Diamondoid-containing materials in microelectronics |
| WO2002081546A1 (en) * | 2001-04-06 | 2002-10-17 | Honeywell International Inc. | Low dielectric constant materials and methods of preparation thereof |
| US7141188B2 (en) * | 2001-05-30 | 2006-11-28 | Honeywell International Inc. | Organic compositions |
| US7049005B2 (en) * | 2001-05-30 | 2006-05-23 | Honeywell International Inc. | Organic compositions |
| US6740685B2 (en) * | 2001-05-30 | 2004-05-25 | Honeywell International Inc. | Organic compositions |
| US20040247896A1 (en) * | 2001-12-31 | 2004-12-09 | Paul Apen | Organic compositions |
| AU2003202905A1 (en) * | 2002-01-08 | 2003-07-24 | Honeywell International Inc. | Organic composition |
| EP1466356A2 (en) * | 2002-01-15 | 2004-10-13 | Honeywell International Inc. | Organic compositions |
| US7060204B2 (en) * | 2002-04-29 | 2006-06-13 | Honeywell International Inc. | Organic compositions |
| US6855738B2 (en) * | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
| US7488565B2 (en) * | 2003-10-01 | 2009-02-10 | Chevron U.S.A. Inc. | Photoresist compositions comprising diamondoid derivatives |
| US7208243B2 (en) * | 2004-12-01 | 2007-04-24 | Toyota Technical Center Usa, Inc. | Proton exchange membranes using cycloaddition reaction between azide and alkyne containing components |
| KR20060090483A (ko) * | 2005-02-07 | 2006-08-11 | 삼성코닝 주식회사 | 풀러렌을 포함하는 저유전 박막 형성용 조성물, 이를이용한 저유전 박막 및 저유전 박막의 제조방법 |
| US7531209B2 (en) | 2005-02-24 | 2009-05-12 | Michael Raymond Ayers | Porous films and bodies with enhanced mechanical strength |
| JP4516857B2 (ja) * | 2005-02-28 | 2010-08-04 | 富士フイルム株式会社 | カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス |
| JP2006253577A (ja) * | 2005-03-14 | 2006-09-21 | Fuji Photo Film Co Ltd | 絶縁膜、その製造方法及び該絶縁膜を有するデバイス |
| JP2006291160A (ja) * | 2005-03-14 | 2006-10-26 | Fuji Photo Film Co Ltd | 膜形成用組成物、それを用いた絶縁膜および電子デバイス |
| JP4368319B2 (ja) * | 2005-03-14 | 2009-11-18 | 富士フイルム株式会社 | 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス |
| JP2006253573A (ja) * | 2005-03-14 | 2006-09-21 | Fuji Photo Film Co Ltd | 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス |
| JP4542927B2 (ja) * | 2005-03-17 | 2010-09-15 | 富士フイルム株式会社 | 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス |
| US7432133B2 (en) * | 2005-10-24 | 2008-10-07 | Freescale Semiconductor, Inc. | Plastic packaged device with die interface layer |
| US20070090545A1 (en) * | 2005-10-24 | 2007-04-26 | Condie Brian W | Semiconductor device with improved encapsulation |
| US7435625B2 (en) * | 2005-10-24 | 2008-10-14 | Freescale Semiconductor, Inc. | Semiconductor device with reduced package cross-talk and loss |
| JP2007161779A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 膜形成用組成物 |
| ATE556118T1 (de) * | 2006-03-29 | 2012-05-15 | Sumitomo Bakelite Co | Harzzusammensetzung, lack, harzfolie und halbleitervorrichtung mit der harzfolie |
| WO2007143028A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Low dielectric constant materials prepared from soluble fullerene clusters |
| WO2007143026A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials |
| US7883742B2 (en) | 2006-05-31 | 2011-02-08 | Roskilde Semiconductor Llc | Porous materials derived from polymer composites |
| US7875315B2 (en) | 2006-05-31 | 2011-01-25 | Roskilde Semiconductor Llc | Porous inorganic solids for use as low dielectric constant materials |
| JP5134233B2 (ja) * | 2006-11-29 | 2013-01-30 | 出光興産株式会社 | アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物 |
| US20080173541A1 (en) * | 2007-01-22 | 2008-07-24 | Eal Lee | Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling |
| US20090026924A1 (en) * | 2007-07-23 | 2009-01-29 | Leung Roger Y | Methods of making low-refractive index and/or low-k organosilicate coatings |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| CN101219934B (zh) * | 2008-01-25 | 2010-06-02 | 吉林大学 | 4,8-二(1-金刚烷基)-1,5-萘二酚、制备方法及用于合成聚合物材料 |
| JPWO2012111314A1 (ja) * | 2011-02-18 | 2014-07-03 | 出光興産株式会社 | 電子素子用絶縁材料形成用組成物、電子素子用絶縁材料、電子素子及び薄膜トランジスタ |
| CN105152881B (zh) * | 2015-06-23 | 2018-06-29 | 复旦大学 | 含金刚烷与六氟环丁烷结构的苯并环丁烯单体、其制备方法及应用 |
| CN109294203B (zh) * | 2018-10-10 | 2021-04-09 | 湖南七纬科技有限公司 | 一种新能源汽车动力电池用阻燃防火材料及其制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3580964A (en) * | 1967-09-06 | 1971-05-25 | Sun Oil Co | Curable linear polyesters |
| US3795658A (en) * | 1971-12-30 | 1974-03-05 | Sun Research Development | Epoxy resins from dimethyladamantane bisphenols |
| US5019660A (en) | 1990-01-30 | 1991-05-28 | Mobil Oil Corporation | Diamondoid polymeric compositions |
| US5166313A (en) | 1991-04-29 | 1992-11-24 | Fluorochem, Inc. | Diamantane modified rigid-rod poly benzazole and method of manufacture |
| US5347063A (en) | 1993-03-09 | 1994-09-13 | Mobil Oil Corporation | Method for direct arylation of diamondoids |
| US5874516A (en) * | 1995-07-13 | 1999-02-23 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ethers) |
| JPH10130371A (ja) * | 1996-11-01 | 1998-05-19 | Nippon Kayaku Co Ltd | アダマンタン類、これらを含有する熱可塑性樹脂及びこれらを含有する熱硬化性樹脂組成物 |
| EP2256133B1 (en) * | 1997-01-08 | 2016-12-14 | Sigma-Aldrich Co. LLC | Bioconjugation of macromolecules |
| US6124421A (en) * | 1997-12-12 | 2000-09-26 | Alliedsignal Inc. | Poly(arylene ether) compositions and methods of manufacture thereof |
| US6303733B1 (en) * | 1997-12-12 | 2001-10-16 | Alliedsignal Inc. | Poly(arylene ether) homopolymer compositions and methods of manufacture thereof |
| US6172128B1 (en) * | 1999-04-09 | 2001-01-09 | Honeywell International Inc. | Nanoporous polymers crosslinked via cyclic structures |
| JP2003520864A (ja) * | 1999-04-09 | 2003-07-08 | アライドシグナル・インコーポレイテツド | ナノ多孔質薄膜構造への前駆体として架橋に用いられる反応性基を有する骨格を持ったポリマー |
| US6156812A (en) * | 1999-04-09 | 2000-12-05 | Honeywell International Inc. | Nanoporous material fabricated using polymeric template strands |
| JP4211161B2 (ja) * | 1999-11-09 | 2009-01-21 | Jsr株式会社 | ジイン含有(共)重合体、その製造方法及び硬化膜 |
| JP4325046B2 (ja) * | 1999-11-09 | 2009-09-02 | Jsr株式会社 | 膜形成用組成物、膜の形成方法、及び膜 |
| JP3442049B2 (ja) * | 2000-03-29 | 2003-09-02 | 住友ベークライト株式会社 | 耐熱性樹脂前駆体、耐熱性樹脂及び絶縁膜並びに半導体装置 |
| US6380270B1 (en) * | 2000-09-26 | 2002-04-30 | Honeywell International Inc. | Photogenerated nanoporous materials |
-
2000
- 2000-04-07 US US09/545,058 patent/US6509415B1/en not_active Expired - Fee Related
-
2001
- 2001-04-06 JP JP2001575466A patent/JP4795607B2/ja not_active Expired - Fee Related
- 2001-04-06 AT AT01928386T patent/ATE386758T1/de not_active IP Right Cessation
- 2001-04-06 CN CNB018074413A patent/CN1227276C/zh not_active Expired - Fee Related
- 2001-04-06 WO PCT/US2001/011273 patent/WO2001078110A2/en not_active Ceased
- 2001-04-06 DE DE60132883T patent/DE60132883T2/de not_active Expired - Lifetime
- 2001-04-06 HK HK03106542.7A patent/HK1054398A1/zh unknown
- 2001-04-06 KR KR1020027013423A patent/KR100823777B1/ko not_active Expired - Fee Related
- 2001-04-06 AU AU2001255248A patent/AU2001255248A1/en not_active Abandoned
- 2001-04-06 EP EP01928386A patent/EP1274755B1/en not_active Expired - Lifetime
-
2002
- 2002-11-12 US US10/293,024 patent/US6849696B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003530464A5 (enExample) | ||
| KR100823777B1 (ko) | 케이지형 구조에 기초한 저유전율 유기 유전체 | |
| TW553967B (en) | Low dielectric constant materials with polymeric networks | |
| JP2002363414A (ja) | 籠状シルセスキオキサン含有組成物 | |
| JPWO2004104097A1 (ja) | エポキシ樹脂組成物 | |
| JP2005521764A5 (enExample) | ||
| JP2004504455A5 (enExample) | ||
| KR900003679A (ko) | 저 열응력 폴리이미드 전구체 및 폴리이미드 전구체를 함유하는 광중합 가능한 조성물 | |
| JP2001093824A (ja) | レジスト下層用組成物及びパターン形成方法 | |
| EP0506432B1 (en) | Three-dimensional polysilane | |
| JP2004196958A (ja) | 架橋基含有籠状シルセスキオキサン化合物 | |
| US20020016414A1 (en) | Low dielectric constant organic dielectrics based on cage-like structures | |
| KR101145555B1 (ko) | 유기 절연 재료, 그것을 이용한 수지막용 바니시, 수지막 및 반도체 장치 | |
| KR102088868B1 (ko) | 탄소와 탄소의 다중 결합을 갖는 수지를 포함하는 패시베이션막 형성용 조성물 | |
| JP2012009796A (ja) | メタクリロキシ基もしくはアクリロキシ基を有するポリオルガノシルセスキオキサンを含む半導体絶縁膜用組成物 | |
| KR100864776B1 (ko) | 중합체, 그의 제조 방법 및 그를 함유하는 막형성용조성물, 막형성 방법 및 절연막 | |
| KR100607300B1 (ko) | 연성금속박막 적층필름의 제조방법 | |
| EP0419519A1 (en) | OLIGOMERS AND POLYMERS OF POLYIMIDE CONTAINING HEXAFLUOROISOPROPYLIDENE. | |
| JPH05320350A (ja) | シリコーン化合物 | |
| JP3562569B2 (ja) | 架橋性ケイ素系高分子組成物並びに反射防止膜用組成物及び反射防止膜 | |
| US6716958B1 (en) | Waveguide systems or structures or parts thereof, containing polycyanate copolymers prepared from polyfunctional cyanates and fluorinated monocyanates | |
| JP4542927B2 (ja) | 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス | |
| KR100584953B1 (ko) | 폴리(아미드-이미드) 유연성 절연필름을 포함하는연성금속박막 적층필름 | |
| JP3456400B2 (ja) | 架橋性ケイ素系高分子組成物 | |
| JPH10273535A (ja) | ケイ素系重合体、その製造方法及びケイ素系樹脂硬化物 |