JP4795607B2 - ケージ様構造を主体とする低誘電定数有機誘電体 - Google Patents

ケージ様構造を主体とする低誘電定数有機誘電体 Download PDF

Info

Publication number
JP4795607B2
JP4795607B2 JP2001575466A JP2001575466A JP4795607B2 JP 4795607 B2 JP4795607 B2 JP 4795607B2 JP 2001575466 A JP2001575466 A JP 2001575466A JP 2001575466 A JP2001575466 A JP 2001575466A JP 4795607 B2 JP4795607 B2 JP 4795607B2
Authority
JP
Japan
Prior art keywords
dielectric constant
cage
low dielectric
main chain
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001575466A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003530464A (ja
JP2003530464A5 (enExample
Inventor
ラウ,クライスラー
リウ,フオン・チユワン
コロリヨフ,ボリス
ブルーク,エマ
ジエレビン,ルスラン
リヨン,ロジヤー
Original Assignee
ハネウエル・インターナシヨナル・インコーポレーテツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ハネウエル・インターナシヨナル・インコーポレーテツド filed Critical ハネウエル・インターナシヨナル・インコーポレーテツド
Publication of JP2003530464A publication Critical patent/JP2003530464A/ja
Publication of JP2003530464A5 publication Critical patent/JP2003530464A5/ja
Application granted granted Critical
Publication of JP4795607B2 publication Critical patent/JP4795607B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/246Intercrosslinking of at least two polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/963Miscellaneous

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Organic Insulating Materials (AREA)
  • Rolling Contact Bearings (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Polyethers (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
JP2001575466A 2000-04-07 2001-04-06 ケージ様構造を主体とする低誘電定数有機誘電体 Expired - Fee Related JP4795607B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/545,058 US6509415B1 (en) 2000-04-07 2000-04-07 Low dielectric constant organic dielectrics based on cage-like structures
US09/545,058 2000-04-07
PCT/US2001/011273 WO2001078110A2 (en) 2000-04-07 2001-04-06 Low dielectric constant organic dielectrics based on cage-like structures

Publications (3)

Publication Number Publication Date
JP2003530464A JP2003530464A (ja) 2003-10-14
JP2003530464A5 JP2003530464A5 (enExample) 2008-05-08
JP4795607B2 true JP4795607B2 (ja) 2011-10-19

Family

ID=24174726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001575466A Expired - Fee Related JP4795607B2 (ja) 2000-04-07 2001-04-06 ケージ様構造を主体とする低誘電定数有機誘電体

Country Status (10)

Country Link
US (2) US6509415B1 (enExample)
EP (1) EP1274755B1 (enExample)
JP (1) JP4795607B2 (enExample)
KR (1) KR100823777B1 (enExample)
CN (1) CN1227276C (enExample)
AT (1) ATE386758T1 (enExample)
AU (1) AU2001255248A1 (enExample)
DE (1) DE60132883T2 (enExample)
HK (1) HK1054398A1 (enExample)
WO (1) WO2001078110A2 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020022708A1 (en) * 2000-07-19 2002-02-21 Honeywell International Inc. Compositions and methods for thermosetting molecules in organic compositions
US6783589B2 (en) * 2001-01-19 2004-08-31 Chevron U.S.A. Inc. Diamondoid-containing materials in microelectronics
WO2002081546A1 (en) * 2001-04-06 2002-10-17 Honeywell International Inc. Low dielectric constant materials and methods of preparation thereof
US7141188B2 (en) * 2001-05-30 2006-11-28 Honeywell International Inc. Organic compositions
US7049005B2 (en) * 2001-05-30 2006-05-23 Honeywell International Inc. Organic compositions
US6740685B2 (en) * 2001-05-30 2004-05-25 Honeywell International Inc. Organic compositions
US20040247896A1 (en) * 2001-12-31 2004-12-09 Paul Apen Organic compositions
AU2003202905A1 (en) * 2002-01-08 2003-07-24 Honeywell International Inc. Organic composition
EP1466356A2 (en) * 2002-01-15 2004-10-13 Honeywell International Inc. Organic compositions
US7060204B2 (en) * 2002-04-29 2006-06-13 Honeywell International Inc. Organic compositions
US6855738B2 (en) * 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7488565B2 (en) * 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US7208243B2 (en) * 2004-12-01 2007-04-24 Toyota Technical Center Usa, Inc. Proton exchange membranes using cycloaddition reaction between azide and alkyne containing components
KR20060090483A (ko) * 2005-02-07 2006-08-11 삼성코닝 주식회사 풀러렌을 포함하는 저유전 박막 형성용 조성물, 이를이용한 저유전 박막 및 저유전 박막의 제조방법
US7531209B2 (en) 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
JP4516857B2 (ja) * 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
JP2006253577A (ja) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd 絶縁膜、その製造方法及び該絶縁膜を有するデバイス
JP2006291160A (ja) * 2005-03-14 2006-10-26 Fuji Photo Film Co Ltd 膜形成用組成物、それを用いた絶縁膜および電子デバイス
JP4368319B2 (ja) * 2005-03-14 2009-11-18 富士フイルム株式会社 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス
JP2006253573A (ja) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス
JP4542927B2 (ja) * 2005-03-17 2010-09-15 富士フイルム株式会社 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス
US7432133B2 (en) * 2005-10-24 2008-10-07 Freescale Semiconductor, Inc. Plastic packaged device with die interface layer
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
JP2007161779A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 膜形成用組成物
ATE556118T1 (de) * 2006-03-29 2012-05-15 Sumitomo Bakelite Co Harzzusammensetzung, lack, harzfolie und halbleitervorrichtung mit der harzfolie
WO2007143028A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Low dielectric constant materials prepared from soluble fullerene clusters
WO2007143026A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
US7883742B2 (en) 2006-05-31 2011-02-08 Roskilde Semiconductor Llc Porous materials derived from polymer composites
US7875315B2 (en) 2006-05-31 2011-01-25 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
JP5134233B2 (ja) * 2006-11-29 2013-01-30 出光興産株式会社 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US20090026924A1 (en) * 2007-07-23 2009-01-29 Leung Roger Y Methods of making low-refractive index and/or low-k organosilicate coatings
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
CN101219934B (zh) * 2008-01-25 2010-06-02 吉林大学 4,8-二(1-金刚烷基)-1,5-萘二酚、制备方法及用于合成聚合物材料
JPWO2012111314A1 (ja) * 2011-02-18 2014-07-03 出光興産株式会社 電子素子用絶縁材料形成用組成物、電子素子用絶縁材料、電子素子及び薄膜トランジスタ
CN105152881B (zh) * 2015-06-23 2018-06-29 复旦大学 含金刚烷与六氟环丁烷结构的苯并环丁烯单体、其制备方法及应用
CN109294203B (zh) * 2018-10-10 2021-04-09 湖南七纬科技有限公司 一种新能源汽车动力电池用阻燃防火材料及其制备方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09202824A (ja) * 1995-07-13 1997-08-05 Air Prod And Chem Inc 非機能化したポリ(アリーレンエーテル)及びその合成方法
WO1999029761A2 (en) * 1997-12-12 1999-06-17 Alliedsignal Inc. Poly(arylene ether) compositions and methods of manufacture thereof
US6156812A (en) * 1999-04-09 2000-12-05 Honeywell International Inc. Nanoporous material fabricated using polymeric template strands
US6172128B1 (en) * 1999-04-09 2001-01-09 Honeywell International Inc. Nanoporous polymers crosslinked via cyclic structures
JP2001131469A (ja) * 1999-11-09 2001-05-15 Jsr Corp 膜形成用組成物、膜の形成方法、及び膜
JP2001131263A (ja) * 1999-11-09 2001-05-15 Jsr Corp ジイン含有(共)重合体、その製造方法及び硬化膜
JP2001509828A (ja) * 1997-01-08 2001-07-24 プロリゴ・エルエルシー 高分子のバイオコンジュゲーション
US6303733B1 (en) * 1997-12-12 2001-10-16 Alliedsignal Inc. Poly(arylene ether) homopolymer compositions and methods of manufacture thereof
US6380270B1 (en) * 2000-09-26 2002-04-30 Honeywell International Inc. Photogenerated nanoporous materials
JP2002167435A (ja) * 2000-03-29 2002-06-11 Sumitomo Bakelite Co Ltd 耐熱性樹脂前駆体、耐熱性樹脂及び絶縁膜並びに半導体装置
JP2003520864A (ja) * 1999-04-09 2003-07-08 アライドシグナル・インコーポレイテツド ナノ多孔質薄膜構造への前駆体として架橋に用いられる反応性基を有する骨格を持ったポリマー

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3580964A (en) * 1967-09-06 1971-05-25 Sun Oil Co Curable linear polyesters
US3795658A (en) * 1971-12-30 1974-03-05 Sun Research Development Epoxy resins from dimethyladamantane bisphenols
US5019660A (en) 1990-01-30 1991-05-28 Mobil Oil Corporation Diamondoid polymeric compositions
US5166313A (en) 1991-04-29 1992-11-24 Fluorochem, Inc. Diamantane modified rigid-rod poly benzazole and method of manufacture
US5347063A (en) 1993-03-09 1994-09-13 Mobil Oil Corporation Method for direct arylation of diamondoids
JPH10130371A (ja) * 1996-11-01 1998-05-19 Nippon Kayaku Co Ltd アダマンタン類、これらを含有する熱可塑性樹脂及びこれらを含有する熱硬化性樹脂組成物

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09202824A (ja) * 1995-07-13 1997-08-05 Air Prod And Chem Inc 非機能化したポリ(アリーレンエーテル)及びその合成方法
JP2001509828A (ja) * 1997-01-08 2001-07-24 プロリゴ・エルエルシー 高分子のバイオコンジュゲーション
WO1999029761A2 (en) * 1997-12-12 1999-06-17 Alliedsignal Inc. Poly(arylene ether) compositions and methods of manufacture thereof
US6124421A (en) * 1997-12-12 2000-09-26 Alliedsignal Inc. Poly(arylene ether) compositions and methods of manufacture thereof
US6303733B1 (en) * 1997-12-12 2001-10-16 Alliedsignal Inc. Poly(arylene ether) homopolymer compositions and methods of manufacture thereof
US6156812A (en) * 1999-04-09 2000-12-05 Honeywell International Inc. Nanoporous material fabricated using polymeric template strands
US6172128B1 (en) * 1999-04-09 2001-01-09 Honeywell International Inc. Nanoporous polymers crosslinked via cyclic structures
JP2003520864A (ja) * 1999-04-09 2003-07-08 アライドシグナル・インコーポレイテツド ナノ多孔質薄膜構造への前駆体として架橋に用いられる反応性基を有する骨格を持ったポリマー
JP2001131469A (ja) * 1999-11-09 2001-05-15 Jsr Corp 膜形成用組成物、膜の形成方法、及び膜
JP2001131263A (ja) * 1999-11-09 2001-05-15 Jsr Corp ジイン含有(共)重合体、その製造方法及び硬化膜
JP2002167435A (ja) * 2000-03-29 2002-06-11 Sumitomo Bakelite Co Ltd 耐熱性樹脂前駆体、耐熱性樹脂及び絶縁膜並びに半導体装置
US6380270B1 (en) * 2000-09-26 2002-04-30 Honeywell International Inc. Photogenerated nanoporous materials

Also Published As

Publication number Publication date
WO2001078110A2 (en) 2001-10-18
EP1274755A4 (en) 2004-05-12
WO2001078110A3 (en) 2002-03-07
EP1274755A2 (en) 2003-01-15
KR20020091181A (ko) 2002-12-05
HK1054398A1 (zh) 2003-11-28
DE60132883D1 (de) 2008-04-03
US6849696B2 (en) 2005-02-01
JP2003530464A (ja) 2003-10-14
US20030187139A1 (en) 2003-10-02
DE60132883T2 (de) 2009-03-05
ATE386758T1 (de) 2008-03-15
CN1420899A (zh) 2003-05-28
EP1274755B1 (en) 2008-02-20
KR100823777B1 (ko) 2008-04-21
WO2001078110B1 (en) 2002-05-16
US6509415B1 (en) 2003-01-21
AU2001255248A1 (en) 2001-10-23
CN1227276C (zh) 2005-11-16

Similar Documents

Publication Publication Date Title
JP4795607B2 (ja) ケージ様構造を主体とする低誘電定数有機誘電体
US6172128B1 (en) Nanoporous polymers crosslinked via cyclic structures
US6713590B2 (en) Low dielectric constant materials with polymeric networks
US6797777B2 (en) Low dielectric constant organic dielectrics based on cage-like structures
TWI241310B (en) Compositions and methods for thermosetting molecules in organic compositions
US6469123B1 (en) Compositions and methods for thermosetting molecules in organic compositions
CA2441901A1 (en) Low dielectric constant materials and methods of preparation thereof
US7049386B2 (en) Compositions and methods for thermosetting molecules in organic compositions
JP3329416B2 (ja) 硬化性化合物およびその製造方法
JP2007505976A (ja) 結合ポラゲン含有多官能性モノマー及びそれからのポリアリーレン組成物
US20040102584A1 (en) Low dielectric constant materials with polymeric networks
JPH09188757A (ja) 硬化性樹脂組成物、その製造方法および樹脂硬化物
JP2003520864A (ja) ナノ多孔質薄膜構造への前駆体として架橋に用いられる反応性基を有する骨格を持ったポリマー
KR20020060068A (ko) 나노 크기의 다공성 박막 구조에 대한 전구체로서가교결합에 이용되는 반응성 기를 구비한 주쇄를 가진중합체

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080321

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080321

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100803

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101028

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20101105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110105

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110719

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110728

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140805

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees