CN1227276C - 基于笼形结构的低介电常数有机电介质 - Google Patents

基于笼形结构的低介电常数有机电介质 Download PDF

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Publication number
CN1227276C
CN1227276C CNB018074413A CN01807441A CN1227276C CN 1227276 C CN1227276 C CN 1227276C CN B018074413 A CNB018074413 A CN B018074413A CN 01807441 A CN01807441 A CN 01807441A CN 1227276 C CN1227276 C CN 1227276C
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China
Prior art keywords
low
cage structure
reactive group
diamantane
skeleton
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Expired - Fee Related
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CNB018074413A
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English (en)
Chinese (zh)
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CN1420899A (zh
Inventor
K·劳
F·Q·刘
B·科罗勒夫
E·布罗克
R·泽雷宾
R·梁
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Honeywell International Inc
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Honeywell International Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/246—Intercrosslinking of at least two polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/963—Miscellaneous

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Organic Insulating Materials (AREA)
  • Rolling Contact Bearings (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Polyethers (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
CNB018074413A 2000-04-07 2001-04-06 基于笼形结构的低介电常数有机电介质 Expired - Fee Related CN1227276C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/545,058 US6509415B1 (en) 2000-04-07 2000-04-07 Low dielectric constant organic dielectrics based on cage-like structures
US09/545,058 2000-04-07

Publications (2)

Publication Number Publication Date
CN1420899A CN1420899A (zh) 2003-05-28
CN1227276C true CN1227276C (zh) 2005-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018074413A Expired - Fee Related CN1227276C (zh) 2000-04-07 2001-04-06 基于笼形结构的低介电常数有机电介质

Country Status (10)

Country Link
US (2) US6509415B1 (enExample)
EP (1) EP1274755B1 (enExample)
JP (1) JP4795607B2 (enExample)
KR (1) KR100823777B1 (enExample)
CN (1) CN1227276C (enExample)
AT (1) ATE386758T1 (enExample)
AU (1) AU2001255248A1 (enExample)
DE (1) DE60132883T2 (enExample)
HK (1) HK1054398A1 (enExample)
WO (1) WO2001078110A2 (enExample)

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US7141188B2 (en) * 2001-05-30 2006-11-28 Honeywell International Inc. Organic compositions
US7049005B2 (en) * 2001-05-30 2006-05-23 Honeywell International Inc. Organic compositions
US6740685B2 (en) * 2001-05-30 2004-05-25 Honeywell International Inc. Organic compositions
US20040247896A1 (en) * 2001-12-31 2004-12-09 Paul Apen Organic compositions
AU2003202905A1 (en) * 2002-01-08 2003-07-24 Honeywell International Inc. Organic composition
EP1466356A2 (en) * 2002-01-15 2004-10-13 Honeywell International Inc. Organic compositions
US7060204B2 (en) * 2002-04-29 2006-06-13 Honeywell International Inc. Organic compositions
US6855738B2 (en) * 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7488565B2 (en) * 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US7208243B2 (en) * 2004-12-01 2007-04-24 Toyota Technical Center Usa, Inc. Proton exchange membranes using cycloaddition reaction between azide and alkyne containing components
KR20060090483A (ko) * 2005-02-07 2006-08-11 삼성코닝 주식회사 풀러렌을 포함하는 저유전 박막 형성용 조성물, 이를이용한 저유전 박막 및 저유전 박막의 제조방법
US7531209B2 (en) 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
JP4516857B2 (ja) * 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
JP2006253577A (ja) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd 絶縁膜、その製造方法及び該絶縁膜を有するデバイス
JP2006291160A (ja) * 2005-03-14 2006-10-26 Fuji Photo Film Co Ltd 膜形成用組成物、それを用いた絶縁膜および電子デバイス
JP4368319B2 (ja) * 2005-03-14 2009-11-18 富士フイルム株式会社 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス
JP2006253573A (ja) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd 絶縁膜とそれを製造する方法、およびそれを用いた電子デバイス
JP4542927B2 (ja) * 2005-03-17 2010-09-15 富士フイルム株式会社 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス
US7432133B2 (en) * 2005-10-24 2008-10-07 Freescale Semiconductor, Inc. Plastic packaged device with die interface layer
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
JP2007161779A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 膜形成用組成物
ATE556118T1 (de) * 2006-03-29 2012-05-15 Sumitomo Bakelite Co Harzzusammensetzung, lack, harzfolie und halbleitervorrichtung mit der harzfolie
WO2007143028A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Low dielectric constant materials prepared from soluble fullerene clusters
WO2007143026A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
US7883742B2 (en) 2006-05-31 2011-02-08 Roskilde Semiconductor Llc Porous materials derived from polymer composites
US7875315B2 (en) 2006-05-31 2011-01-25 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
JP5134233B2 (ja) * 2006-11-29 2013-01-30 出光興産株式会社 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US20090026924A1 (en) * 2007-07-23 2009-01-29 Leung Roger Y Methods of making low-refractive index and/or low-k organosilicate coatings
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
CN101219934B (zh) * 2008-01-25 2010-06-02 吉林大学 4,8-二(1-金刚烷基)-1,5-萘二酚、制备方法及用于合成聚合物材料
JPWO2012111314A1 (ja) * 2011-02-18 2014-07-03 出光興産株式会社 電子素子用絶縁材料形成用組成物、電子素子用絶縁材料、電子素子及び薄膜トランジスタ
CN105152881B (zh) * 2015-06-23 2018-06-29 复旦大学 含金刚烷与六氟环丁烷结构的苯并环丁烯单体、其制备方法及应用
CN109294203B (zh) * 2018-10-10 2021-04-09 湖南七纬科技有限公司 一种新能源汽车动力电池用阻燃防火材料及其制备方法

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Also Published As

Publication number Publication date
WO2001078110A2 (en) 2001-10-18
EP1274755A4 (en) 2004-05-12
WO2001078110A3 (en) 2002-03-07
EP1274755A2 (en) 2003-01-15
JP4795607B2 (ja) 2011-10-19
KR20020091181A (ko) 2002-12-05
HK1054398A1 (zh) 2003-11-28
DE60132883D1 (de) 2008-04-03
US6849696B2 (en) 2005-02-01
JP2003530464A (ja) 2003-10-14
US20030187139A1 (en) 2003-10-02
DE60132883T2 (de) 2009-03-05
ATE386758T1 (de) 2008-03-15
CN1420899A (zh) 2003-05-28
EP1274755B1 (en) 2008-02-20
KR100823777B1 (ko) 2008-04-21
WO2001078110B1 (en) 2002-05-16
US6509415B1 (en) 2003-01-21
AU2001255248A1 (en) 2001-10-23

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