JP2003273571A5 - - Google Patents

Download PDF

Info

Publication number
JP2003273571A5
JP2003273571A5 JP2002074253A JP2002074253A JP2003273571A5 JP 2003273571 A5 JP2003273571 A5 JP 2003273571A5 JP 2002074253 A JP2002074253 A JP 2002074253A JP 2002074253 A JP2002074253 A JP 2002074253A JP 2003273571 A5 JP2003273571 A5 JP 2003273571A5
Authority
JP
Japan
Prior art keywords
high frequency
frequency module
active element
resin
radio wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002074253A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003273571A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002074253A priority Critical patent/JP2003273571A/ja
Priority claimed from JP2002074253A external-priority patent/JP2003273571A/ja
Publication of JP2003273571A publication Critical patent/JP2003273571A/ja
Publication of JP2003273571A5 publication Critical patent/JP2003273571A5/ja
Pending legal-status Critical Current

Links

JP2002074253A 2002-03-18 2002-03-18 素子間干渉電波シールド型高周波モジュール Pending JP2003273571A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002074253A JP2003273571A (ja) 2002-03-18 2002-03-18 素子間干渉電波シールド型高周波モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002074253A JP2003273571A (ja) 2002-03-18 2002-03-18 素子間干渉電波シールド型高周波モジュール

Publications (2)

Publication Number Publication Date
JP2003273571A JP2003273571A (ja) 2003-09-26
JP2003273571A5 true JP2003273571A5 (enrdf_load_stackoverflow) 2005-09-08

Family

ID=29203700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002074253A Pending JP2003273571A (ja) 2002-03-18 2002-03-18 素子間干渉電波シールド型高周波モジュール

Country Status (1)

Country Link
JP (1) JP2003273571A (enrdf_load_stackoverflow)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1684341A3 (de) * 2005-01-21 2007-01-10 Robert Bosch Gmbh Elektrische Schaltung und Verfahren zur Herstellung einer elektrischen Schaltung
JP4492448B2 (ja) * 2005-06-15 2010-06-30 株式会社日立製作所 半導体パワーモジュール
DE102005044216A1 (de) * 2005-09-15 2007-03-29 Smartrac Technology Ltd. Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
US8212339B2 (en) 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8022511B2 (en) 2008-02-05 2011-09-20 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8350367B2 (en) 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7989928B2 (en) 2008-02-05 2011-08-02 Advanced Semiconductor Engineering Inc. Semiconductor device packages with electromagnetic interference shielding
US8410584B2 (en) 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US20100110656A1 (en) 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
JP2010177520A (ja) * 2009-01-30 2010-08-12 Toshiba Corp 電子回路モジュールおよびその製造方法
US8110902B2 (en) 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8212340B2 (en) 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8030750B2 (en) 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8378466B2 (en) 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8368185B2 (en) 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
KR101862370B1 (ko) * 2011-05-30 2018-05-29 삼성전자주식회사 반도체 소자, 반도체 패키지 및 전자 장치
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US8704341B2 (en) 2012-05-15 2014-04-22 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal dissipation structures and EMI shielding
US8653634B2 (en) 2012-06-11 2014-02-18 Advanced Semiconductor Engineering, Inc. EMI-shielded semiconductor devices and methods of making
JP6225436B2 (ja) * 2012-08-16 2017-11-08 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品の被覆方法
JP6205859B2 (ja) * 2013-05-31 2017-10-04 住友電気工業株式会社 半導体装置、及び電子装置
KR20160040927A (ko) 2014-10-06 2016-04-15 삼성전자주식회사 반도체 패키지 및 그 제조 방법
JP6254509B2 (ja) 2014-11-07 2017-12-27 信越化学工業株式会社 電磁波シールド性支持基材付封止材及び封止後半導体素子搭載基板、封止後半導体素子形成ウエハ並びに半導体装置
US9929078B2 (en) 2016-01-14 2018-03-27 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
WO2018008657A1 (ja) * 2016-07-08 2018-01-11 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
US10373917B2 (en) 2017-12-05 2019-08-06 Tdk Corporation Electronic circuit package using conductive sealing material
KR102677777B1 (ko) * 2019-04-01 2024-06-25 삼성전자주식회사 반도체 패키지
CN114171501A (zh) * 2020-09-10 2022-03-11 中芯集成电路（宁波）有限公司上海分公司 一种射频半导体器件结构及其制造方法
JP2024000949A (ja) * 2022-06-17 2024-01-09 東洋インキＳｃホールディングス株式会社 導電性シート、電子部品及びその製造方法
JP2024036954A (ja) * 2022-09-06 2024-03-18 Ｔｏｗａ株式会社 シート材の位置決め装置、位置決め方法、及び電子部品に対するシールド層の形成方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54142001A (en) * 1978-04-27 1979-11-05 Tdk Corp Forming metod of microwave reflection preventing layer
JPS60241237A (ja) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp 混成集積回路装置
JPH0242499U (enrdf_load_stackoverflow) * 1988-09-19 1990-03-23
JPH0810957Y2 (ja) * 1991-06-26 1996-03-29 鐘淵化学工業株式会社 高周波数帯域用電子機器内部回路の反射防止構造
US5597979A (en) * 1995-05-12 1997-01-28 Schlegel Corporation EMI shielding having flexible condustive sheet and I/O Gasket
JPH09116289A (ja) * 1995-10-24 1997-05-02 Tokin Corp ノイズ抑制型電子装置およびその製造方法
JP3608063B2 (ja) * 1996-08-23 2005-01-05 Ｎｅｃトーキン株式会社 Ｅｍｉ対策部品及びそれを備えた能動素子
JPH1140709A (ja) * 1997-07-18 1999-02-12 Nec Eng Ltd 半導体実装構造およびその製造方法
DE19806818C1 (de) * 1998-02-18 1999-11-04 Siemens Matsushita Components Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements
JP2000223884A (ja) * 1999-02-02 2000-08-11 Daido Steel Co Ltd 電磁波吸収体
KR20010090354A (ko) * 1999-03-26 2001-10-18 가나이 쓰토무 반도체 모듈 및 그 실장 방법
JP2001057496A (ja) * 1999-08-19 2001-02-27 Tokin Corp 電磁干渉抑制体
JP2001068888A (ja) * 1999-08-26 2001-03-16 Sony Corp 電磁波吸収体
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体

Similar Documents

Publication Publication Date Title
JP2003273571A5 (enrdf_load_stackoverflow)
US8648261B2 (en) Printed circuit board
JP4484035B2 (ja) 半導体装置の製造方法
JP2011003906A5 (enrdf_load_stackoverflow)
US20170064458A1 (en) Mems microphone package structure having a non-planar substrate
JP2018061011A5 (ja) 電磁波シールドシート、プリント配線板およびプリント配線板の製造方法
JP2005501415A5 (enrdf_load_stackoverflow)
JP2007165888A (ja) 電子素子内蔵印刷回路基板及びその製造方法
TWI484875B (zh) 電路板及電路板製作方法
JP2010245931A (ja) アンテナ一体型モジュール部品とその製造方法と、これを用いた電子機器
TWI429043B (zh) 電路板結構、封裝結構與製作電路板的方法
JP2006517348A5 (enrdf_load_stackoverflow)
KR101162296B1 (ko) 전자파 차폐 필름 및 이를 구비하는 회로기판 어셈블리
JP2008078205A (ja) 基板組立体及びその製造方法、電子部品組立体及びその製造方法、電子装置
TWI400012B (zh) 電路板和構造電路板的方法
KR20150130915A (ko) 자기억제 시트 및 그 제조방법
CN102655715B (zh) 柔性印刷电路板及其制造方法
JP2015220259A (ja) 磁気抑制シート及びその製造方法
CN112153801B (zh) 电路板及其制作方法
JP2011077164A (ja) 半導体発光装置
CN108076581A (zh) 多层柔性电路板及其制备方法
CN210641072U (zh) 一种传感器封装结构以及电子设备
KR101546452B1 (ko) 습식 도금을 이용한 전사용 전자파 차폐 필름의 제조방법
JP4317101B2 (ja) 配線回路基板
JP2003115561A (ja) 集積型電子部品、電子部品装置及びその製造方法