JP2003192765A5 - - Google Patents

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Publication number
JP2003192765A5
JP2003192765A5 JP2002241364A JP2002241364A JP2003192765A5 JP 2003192765 A5 JP2003192765 A5 JP 2003192765A5 JP 2002241364 A JP2002241364 A JP 2002241364A JP 2002241364 A JP2002241364 A JP 2002241364A JP 2003192765 A5 JP2003192765 A5 JP 2003192765A5
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JP
Japan
Prior art keywords
component
epoxy resin
weight
resin composition
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002241364A
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English (en)
Japanese (ja)
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JP2003192765A (ja
Filing date
Publication date
Priority claimed from US09/935,369 external-priority patent/US6617400B2/en
Application filed filed Critical
Publication of JP2003192765A publication Critical patent/JP2003192765A/ja
Publication of JP2003192765A5 publication Critical patent/JP2003192765A5/ja
Pending legal-status Critical Current

Links

JP2002241364A 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法 Pending JP2003192765A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/935,369 US6617400B2 (en) 2001-08-23 2001-08-23 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
US09/935369 2001-08-23

Publications (2)

Publication Number Publication Date
JP2003192765A JP2003192765A (ja) 2003-07-09
JP2003192765A5 true JP2003192765A5 (https=) 2005-11-04

Family

ID=25467000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002241364A Pending JP2003192765A (ja) 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法

Country Status (3)

Country Link
US (2) US6617400B2 (https=)
EP (1) EP1285939A1 (https=)
JP (1) JP2003192765A (https=)

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US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
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US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
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JP5629009B2 (ja) 2010-09-15 2014-11-19 ヘンケル アイルランド リミテッド 二成分系シアノアクリレート／カチオン硬化性接着剤システム
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WO2012060449A1 (ja) 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
KR101905938B1 (ko) 2012-04-27 2018-10-08 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체
TWI494339B (zh) 2012-10-23 2015-08-01 Ind Tech Res Inst 部分酯化環氧樹脂及應用其製成之環氧樹脂組成物及其製法
CA2905948C (en) 2013-03-14 2022-01-11 Board Of Regents Of The University Of Nebraska Methods, systems, and devices relating to robotic surgical devices, end effectors, and controllers
US8981027B2 (en) 2013-03-15 2015-03-17 Henkel IP & Holding GmbH Two-part, cyanoacrylate/cationically curable adhesive systems
CN103980231B (zh) * 2014-06-04 2016-03-30 中国科学院上海有机化学研究所 一种五氟苯基环氧丙烷的合成方法
JP5977794B2 (ja) * 2014-10-23 2016-08-24 株式会社ダイセル 硬化性エポキシ樹脂組成物
EP3263621B1 (de) * 2016-07-01 2020-03-11 ZoE GmbH & Co. KG Epoxidharzmischung als giessharz
CN115337111B (zh) 2016-11-22 2025-04-25 内布拉斯加大学董事会 改进的粗定位装置及相关系统和方法
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GB2582537B (en) 2019-03-04 2022-02-23 Henkel IP & Holding GmbH Two-part, cyanoacrylate/cationically curable adhesive systems
CN115843233A (zh) 2020-07-06 2023-03-24 虚拟切割有限公司 手术机器人定位系统及相关装置和方法
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