JP2003176333A5 - - Google Patents

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Publication number
JP2003176333A5
JP2003176333A5 JP2002241363A JP2002241363A JP2003176333A5 JP 2003176333 A5 JP2003176333 A5 JP 2003176333A5 JP 2002241363 A JP2002241363 A JP 2002241363A JP 2002241363 A JP2002241363 A JP 2002241363A JP 2003176333 A5 JP2003176333 A5 JP 2003176333A5
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JP
Japan
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JP2002241363A
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English (en)
Japanese (ja)
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JP2003176333A (ja
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Priority claimed from US09/935,409 external-priority patent/US6617401B2/en
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Publication of JP2003176333A publication Critical patent/JP2003176333A/ja
Publication of JP2003176333A5 publication Critical patent/JP2003176333A5/ja
Withdrawn legal-status Critical Current

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JP2002241363A 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法 Withdrawn JP2003176333A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/935409 2001-08-23
US09/935,409 US6617401B2 (en) 2001-08-23 2001-08-23 Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst

Publications (2)

Publication Number Publication Date
JP2003176333A JP2003176333A (ja) 2003-06-24
JP2003176333A5 true JP2003176333A5 (https=) 2005-11-04

Family

ID=25467073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002241363A Withdrawn JP2003176333A (ja) 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法

Country Status (4)

Country Link
US (2) US6617401B2 (https=)
EP (1) EP1285938B1 (https=)
JP (1) JP2003176333A (https=)
DE (1) DE60208863T2 (https=)

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US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
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US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
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US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
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US8092735B2 (en) * 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
JP5470680B2 (ja) * 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
US9944031B2 (en) * 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
TWI481064B (zh) 2007-02-13 2015-04-11 ３Ｍ新設資產公司 具有透鏡之發光二極體裝置及其製造方法
US20090065792A1 (en) * 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
JP5353629B2 (ja) * 2008-11-14 2013-11-27 信越化学工業株式会社 熱硬化性樹脂組成物
JP5478603B2 (ja) * 2009-03-05 2014-04-23 新日鉄住金化学株式会社 エポキシ樹脂組成物
JP5745248B2 (ja) * 2010-10-08 2015-07-08 株式会社ダイセル エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物
JP2012122002A (ja) 2010-12-09 2012-06-28 Daicel Corp 付加硬化性メタロシロキサン化合物
WO2012158291A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
US8486214B2 (en) * 2011-09-27 2013-07-16 Source Photonics, Inc. Ramped, variable power UV adhesive cure process for improved alignment
JP5885126B2 (ja) * 2012-05-02 2016-03-15 川崎化成工業株式会社 エポキシ化合物及びその製造方法ならびにエポキシ樹脂組成物及びその硬化物
TWI494339B (zh) 2012-10-23 2015-08-01 Ind Tech Res Inst 部分酯化環氧樹脂及應用其製成之環氧樹脂組成物及其製法
JP6517043B2 (ja) * 2015-02-25 2019-05-22 ルネサスエレクトロニクス株式会社 光結合装置、光結合装置の製造方法および電力変換システム
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CN105936815B (zh) * 2016-06-08 2018-11-30 天津德高化成光电科技有限责任公司 触变性环氧树脂、制备方法及在led芯片封装应用

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