JP2010047741A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010047741A5 JP2010047741A5 JP2008320024A JP2008320024A JP2010047741A5 JP 2010047741 A5 JP2010047741 A5 JP 2010047741A5 JP 2008320024 A JP2008320024 A JP 2008320024A JP 2008320024 A JP2008320024 A JP 2008320024A JP 2010047741 A5 JP2010047741 A5 JP 2010047741A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- thermosetting resin
- resin composition
- optical semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 phosphonium ion Chemical class 0.000 claims 15
- 229920001187 thermosetting polymer Polymers 0.000 claims 15
- 239000011342 resin composition Substances 0.000 claims 14
- 230000003287 optical effect Effects 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 12
- 125000001424 substituent group Chemical group 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000003054 catalyst Substances 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 150000003839 salts Chemical class 0.000 claims 3
- 239000012463 white pigment Substances 0.000 claims 3
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical group CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 claims 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 239000013522 chelant Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 150000002736 metal compounds Chemical class 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 150000004010 onium ions Chemical class 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 150000001242 acetic acid derivatives Chemical class 0.000 claims 1
- 125000004018 acid anhydride group Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052752 metalloid Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000001579 optical reflectometry Methods 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 150000004714 phosphonium salts Chemical group 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008320024A JP5599561B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008188406 | 2008-07-22 | ||
| JP2008188406 | 2008-07-22 | ||
| JP2008320024A JP5599561B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010047741A JP2010047741A (ja) | 2010-03-04 |
| JP2010047741A5 true JP2010047741A5 (https=) | 2011-12-01 |
| JP5599561B2 JP5599561B2 (ja) | 2014-10-01 |
Family
ID=42065084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008320024A Active JP5599561B2 (ja) | 2008-07-22 | 2008-12-16 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5599561B2 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011108672A2 (ja) | 2010-03-04 | 2011-09-09 | 高砂香料工業株式会社 | 均一系不斉水素化触媒 |
| JP6045774B2 (ja) * | 2010-03-16 | 2016-12-14 | 日立化成株式会社 | 半導体封止充てん用エポキシ樹脂組成物、半導体装置、及びその製造方法 |
| JP5533203B2 (ja) * | 2010-04-30 | 2014-06-25 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
| CN103396665B (zh) | 2011-01-28 | 2016-01-20 | 可乐丽股份有限公司 | 反射板用聚酰胺组合物、反射板、具备该反射板的发光装置、以及具备该发光装置的照明装置和图像显示装置 |
| JP5838790B2 (ja) * | 2011-12-22 | 2016-01-06 | 日本ゼオン株式会社 | 光反射部材用樹脂組成物、光反射部材及び発光素子 |
| WO2014156696A1 (ja) * | 2013-03-28 | 2014-10-02 | 日東電工株式会社 | 光半導体装置の製造方法、システム、製造条件決定装置および製造管理装置 |
| KR101627019B1 (ko) * | 2013-10-10 | 2016-06-03 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| KR102409220B1 (ko) * | 2014-01-07 | 2022-06-16 | 루미리즈 홀딩 비.브이. | 발광 디바이스 패키지 |
| JP6451579B2 (ja) * | 2015-09-30 | 2019-01-16 | 日亜化学工業株式会社 | 発光装置 |
| JP6917707B2 (ja) * | 2016-12-27 | 2021-08-11 | サンアプロ株式会社 | エポキシ樹脂硬化促進剤 |
| JP7659329B2 (ja) * | 2020-07-30 | 2025-04-09 | 日東化成株式会社 | 重合体の硬化に用いる硬化触媒及びその製造方法、湿気硬化型組成物、硬化物の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4475771B2 (ja) * | 2000-08-08 | 2010-06-09 | 日本化学工業株式会社 | 光半導体封止用エポキシ樹脂組成物 |
| JP2005054060A (ja) * | 2003-08-04 | 2005-03-03 | Hokko Chem Ind Co Ltd | 熱硬化性エポキシ樹脂用硬化促進剤および高温熱硬化用潜在型エポキシ樹脂組成物 |
| CN101268559B (zh) * | 2005-08-04 | 2010-11-17 | 日亚化学工业株式会社 | 发光装置及其制造方法以及成形体及密封构件 |
| JP4802667B2 (ja) * | 2005-11-08 | 2011-10-26 | 住友金属鉱山株式会社 | エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤 |
| JP2007256545A (ja) * | 2006-03-23 | 2007-10-04 | Konica Minolta Holdings Inc | 表示素子 |
| JP5298468B2 (ja) * | 2006-09-26 | 2013-09-25 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置 |
| WO2011019003A1 (ja) * | 2009-08-10 | 2011-02-17 | 三菱瓦斯化学株式会社 | 表面保護層用熱硬化性樹脂組成物 |
-
2008
- 2008-12-16 JP JP2008320024A patent/JP5599561B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010047741A5 (https=) | ||
| JP2010047740A5 (https=) | ||
| TWI530532B (zh) | A silicon-containing hardened composition and a hardened product thereof | |
| JP6089900B2 (ja) | 固定用樹脂組成物、ロータ、自動車、及びロータの製造方法 | |
| JP5739418B2 (ja) | ケイ素含有硬化性組成物、該ケイ素含有硬化性組成物の硬化物及び該ケイ素含有硬化性組成物より形成されるリードフレーム基板 | |
| JP2006328315A5 (https=) | ||
| TWI684617B (zh) | 聚矽氧烷共聚物及含有其之抗靜電劑 | |
| CN105683283A (zh) | 含水滑石的密封用树脂组合物和密封用片材 | |
| CN102786803B (zh) | 高折射率可固化液态发光二极管密封剂制剂 | |
| CN105683284A (zh) | 密封用树脂组合物和密封用片材 | |
| KR20180132619A (ko) | 피막형성용 조성물 및 그 제조방법 | |
| JP5805420B2 (ja) | オルガノポリシロキサンを用いた熱硬化性樹脂組成物、光半導体用封止材、半導体用ダイボンド材、光半導体パッケージ、光半導体 | |
| JP2008185672A5 (https=) | ||
| JP4246269B2 (ja) | シロキサン系のためのｕｖ−安定化剤 | |
| TWI713519B (zh) | 封裝用樹脂組成物及封裝用薄片 | |
| JP5070107B2 (ja) | エポキシ樹脂組成物 | |
| JP2014205823A (ja) | ケイ素含有硬化性組成物 | |
| JP5629973B2 (ja) | 低屈折率組成物および反射防止材の製造方法 | |
| KR102766357B1 (ko) | 경화성 조성물, 그 제조방법 및 표시장치 | |
| JP2003306605A (ja) | 無機ｕｖ吸収剤を含む組成物 | |
| CN202772736U (zh) | 马达防护结构 | |
| WO2007037024A1 (ja) | 潜伏性触媒の製造方法及びエポキシ樹脂組成物 | |
| JP6236643B1 (ja) | 帯電防止材料、その製造方法および帯電防止膜 | |
| TW201807072A (zh) | 含有矽之硬化性組合物及其硬化物 | |
| TW201430047A (zh) | 片狀環氧樹脂組成物、使用其的有機ｅｌ裝置的製造方法、有機ｅｌ裝置、有機ｅｌ顯示面板及有機ｅｌ照明 |