JP2002256062A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002256062A5 JP2002256062A5 JP2001056834A JP2001056834A JP2002256062A5 JP 2002256062 A5 JP2002256062 A5 JP 2002256062A5 JP 2001056834 A JP2001056834 A JP 2001056834A JP 2001056834 A JP2001056834 A JP 2001056834A JP 2002256062 A5 JP2002256062 A5 JP 2002256062A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- active energy
- energy ray
- polymerizable organic
- organic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000002894 organic compounds Chemical class 0.000 claims 11
- 239000011342 resin composition Substances 0.000 claims 11
- 150000001875 compounds Chemical class 0.000 claims 8
- 230000003287 optical effect Effects 0.000 claims 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 125000002091 cationic group Chemical group 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- -1 acrylate compound Chemical class 0.000 claims 1
- 238000010538 cationic polymerization reaction Methods 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000003566 oxetanyl group Chemical group 0.000 claims 1
- 239000003505 polymerization initiator Substances 0.000 claims 1
- 239000007870 radical polymerization initiator Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001056834A JP3974336B2 (ja) | 2001-03-01 | 2001-03-01 | 光学的立体造形用の活性エネルギー線硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001056834A JP3974336B2 (ja) | 2001-03-01 | 2001-03-01 | 光学的立体造形用の活性エネルギー線硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002256062A JP2002256062A (ja) | 2002-09-11 |
| JP2002256062A5 true JP2002256062A5 (https=) | 2005-08-04 |
| JP3974336B2 JP3974336B2 (ja) | 2007-09-12 |
Family
ID=18916796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001056834A Expired - Lifetime JP3974336B2 (ja) | 2001-03-01 | 2001-03-01 | 光学的立体造形用の活性エネルギー線硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3974336B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050007372A (ko) * | 2002-05-03 | 2005-01-17 | 디에스엠 아이피 어셋츠 비.브이. | 방사선 경화성 수지 조성물 및 이를 이용한 쾌속 성형법 |
| WO2004113396A1 (ja) * | 2003-06-25 | 2004-12-29 | Cmet Inc. | 安定性の向上した活性エネルギー線硬化性の光学的立体造形用樹脂組成物 |
| JP5111774B2 (ja) * | 2006-04-04 | 2013-01-09 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
| JP5763944B2 (ja) * | 2011-03-25 | 2015-08-12 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法 |
| EP2842980B1 (en) * | 2013-08-09 | 2021-05-05 | DSM IP Assets B.V. | Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing |
| JP2015152854A (ja) * | 2014-02-18 | 2015-08-24 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 |
| JP6388570B2 (ja) * | 2015-09-29 | 2018-09-12 | 富士フイルム株式会社 | 積層フィルムおよびその製造方法、偏光板、液晶パネル、ならびに液晶表示装置 |
| JP6097815B1 (ja) * | 2015-12-18 | 2017-03-15 | 古河電気工業株式会社 | 接着剤組成物、これを用いた被着体の接合方法および積層体の製造方法 |
| JP6949458B2 (ja) * | 2016-03-30 | 2021-10-13 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
| JP2020075941A (ja) * | 2016-12-05 | 2020-05-21 | Dic株式会社 | サージカルガイド用の立体造形物を形成するために用いられる光学的立体造形用光硬化性樹脂組成物 |
| CN113631390A (zh) * | 2019-03-28 | 2021-11-09 | 汉高股份有限及两合公司 | 用于增材制造的可光固化的组合物 |
| WO2021153213A1 (ja) * | 2020-01-30 | 2021-08-05 | 株式会社ダイセル | 成形体ならびにその前駆体、製造方法および用途 |
| JPWO2024176886A1 (https=) * | 2023-02-20 | 2024-08-29 |
-
2001
- 2001-03-01 JP JP2001056834A patent/JP3974336B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002256062A5 (https=) | ||
| US11427721B2 (en) | Photocurable composition for 3D printer for producing transparent orthodontic device | |
| JP5741860B2 (ja) | 硬化性長鎖アルキレン基含有エポキシ樹脂組成物 | |
| JP2009051954A (ja) | 光および加熱硬化性組成物とその硬化物 | |
| JP2013504652A5 (https=) | ||
| JP2011043806A5 (https=) | ||
| JP2016170412A5 (https=) | ||
| JP2010189641A5 (https=) | ||
| JP2012525467A5 (https=) | ||
| WO2003076528A3 (en) | Photocurable resin composition and optical component | |
| JP7235482B2 (ja) | 電子デバイス用光硬化性樹脂組成物 | |
| WO2018037565A1 (ja) | エポキシ樹脂組成物及び密着性に優れる低硬化収縮性樹脂硬化膜 | |
| JPH11199647A5 (https=) | ||
| JP2012533675A5 (https=) | ||
| JP2009533535A5 (https=) | ||
| JPWO2022209689A5 (https=) | ||
| SG114604A1 (en) | Thermosetting resin composition and semiconductor device obtained with the same | |
| SE0501028L (sv) | Hybrid radiation curable composition and use thereof | |
| JP4548415B2 (ja) | 紫外線硬化型組成物 | |
| JP2009040989A5 (https=) | ||
| RU2213748C2 (ru) | Композиция для перегородки тонкой индикаторной панели | |
| JP2007521388A5 (https=) | ||
| CN121358808A (zh) | 光固化性树脂组合物、粘接剂、密封材料、涂覆剂、固化物、半导体装置、电子部件以及使用光固化性树脂组合物的固化、粘接、密封及涂覆方法 | |
| JPWO2007037434A1 (ja) | 光学的立体造形用樹脂組成物 | |
| JP2007510772A5 (https=) |