JP2002256062A5 - - Google Patents

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JP2002256062A5
JP2002256062A5 JP2001056834A JP2001056834A JP2002256062A5 JP 2002256062 A5 JP2002256062 A5 JP 2002256062A5 JP 2001056834 A JP2001056834 A JP 2001056834A JP 2001056834 A JP2001056834 A JP 2001056834A JP 2002256062 A5 JP2002256062 A5 JP 2002256062A5
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resin composition
active energy
energy ray
polymerizable organic
organic compound
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JP2001056834A
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JP3974336B2 (en
JP2002256062A (en
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カチオン重合性有機化合物（ａ）、ラジカル重合性有機化合物（ｂ）、活性エネルギー線感受性カチオン重合開始剤（ｃ）および活性エネルギー線感受性ラジカル重合開始剤（ｄ）を含有する活性エネルギー線硬化性樹脂組成物であって、カチオン重合性有機化合物（ａ）の一部として、下記の一般式（Ｉ）；
Figure 2002256062
（式中、Ｒ1、Ｒ2およびＲ3はそれぞれ独立してメチル基または水素原子を示し、ｍおよびｎはそれぞれ独立して１〜１５の整数を示す。）
で表されるジエポキシ化合物を含有することを特徴とする活性エネルギー線硬化性樹脂組成物。Active energy ray curable resin containing cationic polymerizable organic compound (a), radical polymerizable organic compound (b), active energy ray sensitive cationic polymerization initiator (c) and active energy ray sensitive radical polymerization initiator (d) A composition having the following general formula (I) as a part of the cationically polymerizable organic compound (a):
Figure 2002256062
 (In the formula, R 1 , R 2 and R 3 each independently represent a methyl group or a hydrogen atom, and m and n each independently represents an integer of 1 to 15.)
An active energy ray-curable resin composition comprising a diepoxy compound represented by the formula: 上記の一般式（Ｉ）で表されるジエポキシ化合物が、一般式（Ｉ）においてｍおよびｎがそれぞれ独立して１〜１０のジエポキシ化合物である請求項１に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable resin composition according to claim 1, wherein the diepoxy compound represented by the general formula (I) is a diepoxy compound in which m and n are each independently 1 to 10 in the general formula (I). object. カチオン重合性有機化合物（ａ）の全質量に対する一般式（Ｉ）で表されるジエポキシ化合物の割合が１〜５０質量％である請求項１または２に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable resin composition according to claim 1 or 2, wherein a ratio of the diepoxy compound represented by the general formula (I) to the total mass of the cationically polymerizable organic compound (a) is 1 to 50% by mass. カチオン重合性有機化合物（ａ）の３０〜９９質量％が、２個以上のエポキシ基を有する脂環族ポリエポキシ化合物からなる請求項１〜３のいずれか１項に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable property according to any one of claims 1 to 3, wherein 30 to 99% by mass of the cationically polymerizable organic compound (a) comprises an alicyclic polyepoxy compound having two or more epoxy groups. Resin composition. ２個以上のエポキシ基を有する脂環族ポリエポキシ化合物として、水素添加ビスフェノールＡジグリシジルエーテルを含む請求項１〜４のいずれか１項に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable resin composition according to any one of claims 1 to 4, comprising hydrogenated bisphenol A diglycidyl ether as an alicyclic polyepoxy compound having two or more epoxy groups. カチオン重合性有機化合物（ａ）がエポキシ化合物から主としてなり、ラジカル重合性有機化合物（ｂ）が（メタ）アクリレート系化合物から主としてなる請求項１〜５のいずれか１項に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray curing according to any one of claims 1 to 5, wherein the cationic polymerizable organic compound (a) mainly comprises an epoxy compound, and the radical polymerizable organic compound (b) mainly comprises a (meth) acrylate compound. Resin composition. ラジカル重合性有機化合物として、ジペンタエリスリトールヘキサ（メタ）アクリレートを含む請求項１〜６のいずれか１項に記載の光学的造形用樹脂組成物。  The resin composition for optical modeling according to any one of claims 1 to 6, comprising dipentaerythritol hexa (meth) acrylate as the radical polymerizable organic compound. カチオン重合性有機化合物（ａ）として水素添加ビスフェノールＡジグリシジルエーテルを含有し、ラジカル重合性有機化合物としてジペンタエリスリトールヘキサ（メタ）アクリレートを含有する請求項１〜７のいずれか１項に記載の光学的造形用樹脂組成物。  The hydrogenated bisphenol A diglycidyl ether is contained as the cationically polymerizable organic compound (a), and dipentaerythritol hexa (meth) acrylate is contained as the radically polymerizable organic compound. A resin composition for optical modeling. オキセタン基を有する化合物を、カチオン重合性有機化合物（ａ）１００質量部に対して、１〜１００質量部の割合で含有する請求項１〜８のいずれか１項に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable composition according to any one of claims 1 to 8, wherein the compound having an oxetane group is contained at a ratio of 1 to 100 parts by mass with respect to 100 parts by mass of the cationically polymerizable organic compound (a). Resin composition. 光学的立体造形用樹脂組成物である請求項１〜９のいずれか１項に記載の活性エネルギー線硬化性樹脂組成物。  The active energy ray-curable resin composition according to any one of claims 1 to 9, which is a resin composition for optical three-dimensional modeling.
JP2001056834A 2001-03-01 2001-03-01 Active energy ray-curable resin composition for optical three-dimensional modeling Expired - Lifetime JP3974336B2 (en)

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JP2002256062A JP2002256062A (en) 2002-09-11
JP2002256062A5 true JP2002256062A5 (en) 2005-08-04
JP3974336B2 JP3974336B2 (en) 2007-09-12

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Publication number Priority date Publication date Assignee Title
AU2003224516A1 (en) * 2002-05-03 2003-11-17 Dsm Ip Assets B.V. Radiation curable resin composition and rapid prototyping process using the same
WO2004113396A1 (en) * 2003-06-25 2004-12-29 Cmet Inc. Actinic-energy-ray-curable stereolithographic resin composition with improved stability
JP5111774B2 (en) * 2006-04-04 2013-01-09 シーメット株式会社 Optical three-dimensional resin composition
JP5763944B2 (en) * 2011-03-25 2015-08-12 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, resist pattern forming method and conductor pattern manufacturing method
EP2842980B1 (en) 2013-08-09 2021-05-05 DSM IP Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
JP2015152854A (en) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
JP6388570B2 (en) * 2015-09-29 2018-09-12 富士フイルム株式会社 Laminated film and method for producing the same, polarizing plate, liquid crystal panel, and liquid crystal display device
JP6097815B1 (en) * 2015-12-18 2017-03-15 古河電気工業株式会社 Adhesive composition, adherend bonding method using the same, and laminate manufacturing method
JP6949458B2 (en) * 2016-03-30 2021-10-13 株式会社Adeka Curable composition, method for producing cured product, and cured product thereof
JP2020075941A (en) * 2016-12-05 2020-05-21 Dic株式会社 Photosetting resin composition for optical solid molding used for forming a solid molded article for surgical guide
EP3946946A4 (en) * 2019-03-28 2022-08-31 Henkel AG & Co. KGaA Photo-curable compositions for additive manufacturing
CN114829505B (en) * 2020-01-30 2024-05-03 株式会社大赛璐 Molded body, precursor thereof, method for producing same, and use thereof

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