JP2003192765A - エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法 - Google Patents

エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法

Info

Publication number
JP2003192765A
JP2003192765A JP2002241364A JP2002241364A JP2003192765A JP 2003192765 A JP2003192765 A JP 2003192765A JP 2002241364 A JP2002241364 A JP 2002241364A JP 2002241364 A JP2002241364 A JP 2002241364A JP 2003192765 A JP2003192765 A JP 2003192765A
Authority
JP
Japan
Prior art keywords
component
anhydride
encapsulant
epoxy resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002241364A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003192765A5 (https=
Inventor
Gary William Yeager
ゲーリー・ウィリアム・イェーガー
Malgorzata Iwona Rubinsztajn
マウゴジャータ・イヴォナ・ルビンシュタイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2003192765A publication Critical patent/JP2003192765A/ja
Publication of JP2003192765A5 publication Critical patent/JP2003192765A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2002241364A 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法 Pending JP2003192765A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/935,369 US6617400B2 (en) 2001-08-23 2001-08-23 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
US09/935369 2001-08-23

Publications (2)

Publication Number Publication Date
JP2003192765A true JP2003192765A (ja) 2003-07-09
JP2003192765A5 JP2003192765A5 (https=) 2005-11-04

Family

ID=25467000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002241364A Pending JP2003192765A (ja) 2001-08-23 2002-08-22 エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法

Country Status (3)

Country Link
US (2) US6617400B2 (https=)
EP (1) EP1285939A1 (https=)
JP (1) JP2003192765A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005524737A (ja) * 2002-05-06 2005-08-18 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 波長変換する反応性樹脂材料及び発光ダイオード素子
JP2007106853A (ja) * 2005-10-13 2007-04-26 Sumitomo Bakelite Co Ltd 透明複合体
JP2009506153A (ja) * 2005-08-25 2009-02-12 アルタナ エレクトリカル インシュレイション ゲゼルシャフト ミット ベシュレンクテル ハフツング 被覆材料
KR20130118339A (ko) 2010-11-05 2013-10-29 가부시키가이샤 닛폰 쇼쿠바이 카티온 경화성 수지 조성물
JP2015034297A (ja) * 2014-10-23 2015-02-19 株式会社ダイセル 硬化性エポキシ樹脂組成物

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US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
JP4102112B2 (ja) * 2002-06-06 2008-06-18 株式会社東芝 半導体装置及びその製造方法
US20030236388A1 (en) * 2002-06-12 2003-12-25 General Electric Company Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
JP4131243B2 (ja) * 2004-02-06 2008-08-13 セイコーエプソン株式会社 電気光学装置の製造方法、電気光学装置、及び電子機器
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
KR100665373B1 (ko) * 2006-02-21 2007-01-09 삼성전기주식회사 발광다이오드 패키지
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
JP5207658B2 (ja) * 2007-05-17 2013-06-12 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置
EP2194085B1 (en) * 2007-09-27 2018-01-03 Mitsubishi Gas Chemical Company, Inc. Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
JP5675230B2 (ja) * 2010-09-03 2015-02-25 株式会社ダイセル 熱硬化性エポキシ樹脂組成物及びその用途
JP5629009B2 (ja) 2010-09-15 2014-11-19 ヘンケル アイルランド リミテッド 二成分系シアノアクリレート／カチオン硬化性接着剤システム
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
KR101905938B1 (ko) 2012-04-27 2018-10-08 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체
TWI494339B (zh) 2012-10-23 2015-08-01 Ind Tech Res Inst 部分酯化環氧樹脂及應用其製成之環氧樹脂組成物及其製法
CA2905948C (en) 2013-03-14 2022-01-11 Board Of Regents Of The University Of Nebraska Methods, systems, and devices relating to robotic surgical devices, end effectors, and controllers
US8981027B2 (en) 2013-03-15 2015-03-17 Henkel IP & Holding GmbH Two-part, cyanoacrylate/cationically curable adhesive systems
CN103980231B (zh) * 2014-06-04 2016-03-30 中国科学院上海有机化学研究所 一种五氟苯基环氧丙烷的合成方法
EP3263621B1 (de) * 2016-07-01 2020-03-11 ZoE GmbH & Co. KG Epoxidharzmischung als giessharz
CN115337111B (zh) 2016-11-22 2025-04-25 内布拉斯加大学董事会 改进的粗定位装置及相关系统和方法
WO2018112199A1 (en) 2016-12-14 2018-06-21 Virtual Incision Corporation Releasable attachment device for coupling to medical devices and related systems and methods
GB2576792B (en) 2018-08-13 2022-09-14 Henkel Ag & Co Kgaa A two-part cyanoacrylate curable adhesive system
GB2576791B (en) 2018-08-13 2022-09-14 Henkel Ag & Co Kgaa A two-part cyanoacrylate curable adhesive system
GB2582537B (en) 2019-03-04 2022-02-23 Henkel IP & Holding GmbH Two-part, cyanoacrylate/cationically curable adhesive systems
CN115843233A (zh) 2020-07-06 2023-03-24 虚拟切割有限公司 手术机器人定位系统及相关装置和方法
KR20250026849A (ko) 2022-06-28 2025-02-25 헨켈 아게 운트 코. 카게아아 수중 결합 방법

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US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005524737A (ja) * 2002-05-06 2005-08-18 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 波長変換する反応性樹脂材料及び発光ダイオード素子
JP2009506153A (ja) * 2005-08-25 2009-02-12 アルタナ エレクトリカル インシュレイション ゲゼルシャフト ミット ベシュレンクテル ハフツング 被覆材料
JP2007106853A (ja) * 2005-10-13 2007-04-26 Sumitomo Bakelite Co Ltd 透明複合体
KR20130118339A (ko) 2010-11-05 2013-10-29 가부시키가이샤 닛폰 쇼쿠바이 카티온 경화성 수지 조성물
JP2015034297A (ja) * 2014-10-23 2015-02-19 株式会社ダイセル 硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
US6617400B2 (en) 2003-09-09
US20030071367A1 (en) 2003-04-17
US20030208009A1 (en) 2003-11-06
EP1285939A1 (en) 2003-02-26
US6878783B2 (en) 2005-04-12

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