JP2003179317A5 - - Google Patents

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Publication number
JP2003179317A5
JP2003179317A5 JP2001376322A JP2001376322A JP2003179317A5 JP 2003179317 A5 JP2003179317 A5 JP 2003179317A5 JP 2001376322 A JP2001376322 A JP 2001376322A JP 2001376322 A JP2001376322 A JP 2001376322A JP 2003179317 A5 JP2003179317 A5 JP 2003179317A5
Authority
JP
Japan
Prior art keywords
wiring board
flexible wiring
electrically insulating
conductive
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001376322A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003179317A (ja
JP4063533B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2001376322A external-priority patent/JP4063533B2/ja
Priority to JP2001376322A priority Critical patent/JP4063533B2/ja
Priority to US10/308,212 priority patent/US6737589B2/en
Priority to FI20022140A priority patent/FI120997B/fi
Priority to KR10-2002-0077836A priority patent/KR100496485B1/ko
Priority to CNB021540985A priority patent/CN1269388C/zh
Publication of JP2003179317A publication Critical patent/JP2003179317A/ja
Publication of JP2003179317A5 publication Critical patent/JP2003179317A5/ja
Publication of JP4063533B2 publication Critical patent/JP4063533B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001376322A 2001-12-10 2001-12-10 フレキシブル配線板 Expired - Fee Related JP4063533B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001376322A JP4063533B2 (ja) 2001-12-10 2001-12-10 フレキシブル配線板
US10/308,212 US6737589B2 (en) 2001-12-10 2002-12-02 Flexible printed wiring board
FI20022140A FI120997B (fi) 2001-12-10 2002-12-04 Taipuisa piirilevy
KR10-2002-0077836A KR100496485B1 (ko) 2001-12-10 2002-12-09 플렉시블 배선판
CNB021540985A CN1269388C (zh) 2001-12-10 2002-12-10 柔性配线板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001376322A JP4063533B2 (ja) 2001-12-10 2001-12-10 フレキシブル配線板

Publications (3)

Publication Number Publication Date
JP2003179317A JP2003179317A (ja) 2003-06-27
JP2003179317A5 true JP2003179317A5 (https=) 2005-07-07
JP4063533B2 JP4063533B2 (ja) 2008-03-19

Family

ID=19184539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001376322A Expired - Fee Related JP4063533B2 (ja) 2001-12-10 2001-12-10 フレキシブル配線板

Country Status (5)

Country Link
US (1) US6737589B2 (https=)
JP (1) JP4063533B2 (https=)
KR (1) KR100496485B1 (https=)
CN (1) CN1269388C (https=)
FI (1) FI120997B (https=)

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US7116522B2 (en) * 2003-05-19 2006-10-03 Hewlett-Packard Development Company, L.P. System and method related to a flexible circuit
US20070013041A1 (en) * 2003-06-02 2007-01-18 Satoru Ishigaki Flexible wiring board and flex-rigid wiring board
EP1551037A1 (de) * 2004-01-05 2005-07-06 Alcan Technology & Management Ltd. Flexibler Träger mit elektrisch leitfähiger Struktur
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JP2007005782A (ja) * 2005-05-27 2007-01-11 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
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US7518831B2 (en) * 2005-10-04 2009-04-14 Certance Llc Low impedance flexible circuit for tape head
US7685392B2 (en) 2005-11-28 2010-03-23 International Business Machines Corporation Providing indeterminate read data latency in a memory system
KR100666224B1 (ko) * 2006-02-27 2007-01-09 삼성전자주식회사 개구를 가지는 리지드 플렉시블 인쇄회로기판
JP4912960B2 (ja) * 2007-06-06 2012-04-11 日本メクトロン株式会社 プリント配線板
JP5000451B2 (ja) * 2007-10-15 2012-08-15 日東電工株式会社 配線回路基板
KR100956238B1 (ko) * 2007-12-18 2010-05-04 삼성전기주식회사 굴곡성 인쇄회로기판 및 그 제조방법
JP2009188379A (ja) * 2008-01-07 2009-08-20 Nitto Denko Corp 配線回路基板
JP2009177030A (ja) * 2008-01-25 2009-08-06 Opnext Japan Inc 光送信モジュール及び光伝送装置
KR100987191B1 (ko) 2008-04-18 2010-10-11 (주)기가레인 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판
US7812258B2 (en) * 2008-04-23 2010-10-12 Hitachi Global Storage Technologies Netherlands, B.V. Flex cable with biased neutral axis
JP2009302342A (ja) * 2008-06-13 2009-12-24 Denso Corp 多層基板及びその設計方法
US20110199741A1 (en) * 2008-11-19 2011-08-18 Sharp Kabushiki Kaisha Flexible substrate and display device provided with same
JP5407404B2 (ja) * 2009-02-19 2014-02-05 ソニー株式会社 配線基板とその製造方法、チューナモジュール、及び電子機器
CN102474978B (zh) * 2009-07-13 2015-08-19 株式会社村田制作所 信号线路及其制造方法
JP5354018B2 (ja) 2009-08-11 2013-11-27 株式会社村田製作所 多層基板
KR101130697B1 (ko) * 2010-05-07 2012-04-02 삼성전자주식회사 복수 층의 신축성 배선
JP5668854B2 (ja) 2011-07-05 2015-02-12 株式会社村田製作所 フレキシブル多層基板
JP5703525B2 (ja) * 2011-08-23 2015-04-22 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及び該フレキシブルプリント配線板の製造方法
US9131602B2 (en) * 2012-02-24 2015-09-08 Mediatek Inc. Printed circuit board for mobile platforms
WO2014065172A1 (ja) * 2012-10-26 2014-05-01 株式会社村田製作所 フレキシブル基板
US9560748B2 (en) 2013-01-04 2017-01-31 Bose Corporation Flexible printed circuit
KR101473312B1 (ko) * 2013-05-31 2014-12-16 삼성디스플레이 주식회사 플렉시블 터치스크린패널과 그것을 구비한 플렉시블 디스플레이 장치
KR102062108B1 (ko) * 2013-06-10 2020-01-03 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
CN104349575B (zh) * 2013-07-31 2017-12-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
JP5658399B1 (ja) 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
TWI552039B (zh) * 2014-06-27 2016-10-01 群創光電股份有限公司 觸控顯示裝置
KR102320382B1 (ko) * 2015-01-28 2021-11-02 삼성디스플레이 주식회사 전자 장치
JP6426067B2 (ja) * 2015-08-06 2018-11-21 日本メクトロン株式会社 多層フレキシブルプリント配線板およびその製造方法
US10111329B2 (en) * 2015-12-18 2018-10-23 Portwell Inc. Flexible flat cable structure capable of improving crosstalk interference
CN105407632B (zh) * 2015-12-29 2018-06-29 广东欧珀移动通信有限公司 柔性电路板走线结构及移动终端
KR102890025B1 (ko) * 2019-08-29 2025-11-25 삼성전자주식회사 인쇄회로 기판 및 그를 포함하는 전자 장치
CN113766725B (zh) * 2020-06-03 2023-06-20 鹏鼎控股(深圳)股份有限公司 高频电路板及其制作方法
CN222366419U (zh) * 2022-12-30 2025-01-17 荣耀终端有限公司 电子设备

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JPH0837351A (ja) * 1994-07-21 1996-02-06 Amp Japan Ltd フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
JP3263705B2 (ja) * 1995-09-21 2002-03-11 三菱電機株式会社 プリント配線板およびフラットパネル・ディスプレイ駆動回路用プリント配線板およびフラットパネル・ディスプレイ装置
JP3062435B2 (ja) * 1995-11-10 2000-07-10 日本碍子株式会社 フレキシブル基板並びにそれに用いるＢｅ−Ｃｕ合金箔およびその製造方法
JPH10303521A (ja) * 1997-04-23 1998-11-13 Hitachi Ltd 伝送線路基板
US6495770B2 (en) * 2000-12-04 2002-12-17 Intel Corporation Electronic assembly providing shunting of electrical current
US20020189854A1 (en) * 2001-04-10 2002-12-19 Crumly William R. Design for long fatigue life in flexible circuits

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