M339184 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種電子裝置，且特別是有關於一種 其軟性印刷電路板具有分段式金屬層之電子裝置。 【先前技術】 軟性印刷電路板（Flexible Print Circuit Board，FPCB ) ~ 具有可撓性並可將電子元件設置於柔軟之基材上，因此業 鲁 界係將軟性印刷電路板應用於多種電子產品，以達到小型 化之特性。 由於軟性印刷電路板可能因外界（如人體）產生之靜 電而造成電子元件損壞，因此傳統之軟性印刷電路板係利 用一金屬層覆蓋於基材上以釋放軟性印刷電路板之靜 電。然而傳統之軟性印刷電路板由於全面性鋪金屬層而導 致撓折性不佳，即造成較大之反彈力，此外更具有以下缺 點： ' ·· 第一、由於反彈力較大，因此產品組裝時需花費較多 力氣而造成組裝困難度提高及效率降低。 第二、反彈力過大容易導致元件貼附不牢固或產生元 件跳脫短路的情況發生，因而降低產品信賴度。 第三、反彈力過大容易造成產品連結器接合時元件錫 裂之問題。 6 M339184 【新型内容】 有鐘於此，本* 性印刷電路板中，131係有關於—種電子裝置，係將其軟 屬層之開Π係位心f/^口之金屬層設置於基材上，且金 曲後具有較佳之之折f區處，使軟性印刷電路板撓 根據本新型之〜 一電子元件、一第: 提出一種電子裝置，包括一第 印刷電路板，板電Γ =:::=括:基材及丄基材之 :與!;;子元件間形成有心二Γ70 區。金屬層係設置於基材 妍弓 -開口以對應地暴露出折f Μ面#且金屬層具有至少 ^n出折弓Q。弟一表面係位於彎折位置 之外緣面，弟一表面係位於彎折位置之内緣面。 為讓本新型之上述内容能更明顯易懂，下文特舉 佳實施例，並配合所附圖式’作詳細說明如下： 乂 【實施方式】 請參照第1圖’騎示依照本新型較佳實施例的一種 電子裝置的剖面圖。電子裝置10包括—軟性印刷電路板 100、-第-電子元件200及-第二電子元件3⑽。軟性印 刷電路板100之兩端分別連結於第一電子元件200及第二 電子元件300，且軟性印刷電路板100包括—基材11〇及 一第一金屬層120。基材110之兩面分別形成為一第一表 7 M339184 面110a及一第二表面110b。基材110呈撓折性並於第一 電子元件200與第二電子元件300間形成呈彎折狀態之至 少一折彎區D。第一金屬層120設置於基材110之第一表 面110a，且具有至少一開口 121以對應地暴露出折彎區D。 第2圖繪示軟性印刷電路板撓折後電子裝置之剖面 圖。當軟性印刷電路板100撓曲時係連結第一電子元件2〇〇 • 及第二電子元件300，位於折彎區D之基板110藉由開口 ^ 1 2 1之設置呈裸露狀，且第一表面1 1 〇a位於彎折位置之外 # 緣面，第二表面ll〇b位於彎折位置之内緣面。由於第一 金屬層120之開口 121暴露出折彎區D，因此軟性印刷電 路板100之折彎區D不受第一金屬層120剛性的影響，而 具有較佳之撓折性。 弟一金屬層120之材質較佳地為銅，具有較佳導電 性，然第一金屬層120亦可為其他金屬或類金屬之導電材 質。再者，第一金屬層120係連接至一接地端（未繪示於 圖中），因此當靜電施加於軟性印刷電路板100時，靜電 會由接地端被導引至外部，而不會施加於電子元件，造成 損壞或因靜電產生雜訊。 進一步來說，軟性印刷電路板100更包括一第一絕緣 層13〇覆蓋於部份之第一金屬層120，並暴露出鄰近開口 121之部份第一金屬層12〇。第一絕緣層13〇具有防止第 一金屬層120氧化之功能，並可隔絕大部份之第一金屬層 120受外界之塵埃和溼氣汙染。於本實施例中，第一絕緣 層130之材貝係為聚亞醯胺其具有耐熱性 8 M339184 高、強度高、厚度薄及絕緣性佳等效果，然第一絕緣層130 亦可為其他具有絕緣性之材質。 一般來說，軟性印刷電路板1〇〇通常設置於接近電子 裝置10之外殼處。靜電容易經由電子裝置10之外殼處進 入而隨機地施加於軟性印刷電路板100、第一電子元件200 及第二電子元件300。雖然軟性印刷電路板100上之第一 絕緣層130具有抗高壓靜電之功能，然而只有絕緣層無法 達到完整的靜電防護功能。有鑑於此，本新型係藉由軟性 印刷電路板100外露之第一金屬層120吸收靜電並導引靜 電至接地端，以確保軟性印刷電路板100、第一電子元件 200及第二電子元件300不會受到靜電作用而損壞，而達 到全面性的靜電防護功能。 另外，於此本實施例中，軟性印刷電路板1〇〇係以雙 層板（double-sided FPC )為例作說明。如第2圖所示，軟 性印刷電路板100包括一導線層140及一第二絕緣層 150。導線層140係位於基材110之第二表面11〇b，且第 二絕緣層150係覆蓋於導線層140。然而軟性印刷電路板 1〇〇並不限定為雙層板，亦可為單層板（single_sidedFPC) 或多層板（multilayer-sided FPC )。 如第2圖所示，軟性印刷電路板1〇〇撓折後係連接第 一電子元件200及第二電子元件3〇〇。第一電子元件2〇〇 例如疋印刷電路板並包括連接器21 〇，使軟性印刷電路板 100之一端固定於連接器210’藉此以電性連結軟性印刷 電路板100及第一電子元件200。第二電子元件3〇〇例如 9 •M339184 是液晶顯示模組（Liquid Crystal Display Module，LCM )，而軟 性印刷電路板100之第二絕緣層150係部分地覆蓋導線層 14〇，且軟性印刷電路板之一端的導線層係暴露 於外’用以連接至連接器210。 、、此外，第一電子元件200的厚度為T，且連接器21〇 7為厚度Η，且待折彎處D之寬度至少大於連接器21〇之 3 及第一電子元件2⑼之厚度τ為直徑之弧形長度， 即 7Γ (H+T)/2。 第3圖繪示第1圖之軟性印刷電路板的俯視圖。於本 亦，例中，第一金屬層120可設為網狀，且第一金屬層120 7、可為整面式金屬層。而本實施例之第一金屬層120之開 的邊線121a係為直線，或第一金屬層12〇之開口 21的邊線可為不規則狀。 心明參照第4A〜第4C圖，其繪示本新型之其他實施例 “車人〖生印刷電路板的俯視圖。如第4Α圖所示，軟性印刷 =路板10〇a中第一金屬層12〇之開口 121的邊線121b係 :規則之波浪狀。如弟4B圖所示，軟性印刷電路板1 〇〇b 形一，屬層120之開口 121的邊線121c係為等距多邊 如第4C圖所示，軟性印刷電路板1〇〇c中第一金屬層 電之開口 121的邊線i21d係為不等距多邊形。軟性印刷 置路板可具有不同形狀之邊線，因此可根據其他元件之配 方式決定軟性印刷電路板之邊線的形狀，以增加軟性印 刷電路的結構強度。 明參照第5圖’其繪示於折彎區具有第三電子元件之 M339184 軟性印刷電路板的示意圖。軟性印刷電路板麵於折彎 區D。又有至v第一電子元件17〇 ’且軟性印刷電路板 l〇〇d於電子元件17〇周緣設有一第二金屬層議。藉由第 三電子元件170設置於折蠻F Λ W 3 & D’使軟性印刷電路板1〇〇d 具有多樣化之配置’且設置第二金屬116〇於電子元件i7〇 周圍能吸收靜電’以避免靜電施加於第三電子元件i7〇所 造成損壞或因靜電而產生之雜訊。 於本實施例中，「第一金屬層12〇」及「第二金屬層 160」係用以區分不同區域之金制，於實際應用時，第 一金屬層120、第二金屬層16〇係可為同一製程中形成。 此外，「第-絕緣㉟13〇」及「第二絕緣層15〇」係用以區 分不同區域之絕緣層，於實際應用時，第一絕緣層13〇及 第二絕緣層150係可為同一材質。 上述依照本新型較佳實施例之軟性印刷電路板，係將 金屬層設置於基材，且金屬層於對應基材之折彎區位置係 設為一開口，以裸露出基材之折彎區，不僅提高撓折性， 反彈力更由傳統之軟性印刷電路板的250g降低至147g ; 以下僅列舉部分其他優點說明如下： 弟一、由於反淨力降低’因此提南產品組裝時之容易 度進而提南組裝效率。 第二、由於反彈力降低，因此可有效地降低元件貼附 不牢固或元件跳脫短路之情況，進而提高產品信賴度並提 升產品良率。 第三、以可釋放高壓靜電之一儀器測試依本新型較佳 11 •M339184 實施例之軟性印刷電路板，其可承受之靜電放電 (electrostatic discharge，ESD)值可提升至 20KV，因此 可有效地牽引靜電。 綜上所述，雖然本新型已以較佳實施例揭露如上，然 其並非用以限定本新型。本新型所屬技術領域中具有通常 • 知識者，在不脫離本新型之精神和範圍内，當可作各種之 - 更動與潤飾。因此，本新型之保護範圍當視後附之申請專 • 利範圍所界定者為準。 12 •M3 39184 【圖式簡單說明】 第1圖繪示依照本新型較佳實施例的一種電子裝置 的剖面圖； 第2圖繪示軟性印刷電路板撓折後電子裝置之剖面 圖， 第3圖繪示第1圖之軟性印刷電路板的俯視圖； 第4A〜4C圖繪示本新型之其他實施例之軟性印刷電 路板的俯視圖；以及 第5圖繪示於折彎區具有第三電子元件之軟性印刷 電路板的不意圖。 主要元件符號說明】 10 :電子裝置M339184 VIII. New Description: [New Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having a flexible printed circuit board having a segmented metal layer. [Prior Art] Flexible Print Circuit Board (FPCB) ~ Flexible and can be used to place electronic components on a soft substrate. Therefore, the company has applied flexible printed circuit boards to various electronic products. In order to achieve the characteristics of miniaturization. Since a flexible printed circuit board may cause damage to electronic components due to static electricity generated by the outside (e.g., a human body), a conventional flexible printed circuit board is covered with a metal layer to release static electricity of the flexible printed circuit board. However, the conventional flexible printed circuit board has poor flexibility due to the comprehensive metallization layer, which causes a large rebound force, and further has the following disadvantages: '·· First, due to the large rebound force, the product assembly It takes a lot of effort to increase assembly difficulty and reduce efficiency. Second, if the rebound force is too large, the component may be attached weakly or the component may be short-circuited, thereby reducing product reliability. Third, the excessive rebound force is likely to cause the problem of cracking of the component when the product connector is joined. 6 M339184 [New content] There is a clock in this, in the * printed circuit board, the 131 series has an electronic device, the metal layer of the open layer of the soft layer is set at the base On the material, and after the golden koji, there is a better folding area, so that the flexible printed circuit board is flexed according to the present invention~ an electronic component, a first: an electronic device, including a first printed circuit board, the board Γ =: ::= Included: Substrate and tantalum substrate: and !;; The metal layer is disposed on the substrate bow-opening to correspondingly expose the fold surface 且 and the metal layer has at least ^n exit bow Q. The surface of the younger brother is located at the outer edge of the bending position, and the surface of the younger brother is located at the inner edge of the bending position. In order to make the above-mentioned content of the present invention more obvious and easy to understand, the following detailed description is given to the preferred embodiment, and the following description is used to describe the following: 乂 [Embodiment] Please refer to FIG. 1 'The riding is better according to the present invention. A cross-sectional view of an electronic device of an embodiment. The electronic device 10 includes a flexible printed circuit board 100, a - electronic component 200, and a second electronic component 3 (10). The two ends of the flexible printed circuit board 100 are respectively connected to the first electronic component 200 and the second electronic component 300, and the flexible printed circuit board 100 includes a substrate 11A and a first metal layer 120. The two sides of the substrate 110 are formed as a first surface 7 M339184 surface 110a and a second surface 110b, respectively. The substrate 110 is flexible and forms at least one bending zone D between the first electronic component 200 and the second electronic component 300 in a bent state. The first metal layer 120 is disposed on the first surface 110a of the substrate 110 and has at least one opening 121 to correspondingly expose the bend region D. Figure 2 is a cross-sectional view showing the electronic device after the flexible printed circuit board is flexed. When the flexible printed circuit board 100 is flexed, the first electronic component 2 and the second electronic component 300 are connected, and the substrate 110 located in the bending zone D is exposed by the opening ^ 1 2 1 and is first. The surface 1 1 〇a is located outside the bending position # 缘面, and the second surface ll 〇b is located at the inner edge surface of the bending position. Since the opening 121 of the first metal layer 120 exposes the bending zone D, the bending zone D of the flexible printed circuit board 100 is not affected by the rigidity of the first metal layer 120, and has better flexibility. The material of the metal layer 120 is preferably copper and has good conductivity. However, the first metal layer 120 may also be a conductive material of other metals or metalloids. Furthermore, the first metal layer 120 is connected to a ground terminal (not shown), so when static electricity is applied to the flexible printed circuit board 100, static electricity is guided to the outside by the ground without being applied. In the case of electronic components, causing damage or noise due to static electricity. Further, the flexible printed circuit board 100 further includes a first insulating layer 13 covering a portion of the first metal layer 120 and exposing a portion of the first metal layer 12A adjacent to the opening 121. The first insulating layer 13 has a function of preventing oxidation of the first metal layer 120, and can isolate most of the first metal layer 120 from external dust and moisture. In the present embodiment, the material of the first insulating layer 130 is polyamidene, which has the effects of high heat resistance 8 M339184, high strength, thin thickness and good insulation, and the first insulating layer 130 may be other Insulating material. Generally, the flexible printed circuit board 1 is usually disposed near the outer casing of the electronic device 10. The static electricity is easily applied to the flexible printed circuit board 100, the first electronic component 200, and the second electronic component 300 at random through the outer casing of the electronic device 10. Although the first insulating layer 130 on the flexible printed circuit board 100 has a function of resisting high voltage static electricity, only the insulating layer cannot achieve complete electrostatic protection. In view of this, the present invention absorbs static electricity by the first metal layer 120 exposed by the flexible printed circuit board 100 and guides the static electricity to the ground to ensure the flexible printed circuit board 100, the first electronic component 200, and the second electronic component 300. It is not damaged by static electricity and achieves comprehensive electrostatic protection. Further, in the present embodiment, the flexible printed circuit board 1 is described by taking a double-sided FPC as an example. As shown in Fig. 2, the flexible printed circuit board 100 includes a wire layer 140 and a second insulating layer 150. The wire layer 140 is on the second surface 11b of the substrate 110, and the second insulating layer 150 is over the wire layer 140. However, the flexible printed circuit board is not limited to a double layer board, and may be a single layer (single_sided FPC) or a multilayer board (multilayer-sided FPC). As shown in Fig. 2, after the flexible printed circuit board 1 is folded, the first electronic component 200 and the second electronic component 3 are connected. The first electronic component 2 is, for example, a printed circuit board and includes a connector 21 〇, and one end of the flexible printed circuit board 100 is fixed to the connector 210 ′ to electrically connect the flexible printed circuit board 100 and the first electronic component 200 . . The second electronic component 3, for example, 9 • M339184 is a liquid crystal display module (LCM), and the second insulating layer 150 of the flexible printed circuit board 100 partially covers the wire layer 14〇, and the flexible printed circuit The wire layer at one end of the board is exposed to the outside 'for connection to the connector 210. In addition, the thickness of the first electronic component 200 is T, and the connector 21〇7 is a thickness Η, and the width of the portion D to be bent is at least greater than the thickness of the connector 21〇3 and the thickness τ of the first electronic component 2(9). The arc length of the diameter, ie 7 Γ (H+T)/2. Fig. 3 is a plan view showing the flexible printed circuit board of Fig. 1. In this example, the first metal layer 120 may be formed in a mesh shape, and the first metal layer 120 7 may be a full-surface metal layer. The edge 121a of the first metal layer 120 of the present embodiment is a straight line, or the edge of the opening 21 of the first metal layer 12 can be irregular. Referring to Figures 4A to 4C, the other embodiments of the present invention are shown in a top view of the printed circuit board of the vehicle. As shown in Fig. 4, the flexible printing = the first metal layer in the road board 10〇a The edge 121b of the opening 121 of the 12's opening is a regular wave shape. As shown in the middle of FIG. 4B, the flexible printed circuit board 1b is shaped like a one, and the edge 121c of the opening 121 of the layer 120 is equilaterally multilateral as the 4C. As shown in the figure, the edge i21d of the opening 121 of the first metal layer in the flexible printed circuit board 1〇〇c is an unequal polygon. The flexible printed circuit board can have different shapes of edges, so that it can be matched according to other components. The method determines the shape of the edge of the flexible printed circuit board to increase the structural strength of the flexible printed circuit. Referring to Figure 5, a schematic diagram of the M339184 flexible printed circuit board having the third electronic component in the bend region is shown. Soft printed circuit The board surface is in the bending area D. There is a second electronic component 17〇' and the flexible printed circuit board 10〇〇d is provided with a second metal layer on the periphery of the electronic component 17. The third electronic component 170 is disposed. In Fantasy F Λ W 3 & D' makes the flexible printed circuit board 1〇〇d have a variety of configurations' and the second metal 116 is disposed around the electronic component i7〇 to absorb static electricity' to avoid damage caused by static electricity applied to the third electronic component i7〇 In the present embodiment, the "first metal layer 12" and the "second metal layer 160" are used to distinguish different regions of gold. In practical applications, the first metal layer 120, The second metal layer 16 can be formed in the same process. In addition, the "first insulating layer 3513" and the "second insulating layer 15" are used to distinguish the insulating layers of different regions. In practical applications, the first insulating layer 13 and the second insulating layer 150 may be the same material. . In the above flexible printed circuit board according to the preferred embodiment of the present invention, the metal layer is disposed on the substrate, and the metal layer is disposed as an opening in the bent portion of the corresponding substrate to expose the bending region of the substrate. Not only improve the flexibility, but also reduce the rebound force from 250g of traditional flexible printed circuit boards to 147g. The following are just some of the other advantages described as follows: Brother I, due to the reduction of the anti-net force, so the ease of assembly of the product In turn, the assembly efficiency of the South. Second, since the rebound force is reduced, it is possible to effectively reduce the component sticking or the component tripping short circuit, thereby improving product reliability and improving product yield. Thirdly, the flexible printed circuit board according to the preferred embodiment of the present invention, which is capable of withstanding the electrostatic discharge (ESD) value, can be increased to 20 kV, so that it can be effectively used. Traction static electricity. In summary, although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. In the technical field of the present invention, it is common for those skilled in the art to make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the application. 12 M3 39184 [Simplified description of the drawings] Fig. 1 is a cross-sectional view showing an electronic device according to a preferred embodiment of the present invention; and Fig. 2 is a cross-sectional view showing the electronic device after flexing a flexible printed circuit board, 1A to 4C are plan views of a flexible printed circuit board according to another embodiment of the present invention; and FIG. 5 is a view showing a third electronic component in a bent portion. The intention of a flexible printed circuit board. Main component symbol description] 10: Electronic device
100、100a、100b、100c、100d :軟性印刷電路板 110 :基材 110a :第一表面 110b ··第二表面 120 :第一金屬層 121 :開口 121a， 〜121d :邊線 130 ： 第一絕緣層 140 ： 導線層 150 ： 第二絕緣層 160 ： 第二金屬層 13 •M339184 170 :第三電子元件 200 :第一電子元件 210 :連接器 300 :第二電子元件 D :折彎區 Η:連接器之厚度 Τ:第一電子元件之厚度100, 100a, 100b, 100c, 100d: flexible printed circuit board 110: substrate 110a: first surface 110b · second surface 120: first metal layer 121: opening 121a, ~121d: edge 130: first insulating layer 140 : wire layer 150 : second insulating layer 160 : second metal layer 13 • M339184 170 : third electronic component 200 : first electronic component 210 : connector 300 : second electronic component D : bending zone Η : connector Thickness Τ: thickness of the first electronic component
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