US7745726B2 - Assembly structure - Google Patents
Assembly structure Download PDFInfo
- Publication number
- US7745726B2 US7745726B2 US12/125,250 US12525008A US7745726B2 US 7745726 B2 US7745726 B2 US 7745726B2 US 12525008 A US12525008 A US 12525008A US 7745726 B2 US7745726 B2 US 7745726B2
- Authority
- US
- United States
- Prior art keywords
- substrate
- medium layer
- assembly structure
- side edge
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24752—Laterally noncoextensive components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Definitions
- the invention relates to an assembly structure, and more particularly to an assembly structure suitable for being bent several times during the assembly process.
- the lead wires of the flexible circuit board are overlapped to electrically connect to the lead wires or contacts of the liquid crystal panel with respect to a side edge thereof, wherein the distributed lead wires of the flexible circuit board are perpendicular to the side edge of the liquid crystal panel.
- lead wires of the flexible circuit board may break.
- the invention provides an assembly structure.
- An embodiment of the assembly structure comprises a first substrate, a second substrate and a medium layer.
- the medium layer having a side edge is disposed between the first and second substrates.
- the second substrate comprises at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.
- the first substrate can be a panel.
- the second substrate can be a flexible circuit board.
- the medium layer can be an anisotropic conductive film.
- the lead wire of the second substrate is relatively oblique to the side edge of the medium layer, the bending angle of the lead wires of the second substrate can be reduced and the strength thereof can be increased, thus, the lifespan of the lead wire of the second substrate can be extended.
- FIG. 1 is a schematic view of an assembly structure of the invention
- FIG. 2A is a sectional view of the assembly structure along line (N-N) of FIG. 1 ;
- FIG. 2B is a top view of FIG. 2A .
- FIG. 1 is a schematic view of an assembly structure W
- FIG. 2A is a sectional view of the assembly structure W along line N-N of FIG. 1
- FIG. 2B is a top view of FIG. 2A .
- the assembly structure W comprises a first substrate 10 , a second substrate 20 , a medium layer K and a circuit board 21 .
- the first substrate 10 is a rectangular member having a top surface 10 u , a side edge 100 and a plurality of lead wires 101 (shown by longer dotted lines).
- the lead wires 101 are disposed on the top surface 10 u and extended toward the side edge 100 .
- the first substrate 10 is a liquid crystal panel, and the lead wires 101 are metallic wires.
- the second substrate 20 comprises a plurality of lead wires 201 .
- the lead wires 201 (shown by shorter dotted lines) of the second substrate 20 are disposed on the medium layer K with respect to the lead wires 101 of the first substrate 10 .
- the second substrate 20 is a flexible circuit board, e.g., chip on film (COF, and the medium layer K is an anisotropic conductive film.
- COF chip on film
- the second substrate 20 and the first substrate 10 are connected by the medium layer K
- the second substrate 20 is overlapped on the medium layer K by passing through the side edge k 100 of the medium layer K, thus, the lead wires 201 of the second substrate 20 and the lead wires 101 of the first substrate 10 are electrically connected.
- the lead wires 201 of the second substrate 20 projecting on the first substrate 10 have projected sections oblique to the side edge k 100 of the medium layer K, i.e., the lead wire 201 of the second substrate 20 are relatively oblique to the side edge k 100 of the medium layer K.
- the bending stress of the lead wires 201 of the second substrate 20 can be reduced because the lead wire 201 of the second substrate 20 is relatively oblique to the side edge k 100 of the medium layer K.
- both the robustness and the lifespan of the lead wire 201 of the second substrate 20 can be enhanced and extended.
- the second substrate 20 is overlapped on the medium layer K and the lead wires 201 of the second substrate 20 and the lead wires 101 of the first substrate 10 are electrically connected via the medium layer K, it is not limited thereto.
- the second substrate can be connected to the first substrate via interposing or clamping in other embodiments, or the lead wires of the first substrate can be replaced by electrical contacts.
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TWTW97111649 | 2008-03-31 | ||
TW97111649A | 2008-03-31 | ||
TW97111649A TWI334746B (en) | 2008-03-31 | 2008-03-31 | Assembly structure |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090246477A1 US20090246477A1 (en) | 2009-10-01 |
US7745726B2 true US7745726B2 (en) | 2010-06-29 |
Family
ID=41117696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/125,250 Expired - Fee Related US7745726B2 (en) | 2008-03-31 | 2008-05-22 | Assembly structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US7745726B2 (en) |
TW (1) | TWI334746B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9761560B2 (en) * | 2014-10-13 | 2017-09-12 | Samsung Display Co., Ltd. | Display device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5776971B2 (en) * | 2011-05-16 | 2015-09-09 | Nltテクノロジー株式会社 | Connection structure and display device including the connection structure |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3499098A (en) * | 1968-10-08 | 1970-03-03 | Bell Telephone Labor Inc | Interconnected matrix conductors and method of making the same |
US3678437A (en) * | 1970-12-30 | 1972-07-18 | Itt | Flat cable wafer |
US4426548A (en) * | 1981-02-13 | 1984-01-17 | Hitachi, Ltd. | Multilayer wiring structure |
US5484648A (en) * | 1993-08-11 | 1996-01-16 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector and method for the preparation thereof |
US5672400A (en) * | 1995-12-21 | 1997-09-30 | Minnesota Mining And Manufacturing Company | Electronic assembly with semi-crystalline copolymer adhesive |
US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
US6564450B2 (en) * | 1999-12-01 | 2003-05-20 | Leoni Bordnetz Sys Gmbh & Co | Contacting-making system for two printed circuit boards |
US6596947B1 (en) * | 2000-01-28 | 2003-07-22 | Sony Chemicals Corp. | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards |
US6636000B2 (en) * | 2000-10-06 | 2003-10-21 | Fujitsu Hitachi Plasma Display Limited | Plasma display device with flexible circuit boards and connectors |
US6884833B2 (en) * | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
-
2008
- 2008-03-31 TW TW97111649A patent/TWI334746B/en not_active IP Right Cessation
- 2008-05-22 US US12/125,250 patent/US7745726B2/en not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3499098A (en) * | 1968-10-08 | 1970-03-03 | Bell Telephone Labor Inc | Interconnected matrix conductors and method of making the same |
US3678437A (en) * | 1970-12-30 | 1972-07-18 | Itt | Flat cable wafer |
US4426548A (en) * | 1981-02-13 | 1984-01-17 | Hitachi, Ltd. | Multilayer wiring structure |
US5484648A (en) * | 1993-08-11 | 1996-01-16 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector and method for the preparation thereof |
US5672400A (en) * | 1995-12-21 | 1997-09-30 | Minnesota Mining And Manufacturing Company | Electronic assembly with semi-crystalline copolymer adhesive |
US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
US6564450B2 (en) * | 1999-12-01 | 2003-05-20 | Leoni Bordnetz Sys Gmbh & Co | Contacting-making system for two printed circuit boards |
US6596947B1 (en) * | 2000-01-28 | 2003-07-22 | Sony Chemicals Corp. | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards |
US6636000B2 (en) * | 2000-10-06 | 2003-10-21 | Fujitsu Hitachi Plasma Display Limited | Plasma display device with flexible circuit boards and connectors |
US6884833B2 (en) * | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9761560B2 (en) * | 2014-10-13 | 2017-09-12 | Samsung Display Co., Ltd. | Display device |
Also Published As
Publication number | Publication date |
---|---|
TW200942098A (en) | 2009-10-01 |
TWI334746B (en) | 2010-12-11 |
US20090246477A1 (en) | 2009-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: RAYDIUM SEMICONDUCTOR CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, MING-TE;CHEN, CHIN-YUNG;REEL/FRAME:021000/0549 Effective date: 20080509 Owner name: RAYDIUM SEMICONDUCTOR CORPORATION,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, MING-TE;CHEN, CHIN-YUNG;REEL/FRAME:021000/0549 Effective date: 20080509 |
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STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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FPAY | Fee payment |
Year of fee payment: 4 |
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MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552) Year of fee payment: 8 |
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LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20220629 |