JP2003131401A - 多層回路基板製造におけるマーキング装置 - Google Patents

多層回路基板製造におけるマーキング装置

Info

Publication number
JP2003131401A
JP2003131401A JP2001328514A JP2001328514A JP2003131401A JP 2003131401 A JP2003131401 A JP 2003131401A JP 2001328514 A JP2001328514 A JP 2001328514A JP 2001328514 A JP2001328514 A JP 2001328514A JP 2003131401 A JP2003131401 A JP 2003131401A
Authority
JP
Japan
Prior art keywords
mark
reference mark
circuit board
marking device
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001328514A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003131401A5 (enExample
Inventor
Ryoichi Ida
田 良 一 井
Katsuya Sannomiya
宮 勝 也 三
Katsumi Momose
瀬 克 己 百
Wataru Nakagawa
川 渉 中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adtec Engineering Co Ltd
Original Assignee
Adtec Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adtec Engineering Co Ltd filed Critical Adtec Engineering Co Ltd
Priority to JP2001328514A priority Critical patent/JP2003131401A/ja
Priority to KR1020020059708A priority patent/KR100880349B1/ko
Priority to US10/266,891 priority patent/US6597757B2/en
Priority to TW091123208A priority patent/TW545090B/zh
Priority to EP02023671A priority patent/EP1307079A1/en
Priority to CN02146078A priority patent/CN1414431A/zh
Publication of JP2003131401A publication Critical patent/JP2003131401A/ja
Publication of JP2003131401A5 publication Critical patent/JP2003131401A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2001328514A 2001-10-26 2001-10-26 多層回路基板製造におけるマーキング装置 Pending JP2003131401A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001328514A JP2003131401A (ja) 2001-10-26 2001-10-26 多層回路基板製造におけるマーキング装置
KR1020020059708A KR100880349B1 (ko) 2001-10-26 2002-10-01 다층 회로기판 제조용 표시장치
US10/266,891 US6597757B2 (en) 2001-10-26 2002-10-08 Marking apparatus used in a process for producing multi-layered printed circuit board
TW091123208A TW545090B (en) 2001-10-26 2002-10-08 Marking apparatus used in a process for producing multi-layered printed circuit board
EP02023671A EP1307079A1 (en) 2001-10-26 2002-10-22 Marking apparatus used in a process for producing multi-layered printed circuit board
CN02146078A CN1414431A (zh) 2001-10-26 2002-10-25 在多层印刷电路板的制造工艺中使用的标记设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001328514A JP2003131401A (ja) 2001-10-26 2001-10-26 多層回路基板製造におけるマーキング装置

Publications (2)

Publication Number Publication Date
JP2003131401A true JP2003131401A (ja) 2003-05-09
JP2003131401A5 JP2003131401A5 (enExample) 2005-03-10

Family

ID=19144569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001328514A Pending JP2003131401A (ja) 2001-10-26 2001-10-26 多層回路基板製造におけるマーキング装置

Country Status (6)

Country Link
US (1) US6597757B2 (enExample)
EP (1) EP1307079A1 (enExample)
JP (1) JP2003131401A (enExample)
KR (1) KR100880349B1 (enExample)
CN (1) CN1414431A (enExample)
TW (1) TW545090B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016758A (ja) * 2006-07-10 2008-01-24 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置
JP2013211389A (ja) * 2012-03-30 2013-10-10 Hitachi Chemical Co Ltd ガイドマーク設置装置、露光装置および多層配線基板の製造方法
KR101341873B1 (ko) 2006-03-27 2013-12-17 조르단 밸리 세미컨덕터즈 리미티드 Ｘ선을 사용한 오버레이 측정

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7178229B2 (en) * 2003-11-20 2007-02-20 E. I. Du Pont De Nemours And Company Method of making interlayer panels
US6981239B2 (en) * 2004-04-29 2005-12-27 Dell Products L.P. Method, system and apparatus for constructing resistive vias
KR100640865B1 (ko) * 2004-09-07 2006-11-02 엘지전자 주식회사 음성 품질 향상 방법 및 장치
DE102005053202A1 (de) * 2005-11-08 2007-05-10 Comet Gmbh Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen
JP2007310014A (ja) * 2006-05-16 2007-11-29 Shinko Electric Ind Co Ltd 配線基板の製造方法および配線基板の製造装置
KR100831593B1 (ko) * 2007-04-23 2008-05-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법, 비아홀 천공 장치
NL2004297A (en) 2009-03-20 2010-09-21 Asml Holding Nv Improving alignment target contrast in a lithographic double patterning process.
NL2004365A (en) * 2009-04-10 2010-10-12 Asml Holding Nv Method and system for increasing alignment target contrast.
CN103327743A (zh) * 2012-03-21 2013-09-25 深圳市万泰电路有限公司 一种针对线路板阻焊开窗2Mil以内的对位生产方法
CN103327744A (zh) * 2012-03-21 2013-09-25 深圳市万泰电路有限公司 一种提高线路板阻焊对位精度的生产方法
CN103197501B (zh) * 2013-02-19 2015-09-09 北京京东方光电科技有限公司 一种阵列基板及其制备方法和显示装置
CN104640370A (zh) * 2013-11-14 2015-05-20 台湾暹劲股份有限公司 一种多层电路板的条形码读取方法
CN109196339B (zh) 2016-04-04 2021-06-29 索雷克核研究中心 电子系统、验证电子系统的部件的兼容性的方法
US11029267B2 (en) 2016-04-04 2021-06-08 Security Matters Ltd. Method and a system for XRF marking and reading XRF marks of electronic systems
CN107797396B (zh) * 2016-09-07 2020-12-25 深圳莱宝高科技股份有限公司 导电薄膜对位标记制作方法
CN108697003A (zh) * 2017-04-09 2018-10-23 上海山泰柯电子有限公司 低温热循环电路板涂布干燥生产线
CN107592746A (zh) * 2017-08-23 2018-01-16 深圳崇达多层线路板有限公司 一种fpc阻焊曝光对位方法
CN107808933B (zh) * 2017-10-31 2020-03-10 京东方科技集团股份有限公司 一种制作盖板的方法、盖板以及显示装置
TWI699702B (zh) * 2019-01-24 2020-07-21 景碩科技股份有限公司 生產線編碼處理系統與方法
CN110549746A (zh) * 2019-09-06 2019-12-10 深圳市升达康科技有限公司 X-ray视觉识别机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4790694A (en) * 1986-10-09 1988-12-13 Loma Park Associates Method and system for multi-layer printed circuit board pre-drill processing
DE4240141A1 (de) * 1992-11-28 1994-06-01 Du Pont Deutschland Kennzeichenbares Photoresistmaterial
JP3450648B2 (ja) * 1997-05-09 2003-09-29 キヤノン株式会社 倍率補正装置および倍率補正装置を搭載したｘ線露光装置ならびにデバイス製造方法
DE69835962T2 (de) * 1997-12-11 2007-01-04 Ibiden Co., Ltd., Ogaki Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
JP3160252B2 (ja) * 1997-12-11 2001-04-25 イビデン株式会社 多層プリント配線板の製造方法
JP4343301B2 (ja) * 1999-01-26 2009-10-14 大日本印刷株式会社 露光装置
JP3219397B2 (ja) * 1999-11-24 2001-10-15 クローバー電子工業株式会社 多層プリント配線基板の製造方法及びそれに用いる製造装置
JP3802309B2 (ja) * 2000-03-28 2006-07-26 株式会社アドテックエンジニアリング 多層回路基板製造における位置合わせ装置及び露光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101341873B1 (ko) 2006-03-27 2013-12-17 조르단 밸리 세미컨덕터즈 리미티드 Ｘ선을 사용한 오버레이 측정
JP2008016758A (ja) * 2006-07-10 2008-01-24 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置
US7614787B2 (en) 2006-07-10 2009-11-10 Adtec Engineering Co., Ltd. Marking apparatus used in a process for producing multi-layered printed circuit board
JP2013211389A (ja) * 2012-03-30 2013-10-10 Hitachi Chemical Co Ltd ガイドマーク設置装置、露光装置および多層配線基板の製造方法

Also Published As

Publication number Publication date
US20030081719A1 (en) 2003-05-01
US6597757B2 (en) 2003-07-22
KR100880349B1 (ko) 2009-01-23
KR20030035872A (ko) 2003-05-09
EP1307079A1 (en) 2003-05-02
TW545090B (en) 2003-08-01
CN1414431A (zh) 2003-04-30

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