JP2002535151A5 - - Google Patents

Download PDF

Info

Publication number
JP2002535151A5
JP2002535151A5 JP2000585029A JP2000585029A JP2002535151A5 JP 2002535151 A5 JP2002535151 A5 JP 2002535151A5 JP 2000585029 A JP2000585029 A JP 2000585029A JP 2000585029 A JP2000585029 A JP 2000585029A JP 2002535151 A5 JP2002535151 A5 JP 2002535151A5
Authority
JP
Japan
Prior art keywords
polishing
head
workpiece
tool
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000585029A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002535151A (ja
Filing date
Publication date
Priority claimed from GBGB9826372.6A external-priority patent/GB9826372D0/en
Priority claimed from GBGB9826371.8A external-priority patent/GB9826371D0/en
Priority claimed from GBGB9826369.2A external-priority patent/GB9826369D0/en
Application filed filed Critical
Priority claimed from PCT/GB1999/004014 external-priority patent/WO2000032353A2/en
Publication of JP2002535151A publication Critical patent/JP2002535151A/ja
Publication of JP2002535151A5 publication Critical patent/JP2002535151A5/ja
Pending legal-status Critical Current

Links

JP2000585029A 1998-12-01 1999-12-01 研磨装置および方法 Pending JP2002535151A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GBGB9826372.6A GB9826372D0 (en) 1998-12-01 1998-12-01 A polishing machine and method
GBGB9826371.8A GB9826371D0 (en) 1998-12-01 1998-12-01 A tool and an abrasive cup for fitment thereto for polishing or abrading a workpiece
GB9826369.2 1998-12-01
GB9826371.8 1998-12-01
GBGB9826369.2A GB9826369D0 (en) 1998-12-01 1998-12-01 A polishing machine and method
GB9826372.6 1998-12-01
PCT/GB1999/004014 WO2000032353A2 (en) 1998-12-01 1999-12-01 A polishing machine and method

Publications (2)

Publication Number Publication Date
JP2002535151A JP2002535151A (ja) 2002-10-22
JP2002535151A5 true JP2002535151A5 (enExample) 2007-01-25

Family

ID=27269568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000585029A Pending JP2002535151A (ja) 1998-12-01 1999-12-01 研磨装置および方法

Country Status (9)

Country Link
US (1) US6796877B1 (enExample)
EP (2) EP1154877A2 (enExample)
JP (1) JP2002535151A (enExample)
KR (1) KR100644144B1 (enExample)
CN (1) CN100372648C (enExample)
AT (1) ATE424968T1 (enExample)
AU (1) AU1399600A (enExample)
DE (1) DE69940566D1 (enExample)
WO (1) WO2000032353A2 (enExample)

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645059B1 (en) * 1999-12-01 2003-11-11 Gerber Coburn Optical Inc. Device for retaining abrasive pad on lap in eyeglass lens making apparatus
DE10100860A1 (de) * 2000-02-03 2001-08-23 Zeiss Carl Polierkopf für eine Poliermaschine
KR20020072453A (ko) 2001-03-10 2002-09-16 삼성전자 주식회사 재생장치 및 부가정보 서비스 서버 시스템
DE60327957D1 (de) 2002-01-09 2009-07-30 Hoya Corp Schleifwerkzeug
DE10207379A1 (de) * 2002-02-21 2003-09-04 Asphericon Gmbh Verfahren zum Schleifen und Polieren von Freiformflächen, insbesondere von rotationssymmetrischen asphärischen optischen Linsen
DE10218039A1 (de) 2002-04-23 2003-11-13 Zeiss Carl Bearbeitungskopf zur Oberflächenbearbeitung
JP2004216477A (ja) * 2003-01-10 2004-08-05 Olympus Corp ポリッシャー、研磨加工装置、研磨加工方法、研磨加工をコンピュータに実行させる制御プログラムおよび記録媒体
JP2004261954A (ja) * 2003-02-14 2004-09-24 Seiko Epson Corp 研磨方法
US20050202754A1 (en) * 2003-05-16 2005-09-15 Bechtold Mike J. Method, apparatus, and tools for precision polishing of lenses and lens molds
DE102004047563A1 (de) * 2004-09-30 2006-04-06 Asphericon Gmbh Verfahren zum Polieren
US7264538B2 (en) * 2005-08-12 2007-09-04 United Technologies Corporation Method of removing a coating
US7390242B2 (en) * 2005-08-29 2008-06-24 Edge Technologies, Inc. Diamond tool blade with circular cutting edge
JP2007111283A (ja) * 2005-10-21 2007-05-10 Timothy Tamio Nemoto 歯冠研磨装置
US7312154B2 (en) * 2005-12-20 2007-12-25 Corning Incorporated Method of polishing a semiconductor-on-insulator structure
US7662024B2 (en) * 2006-05-03 2010-02-16 V.I. Mfg. Inc. Method and apparatus for precision polishing of optical components
DE102006022831A1 (de) * 2006-05-16 2007-11-22 Siemens Ag Verfahren zum Steuern einer Schleifmaschine und numerisch gesteuerte Schleifmaschine
FI121654B (sv) * 2006-07-10 2011-02-28 Kwh Mirka Ab Oy Förfarande för tillverkning av en flexibel sliprondell och en flexibel sliprondell
WO2008066801A1 (en) * 2006-11-30 2008-06-05 Corning Incorporated Precision abrasive machining of work piece surfaces
GB2452091B (en) 2007-08-24 2013-01-02 Zeeko Ltd Computer controlled work tool apparatus and method
US7645180B2 (en) * 2007-10-18 2010-01-12 Thielenhaus Microfinish Corporation Method for finishing a workpiece
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
DE102009004787A1 (de) 2009-01-13 2010-07-15 Schneider Gmbh & Co. Kg Vorrichtung und Verfahren zum Polieren von Linsen
JP5402391B2 (ja) * 2009-01-27 2014-01-29 信越化学工業株式会社 半導体用合成石英ガラス基板の加工方法
US20100242283A1 (en) * 2009-03-30 2010-09-30 Gm Global Technology Operations, Inc. Method for finishing a gear surface
USD635162S1 (en) * 2009-09-18 2011-03-29 Nibbler Sales AB Abrading machine
DE102010019491B4 (de) * 2010-04-30 2015-07-09 Carl Zeiss Vision International Gmbh Polierwerkzeug zur Bearbeitung von optischen Flächen, insbesondere Freiformflächen
US20110275280A1 (en) * 2010-05-07 2011-11-10 National Formosa University Method of auto scanning and scraping a work piece for a hard rail
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US8747188B2 (en) * 2011-02-24 2014-06-10 Apple Inc. Smart automation of robotic surface finishing
DE102011014230A1 (de) * 2011-03-17 2012-09-20 Satisloh Ag Vorrichtung zur Feinbearbeitung von optisch wirksamen Flächen an insbesondere Brillengläsern
DE202011004912U1 (de) * 2011-04-06 2011-08-10 Deckel Maho Seebach Gmbh Polierwerkzeug
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
DE102011084118A1 (de) * 2011-10-07 2013-04-11 Carl Zeiss Smt Gmbh Glättungswerkzeug und Glättungsvorrichtung zur automatisierten Bearbeitung eines optischen Elements und entsprechende Verfahren hierzu
US20130225050A1 (en) * 2012-02-24 2013-08-29 Apple Inc. Localized spot lapping on a larger work surface area
USD673985S1 (en) * 2012-05-18 2013-01-08 Venmill Industries Incorporated Optical disc restoration machine with door open
USD673591S1 (en) * 2012-05-18 2013-01-01 Venmill Industries Incorporated Optical disc restoration machine
CN102873628B (zh) * 2012-09-26 2015-02-18 清华大学 一种用于数控小工具抛光的螺旋线式加工路径的生成方法
US9971339B2 (en) 2012-09-26 2018-05-15 Apple Inc. Contact patch simulation
CN103111934B (zh) * 2013-03-04 2016-05-11 江苏民生特种设备集团有限公司 一种钢瓶封头的抛光方法
TWI589404B (zh) * 2013-06-28 2017-07-01 聖高拜磨料有限公司 基於向日葵圖案之經塗佈的研磨製品
CN103894916B (zh) * 2014-03-06 2016-04-13 浙江工业大学 一种圆锥抛光装置
USD724634S1 (en) * 2014-03-07 2015-03-17 Venmill Industries Incorporated Optical disc sanding machine
USD719989S1 (en) * 2014-03-07 2014-12-23 Venmill Industries Incorporated Optical disc sanding machine with top lid open
DE102014114172A1 (de) * 2014-09-30 2016-03-31 Carl Zeiss Jena Gmbh Verfahren und Vorrichtungen zum Bearbeiten optischer Werkstücke
CN107000155B (zh) * 2014-10-03 2020-04-14 兹科有限公司 用于将工件成形的方法
DE102014222848B4 (de) * 2014-11-10 2021-03-04 Supfina Grieshaber Gmbh & Co. Kg Finishvorrichtung
CN104385080B (zh) * 2014-11-24 2017-03-15 成都精密光学工程研究中心 抛光模面形修改装置
CN105458867A (zh) * 2015-11-16 2016-04-06 中国科学院长春光学精密机械与物理研究所 一种控制非旋转对称误差光学元件抛光用夹具
CN105479318B (zh) * 2015-11-25 2018-05-18 赣州澳克泰工具技术有限公司 硬质合金涂层刀具的后处理方法和硬质合金涂层刀具
CN105478784B (zh) * 2015-12-04 2017-11-14 河源富马硬质合金股份有限公司 一种降低圆片刀偏心的刮料成型方法
ITUA20162674A1 (it) * 2016-04-18 2017-10-18 Bmr S P A Macchina squadratrice
DE102016006741A1 (de) * 2016-06-06 2017-12-07 Schneider Gmbh & Co. Kg Werkzeug, Vorrichtung und Verfahren zum Polieren von Linsen
KR101870701B1 (ko) 2016-08-01 2018-06-25 에스케이실트론 주식회사 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템
JP6888476B2 (ja) 2016-08-23 2021-06-16 信越化学工業株式会社 基板の製造方法
CN108237468B (zh) * 2016-12-26 2021-08-03 台湾积体电路制造股份有限公司 厚度缩减装置及厚度缩减方法
KR101890515B1 (ko) * 2017-02-01 2018-10-01 신성대학 산학협력단 렌즈가공장치
KR101996227B1 (ko) * 2017-11-29 2019-10-01 주식회사 휴비츠 렌즈 블록커
CN107855934B (zh) * 2017-11-29 2019-12-10 东莞长盈精密技术有限公司 打磨治具
CN108637905B (zh) * 2018-04-19 2020-07-14 广州大学 一种柔性打磨控制系统的控制方法
CN108481199A (zh) * 2018-05-29 2018-09-04 碳星智能装备（深圳）有限公司 一种多工位四轴联动数控抛光设备
US20200009701A1 (en) * 2018-07-09 2020-01-09 Arizona Board Of Regents On Behalf Of The University Of Arizona Polishing protocol for zirconium diboride based ceramics to be implemented into optical systems
CN109048553B (zh) * 2018-09-08 2020-07-31 龙南新涛亚克力科技有限公司 一种塑料板材自动化加工装置
CN109048554B (zh) * 2018-09-08 2020-09-01 佛山市铭德塑料有限公司 一种pvc塑料板侧面切割刀口多角度打磨装置及打磨方法
CN109162434B (zh) * 2018-11-01 2023-12-26 江苏南通二建集团有限公司 一种适用于建筑施工的智能化地面抹光机
CN109483393B (zh) * 2018-11-26 2021-02-19 国宏中晶集团有限公司 一种蓝宝石晶体表面研磨专用工具及方法
CN109571032B (zh) * 2018-12-18 2021-10-01 嘉善嘉诚混凝土制管有限公司 钢板磨边装置
DE102019005294A1 (de) * 2019-01-17 2020-07-23 Schneider Gmbh & Co. Kg Polierwerkzeug und Vorrichtung zum Polieren eines Werkstücks
GB2582639B (en) * 2019-03-29 2023-10-18 Zeeko Innovations Ltd Shaping apparatus, method and tool
PL3996937T3 (pl) 2019-07-11 2025-08-11 D. Swarovski Kg Sposoby i urządzenia do nanoszenia elementów dekoracyjnych na przedmioty obrabiane
CN110398792A (zh) * 2019-07-22 2019-11-01 北京理工大学 一种微透镜阵列研磨装置及方法
KR102381559B1 (ko) * 2019-10-29 2022-04-04 (주)미래컴퍼니 연마 시스템
CN111002205B (zh) * 2019-12-19 2022-02-01 山东欧思特新材料科技有限公司 一种半导体用晶圆抛光设备
KR102527422B1 (ko) * 2020-04-29 2023-05-03 주식회사 휴비츠 블로킹 장치 및 방법
EP3904001B1 (en) 2020-04-29 2024-07-03 Huvitz Co., Ltd. Blocking device and method
CN111546142B (zh) * 2020-06-10 2021-06-11 浙江飞挺机械股份有限公司 一种卡套式接头制造加工工艺
CN111633515B (zh) * 2020-06-10 2021-06-15 杭州加淼科技有限公司 一种不锈钢卡套式接头制造自动化加工系统
CN111774982B (zh) * 2020-06-30 2021-07-13 泉州台商投资区飞翔机械设计服务中心 一种圆形玻璃圆角边打磨装置及其打磨方法
CN112757092B (zh) * 2021-01-21 2023-09-15 株洲市宇鑫工业科技有限公司 一种圆形砧板加工用表面打磨装置
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
JP7666128B2 (ja) * 2021-05-24 2025-04-22 Ａｇｃ株式会社 回転加工ツール、及び反射型マスクブランクの製造方法
GB202108332D0 (en) 2021-06-10 2021-07-28 Zeeko Innovations Ltd Polishing tools, polishing machines and methods of polishing a workpiece
CN113442048A (zh) * 2021-07-31 2021-09-28 泉州百麒达自动化科技有限公司 一种圆柱球自动数控磨光机
CN114227458A (zh) * 2021-12-30 2022-03-25 江西奇仁生物科技有限责任公司 一种钨刀电极打磨装置
CN114473813A (zh) * 2022-01-27 2022-05-13 大连理工大学 一种异形结构蓝宝石智能抛光装置及方法
CN115156843B (zh) * 2022-05-11 2023-11-17 重庆工业职业技术学院 一种活塞椭圆截面加工装置及工艺
DE102022125372A1 (de) * 2022-09-30 2024-04-04 Hueck Rheinische Gmbh Verfahren und Bearbeitungsvorrichtung zur Herstellung eines Presswerkzeuges
KR102580741B1 (ko) * 2023-02-22 2023-09-20 주식회사 터보링크 유체윤활베어링의 베어링 패드 및 볼 피봇 연마장치
CN116638394A (zh) * 2023-06-26 2023-08-25 安徽科瑞思创晶体材料有限责任公司 铌酸锂晶体多角度抛光处理装置
CN116810594B (zh) * 2023-07-19 2025-09-30 哈尔滨工程大学 一种深水打磨器
CN118973247B (zh) * 2024-08-01 2025-05-27 东莞市鼎力自动化科技有限公司 一种led散料贴片机零散元器件圆形供料装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB249656A (en) * 1925-03-02 1926-04-01 George William Harris Improvements in or relating to buffing and like devices of the naumkeag type
NL248517A (enExample) * 1959-02-18
US3129541A (en) * 1962-10-29 1964-04-21 Field Albert Abrasive tools
CH614620A5 (enExample) * 1977-07-05 1979-12-14 Identoflex Ag
US4523409A (en) * 1983-05-19 1985-06-18 The Charles Stark Draper Laboratory, Inc. Automatic contour grinding system
US4752160A (en) * 1984-03-19 1988-06-21 Ltv Aerospace & Defense Company Automated tool positioning system
US4617764A (en) * 1985-05-23 1986-10-21 Experimentalny Nauchno-Issledovatelsky Institut Metallorezhuschikh Stankov NC vertical spindle jig grinder
JPH03161281A (ja) * 1989-11-14 1991-07-11 Atsushi Kitamura 研磨用キャップ
US5370718A (en) * 1990-08-22 1994-12-06 Hitachi Maxell, Ltd. Abrasive tape
US5127197A (en) * 1991-04-25 1992-07-07 Brukvoort Wesley J Abrasive article and processes for producing it
US5231803A (en) * 1992-04-13 1993-08-03 Minnesota Mining And Manufacturing Company Automated random orbital abrading method
ES2127838T3 (es) * 1992-10-30 1999-05-01 Bbf Yamate Corp Metodo pulidor y aparato para el mismo y rueda pulidora.
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
GB9512262D0 (en) * 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring
JP3595828B2 (ja) * 1996-11-26 2004-12-02 独立行政法人理化学研究所 自由曲面加工ツール
WO1999047300A1 (en) * 1998-03-18 1999-09-23 The Gleason Works Threaded grinding wheel and method of dressing
US6165057A (en) * 1998-05-15 2000-12-26 Gill, Jr.; Gerald L. Apparatus for localized planarization of semiconductor wafer surface
JP3170627B2 (ja) * 1999-06-23 2001-05-28 信和興産株式会社 溶接方法および溶接装置

Similar Documents

Publication Publication Date Title
JP2002535151A5 (enExample)
CN100372648C (zh) 抛光的设备和方法
CN108161646A (zh) 非球面光学元件的智能柔性抛光方法及其所采用的智能柔性抛光装置
KR19990022989A (ko) 광학 연마 방법 및 장치
JPH10286772A (ja) 研磨工具および研削工具
JP3733444B2 (ja) 曲面加工装置
JP4996964B2 (ja) 研磨装置
JP2011036974A (ja) 研磨加工方法および研磨加工装置
JP4216557B2 (ja) 研磨装置及び研磨方法
JP3885964B2 (ja) 曲面研磨装置および曲面研磨方法
JP2009233832A (ja) 研磨工具の取付け構造および研磨装置
JP6274769B2 (ja) 部品の製造方法、および研磨装置
JP2010221338A (ja) 加工皿の作製装置及び修正方法
JP2002178248A (ja) 研磨装置
JP2003039305A (ja) 研磨装置
JP2003089047A (ja) 曲面仕上げ加工方法および曲面仕上げ加工装置
JP2003225850A (ja) 研磨方法及び研磨機
JPH09300191A (ja) 研磨装置
JP4370743B2 (ja) 研磨用砥石のドレッシング装置
JP2001038592A (ja) 研磨方法および研磨装置
JPH0985603A (ja) 研磨方法及び研磨装置
JP2002178254A (ja) 研磨装置
JPH03221362A (ja) トーリック面研磨装置
JP2004009280A (ja) 研磨方法およびその装置
JP4027171B2 (ja) 研磨方法