JP2002275678A - ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物 - Google Patents

ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物

Info

Publication number
JP2002275678A
JP2002275678A JP2001057139A JP2001057139A JP2002275678A JP 2002275678 A JP2002275678 A JP 2002275678A JP 2001057139 A JP2001057139 A JP 2001057139A JP 2001057139 A JP2001057139 A JP 2001057139A JP 2002275678 A JP2002275678 A JP 2002275678A
Authority
JP
Japan
Prior art keywords
tin
plating solution
plating
bisphenol
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001057139A
Other languages
English (en)
Japanese (ja)
Inventor
Tamahiro Aiba
玲宏 相場
Masashi Kumagai
正志 熊谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Priority to JP2001057139A priority Critical patent/JP2002275678A/ja
Priority to PCT/JP2001/009323 priority patent/WO2002055763A1/ja
Priority to CN01807193A priority patent/CN1420946A/zh
Priority to KR1020027011400A priority patent/KR20020082857A/ko
Publication of JP2002275678A publication Critical patent/JP2002275678A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
JP2001057139A 2001-01-11 2001-03-01 ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物 Withdrawn JP2002275678A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001057139A JP2002275678A (ja) 2001-01-11 2001-03-01 ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物
PCT/JP2001/009323 WO2002055763A1 (fr) 2001-01-11 2001-10-24 Solution d'electrodeposition d'alliage d'etain ou d'etain depourvue de trichite, film d'electrodeposition et article ainsi metallise
CN01807193A CN1420946A (zh) 2001-01-11 2001-10-24 无晶须析出的锡、锡合金镀液、镀膜以及镀膜物
KR1020027011400A KR20020082857A (ko) 2001-01-11 2001-10-24 위스커프리 주석 및 주석합금도금액, 도금피막 및 도금물

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001003639 2001-01-11
JP2001-3639 2001-01-11
JP2001057139A JP2002275678A (ja) 2001-01-11 2001-03-01 ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物

Publications (1)

Publication Number Publication Date
JP2002275678A true JP2002275678A (ja) 2002-09-25

Family

ID=26607531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001057139A Withdrawn JP2002275678A (ja) 2001-01-11 2001-03-01 ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物

Country Status (4)

Country Link
JP (1) JP2002275678A (ko)
KR (1) KR20020082857A (ko)
CN (1) CN1420946A (ko)
WO (1) WO2002055763A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006016603A1 (ja) * 2004-08-10 2006-02-16 Dipsol Chemicals Co., Ltd. 錫－亜鉛合金電気めっき方法
US7314784B2 (en) 2003-03-19 2008-01-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and manufacturing method thereof
JP2008001947A (ja) * 2006-06-22 2008-01-10 Yuken Industry Co Ltd ウイスカ発生が抑制された錫合金めっき皮膜とその形成方法
JP2009035768A (ja) * 2007-08-01 2009-02-19 Taiyo Kagaku Kogyo Kk 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100457977C (zh) * 2004-08-03 2009-02-04 上海新阳半导体材料有限公司 一种无铅纯锡电镀添加剂及其制备方法
CN103882484B (zh) * 2014-04-04 2016-06-29 哈尔滨工业大学 高速电镀锡用镀液
JP7035821B2 (ja) * 2018-06-05 2022-03-15 トヨタ自動車株式会社 成膜用金属溶液及び金属被膜の成膜方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3429894B2 (ja) * 1995-03-20 2003-07-28 株式会社大和化成研究所 錫−ビスマス合金電気めっき浴
JP4186029B2 (ja) * 1998-10-05 2008-11-26 石原薬品株式会社 銅箔基材上のスズ又はスズ合金メッキ皮膜における異常結晶析出防止剤並びに当該防止方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7314784B2 (en) 2003-03-19 2008-01-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and manufacturing method thereof
WO2006016603A1 (ja) * 2004-08-10 2006-02-16 Dipsol Chemicals Co., Ltd. 錫－亜鉛合金電気めっき方法
JP2006052431A (ja) * 2004-08-10 2006-02-23 Dipsol Chem Co Ltd 錫−亜鉛合金電気めっき方法
JP4594672B2 (ja) * 2004-08-10 2010-12-08 ディップソール株式会社 錫−亜鉛合金電気めっき方法
JP2008001947A (ja) * 2006-06-22 2008-01-10 Yuken Industry Co Ltd ウイスカ発生が抑制された錫合金めっき皮膜とその形成方法
JP2009035768A (ja) * 2007-08-01 2009-02-19 Taiyo Kagaku Kogyo Kk 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品

Also Published As

Publication number Publication date
KR20020082857A (ko) 2002-10-31
WO2002055763A1 (fr) 2002-07-18
CN1420946A (zh) 2003-05-28

Similar Documents

Publication Publication Date Title
DE69924807T2 (de) Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
TWI301516B (en) Tin of tin alloy plating bath,tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath,and electrical and electric components prepared by the use of the plating bath
KR100268967B1 (ko) 금속 착물 형성용 수용액, 주석-은 합금도금욕 및 당해도금욕을 사용하는 도금물의 제조방법
KR101319863B1 (ko) 주석 전기도금액 및 주석 전기도금 방법
JP3481020B2 (ja) Ｓｎ−Ｂｉ系合金めっき浴
US7179362B2 (en) Electrolyte and method for depositing tin-copper alloy layers
JP2007284733A (ja) 錫電気めっき浴、錫めっき皮膜、錫電気めっき方法及び電子機器構成部品
JP3274232B2 (ja) 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US20060065538A1 (en) Alloy composition and plating method
JP2001026898A (ja) 錫−銅合金電気めっき浴及びそれを使用するめっき方法
WO1997033015A1 (fr) Bain de placage d'alliage etain-argent et procede de production d'objets plaques au moyen de ce bain de placage
JP3274766B2 (ja) 低融点錫合金めっき浴
JP2002275678A (ja) ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物
JP3632499B2 (ja) 錫−銀系合金電気めっき浴
US6458264B1 (en) Sn-Cu alloy plating bath
JPWO2005085498A1 (ja) 金属の表面処理剤
JP2001200387A (ja) 錫−インジウム合金電気めっき浴
JP2009191335A (ja) めっき液及び電子部品
JP3366851B2 (ja) 錫合金電気めっき液およびめっき方法
JP2000234195A (ja) Ｓｎ−Ｂｉ合金めっき浴、およびこれを使用するめっき方法
JP3034213B2 (ja) 金属錯体形成用水溶液、錫−銀合金めっき浴およびこのめっき浴を用いためっき物の製造方法
JP3335864B2 (ja) 錫−銀系合金めっき浴およびこのめっき浴を用いためっき物の製造方法
JP3292055B2 (ja) 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
JP2001040497A (ja) 錫−ビスマス合金めっき皮膜で被覆された電子部品
WO2022080191A1 (ja) 錫又は錫合金めっき液及びそのめっき液を用いたバンプの形成方法

Legal Events

Date Code Title Description
A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20040217