JP2002076589A5 - - Google Patents

Download PDF

Info

Publication number
JP2002076589A5
JP2002076589A5 JP2000263864A JP2000263864A JP2002076589A5 JP 2002076589 A5 JP2002076589 A5 JP 2002076589A5 JP 2000263864 A JP2000263864 A JP 2000263864A JP 2000263864 A JP2000263864 A JP 2000263864A JP 2002076589 A5 JP2002076589 A5 JP 2002076589A5
Authority
JP
Japan
Prior art keywords
electronic component
electronic device
manufacturing
region
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000263864A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002076589A (ja
Filing date
Publication date
Priority claimed from JP2000263864A external-priority patent/JP2002076589A/ja
Priority to JP2000263864A priority Critical patent/JP2002076589A/ja
Application filed filed Critical
Priority to SG200104762A priority patent/SG101995A1/en
Priority to TW090119799A priority patent/TW523839B/zh
Priority to US09/935,170 priority patent/US6553660B2/en
Priority to KR1020010052729A priority patent/KR20020018133A/ko
Priority to CNB011252278A priority patent/CN1291467C/zh
Publication of JP2002076589A publication Critical patent/JP2002076589A/ja
Priority to US10/152,839 priority patent/US20020135986A1/en
Priority to US10/357,221 priority patent/US6722028B2/en
Priority to US10/790,057 priority patent/US7015070B2/en
Publication of JP2002076589A5 publication Critical patent/JP2002076589A5/ja
Pending legal-status Critical Current

Links

JP2000263864A 2000-08-31 2000-08-31 電子装置及びその製造方法 Pending JP2002076589A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000263864A JP2002076589A (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法
SG200104762A SG101995A1 (en) 2000-08-31 2001-08-08 An electronic device and a method of manufacturing the same
TW090119799A TW523839B (en) 2000-08-31 2001-08-13 Electronic device and its manufacturing method
US09/935,170 US6553660B2 (en) 2000-08-31 2001-08-23 Electronic device and a method of manufacturing the same
KR1020010052729A KR20020018133A (ko) 2000-08-31 2001-08-30 전자 장치 및 그 제조 방법
CNB011252278A CN1291467C (zh) 2000-08-31 2001-08-31 电子器件的制造方法
US10/152,839 US20020135986A1 (en) 2000-08-31 2002-05-23 Electronic device and a method of manufacturing the same
US10/357,221 US6722028B2 (en) 2000-08-31 2003-02-04 Method of making electronic device
US10/790,057 US7015070B2 (en) 2000-08-31 2004-03-02 Electronic device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000263864A JP2002076589A (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002076589A JP2002076589A (ja) 2002-03-15
JP2002076589A5 true JP2002076589A5 (enExample) 2005-02-24

Family

ID=18751356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000263864A Pending JP2002076589A (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法

Country Status (6)

Country Link
US (4) US6553660B2 (enExample)
JP (1) JP2002076589A (enExample)
KR (1) KR20020018133A (enExample)
CN (1) CN1291467C (enExample)
SG (1) SG101995A1 (enExample)
TW (1) TW523839B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6305076B1 (en) * 2000-01-21 2001-10-23 Cypress Semiconductor Corp. Apparatus for transferring a plurality of integrated circuit devices into and/or out of a plurality of sockets
JP3767474B2 (ja) * 2001-01-15 2006-04-19 セイコーエプソン株式会社 表示装置及びその製造方法
JP4105409B2 (ja) * 2001-06-22 2008-06-25 株式会社ルネサステクノロジ マルチチップモジュールの製造方法
US7714432B2 (en) * 2002-07-26 2010-05-11 Intel Corporation Ceramic/organic hybrid substrate
JP4206320B2 (ja) * 2003-09-19 2009-01-07 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US7145234B2 (en) * 2004-01-15 2006-12-05 Via Technologies, Inc. Circuit carrier and package structure thereof
US7167375B2 (en) * 2004-01-16 2007-01-23 Motorola, Inc. Populated printed wiring board and method of manufacture
US20050205292A1 (en) * 2004-03-18 2005-09-22 Etenna Corporation. Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures
GB2412790B (en) * 2004-04-02 2007-12-05 Univ City Hong Kong Process for assembly of electronic devices
JPWO2006001087A1 (ja) * 2004-06-29 2008-04-17 株式会社ルネサステクノロジ 半導体装置
US20060107523A1 (en) * 2004-11-24 2006-05-25 Trw Inc. Method of making a printed circuit board
US7916263B2 (en) * 2004-12-02 2011-03-29 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2006303173A (ja) * 2005-04-20 2006-11-02 Mitsubishi Electric Corp 回路基板デバイスおよびその製造方法
US20070065964A1 (en) * 2005-09-22 2007-03-22 Yinon Degani Integrated passive devices
KR20070039398A (ko) * 2005-10-07 2007-04-11 히다치 막셀 가부시키가이샤 반도체장치, 반도체 모듈 및 반도체 모듈의 제조방법
US7637415B2 (en) 2005-10-31 2009-12-29 General Electric Company Methods and apparatus for assembling a printed circuit board
US7871865B2 (en) * 2007-01-24 2011-01-18 Analog Devices, Inc. Stress free package and laminate-based isolator package
JP4454673B2 (ja) * 2008-08-01 2010-04-21 株式会社新川 金属ナノインクとその製造方法並びにその金属ナノインクを用いるダイボンディング方法及びダイボンディング装置
WO2010038574A1 (ja) 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 アクリル系絶縁性接着剤
KR101044008B1 (ko) * 2008-10-08 2011-06-24 주식회사 하이닉스반도체 플랙시블 반도체 패키지 및 이의 제조 방법
EP2445322B1 (en) * 2009-06-01 2013-07-10 Sumitomo Electric Industries, Ltd. Connection method
JP2012028513A (ja) * 2010-07-22 2012-02-09 Elpida Memory Inc 半導体装置及びその製造方法
JP5794577B2 (ja) * 2011-10-21 2015-10-14 株式会社アマダミヤチ ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造
KR101940237B1 (ko) * 2012-06-14 2019-01-18 한국전자통신연구원 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
TW201436665A (zh) * 2013-03-07 2014-09-16 Delta Electronics Inc 電路板設置緩衝墊的自動化製程及結構
JP2015015442A (ja) 2013-07-08 2015-01-22 三菱電機株式会社 半導体装置
TWI582905B (zh) * 2016-01-07 2017-05-11 晨星半導體股份有限公司 晶片封裝結構及其製作方法
KR101908915B1 (ko) 2016-06-10 2018-10-18 크루셜머신즈 주식회사 릴-투-릴 레이저 리플로우 방법
CN112968109A (zh) * 2020-11-27 2021-06-15 重庆康佳光电技术研究院有限公司 一种驱动背板及其制作方法
JP2022125682A (ja) * 2021-02-17 2022-08-29 レノボ・シンガポール・プライベート・リミテッド 電子基板および電子機器
DE112022006249T5 (de) * 2021-12-27 2024-10-02 Daiwa Co., Ltd. Verfahren zum herstellen einer leiterplatte oder eines leiterplattenmaterials
US20240404989A1 (en) * 2023-06-02 2024-12-05 Taiwan Semiconductor Manufacturing Company Limited Parallel plasma treatment and thermocompression bonding and apparatus for effecting the same

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
FR2556550B1 (fr) * 1983-12-09 1987-01-30 Lignes Telegraph Telephon Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4872261A (en) * 1987-12-11 1989-10-10 Digital Equipment Corporation Method of and apparatus for surface mounting electronic components onto a printed wiring board
DE3806738C1 (enExample) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
JP2502663B2 (ja) * 1988-03-17 1996-05-29 松下電器産業株式会社 プリント配線板の製造方法
US4982376A (en) * 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
US4998342A (en) * 1989-08-31 1991-03-12 International Business Machines Corporation Method of attaching electronic components
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
JP2824148B2 (ja) * 1990-11-28 1998-11-11 富士通株式会社 両面ワイヤボンディング基板組立体製造用ワークテーブル
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US5754401A (en) * 1996-02-16 1998-05-19 Sun Microsystems, Inc. Pressure compliantly protected heatsink for an electronic device
US5978221A (en) * 1996-04-30 1999-11-02 Denki Kagaku Kogyo Kabushiki Kaisha Radiating spacer, its use and silicone composition
US5678304A (en) * 1996-07-24 1997-10-21 Eastman Kodak Company Method for manufacturing double-sided circuit assemblies
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
US5729896A (en) * 1996-10-31 1998-03-24 International Business Machines Corporation Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
US6144101A (en) * 1996-12-03 2000-11-07 Micron Technology, Inc. Flip chip down-bond: method and apparatus
DE19651528B4 (de) * 1996-12-11 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipanordnung und Verfahren zum Herstellen derselben
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US5990564A (en) * 1997-05-30 1999-11-23 Lucent Technologies Inc. Flip chip packaging of memory chips
JP3982876B2 (ja) * 1997-06-30 2007-09-26 沖電気工業株式会社 弾性表面波装置
JP3687280B2 (ja) * 1997-07-02 2005-08-24 松下電器産業株式会社 チップ実装方法
JP3109477B2 (ja) * 1998-05-26 2000-11-13 日本電気株式会社 マルチチップモジュール
KR100510387B1 (ko) * 1998-07-01 2005-08-30 세이코 엡슨 가부시키가이샤 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기
DE19924289A1 (de) * 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
JP2001210763A (ja) * 2000-01-27 2001-08-03 Mitsubishi Electric Corp 半導体モジュ−ル装置
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6673690B2 (en) * 2000-04-27 2004-01-06 Siliconware Precision Industries Co., Ltd. Method of mounting a passive component over an integrated circuit package substrate

Similar Documents

Publication Publication Date Title
JP2002076589A5 (enExample)
JP3994262B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP4037589B2 (ja) 樹脂封止形電力用半導体装置
JP4474431B2 (ja) 半導体パッケージおよび該製造方法
US6628527B2 (en) Mounting structure for electronic parts and manufacturing method thereof
US6553660B2 (en) Electronic device and a method of manufacturing the same
WO2001026155A1 (fr) Dispositif a semi-conducteur, procede et dispositif permettant d'obtenir ce dernier, carte de circuit imprime et equipement electronique
JP2004128219A (ja) 付加機能を有する半導体装置及びその製造方法
JPWO2001026155A1 (ja) 半導体装置及びその製造方法、製造装置、回路基板並びに電子機器
JPWO2001026147A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
US6335563B1 (en) Semiconductor device, method of fabricating the same, circuit board, and electronic device
US6034437A (en) Semiconductor device having a matrix of bonding pads
JP2000332055A (ja) フリップチップ実装構造及び実装方法
JP4228457B2 (ja) 電子モジュール及び電子機器
KR19990062611A (ko) 전자부품의 실장방법 및 그 방법에 의해 제조된 전자회로장치
JPWO1998043288A1 (ja) 半導体装置およびその製造方法
JP2001168233A (ja) 多重回線グリッド・アレイ・パッケージ
JPH0462866A (ja) 表面実装部品の実装方法
JP2000150560A (ja) バンプ形成方法及びバンプ形成用ボンディングツール、半導体ウエーハ、半導体チップ及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
JPH11163054A (ja) 半導体装置の構造及びその製造方法
US20030089973A1 (en) Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
JP2599290Y2 (ja) ハイブリッドｉｃ
EP1317001A1 (en) A semiconductor device
JP2006165333A (ja) 半導体素子搭載装置及び半導体素子搭載方法
JP2004303885A (ja) 実装基板および電子デバイス