FR2556550B1 - Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede - Google Patents

Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede

Info

Publication number
FR2556550B1
FR2556550B1 FR8319762A FR8319762A FR2556550B1 FR 2556550 B1 FR2556550 B1 FR 2556550B1 FR 8319762 A FR8319762 A FR 8319762A FR 8319762 A FR8319762 A FR 8319762A FR 2556550 B1 FR2556550 B1 FR 2556550B1
Authority
FR
France
Prior art keywords
electronic components
printed circuit
hybrid circuit
brazing
brazing electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8319762A
Other languages
English (en)
Other versions
FR2556550A1 (fr
Inventor
Gerard Blangeard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR8319762A priority Critical patent/FR2556550B1/fr
Publication of FR2556550A1 publication Critical patent/FR2556550A1/fr
Application granted granted Critical
Publication of FR2556550B1 publication Critical patent/FR2556550B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10901—Lead partly inserted in hole or via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8319762A 1983-12-09 1983-12-09 Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede Expired FR2556550B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8319762A FR2556550B1 (fr) 1983-12-09 1983-12-09 Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8319762A FR2556550B1 (fr) 1983-12-09 1983-12-09 Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede

Publications (2)

Publication Number Publication Date
FR2556550A1 FR2556550A1 (fr) 1985-06-14
FR2556550B1 true FR2556550B1 (fr) 1987-01-30

Family

ID=9295037

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8319762A Expired FR2556550B1 (fr) 1983-12-09 1983-12-09 Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede

Country Status (1)

Country Link
FR (1) FR2556550B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
FR2690304B1 (fr) * 1992-04-16 1999-09-24 Marelli Autronica Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.
DE19511226A1 (de) * 1995-03-27 1996-10-02 Bosch Gmbh Robert SMD-Verbindung für elektronische Steuergeräte in Kraftfahrzeugen
JP2002076589A (ja) * 2000-08-31 2002-03-15 Hitachi Ltd 電子装置及びその製造方法
DE10211647B4 (de) * 2002-03-15 2014-02-13 Endress + Hauser Gmbh + Co. Kg Verfahren zum Bestücken und Löten einer Leiterplatte
FR2864420B1 (fr) * 2003-12-18 2006-04-28 Johnson Controls Tech Co Boitier electrique a connecteur integre
FR3032327A1 (fr) * 2015-01-30 2016-08-05 Valeo Comfort & Driving Assistance Procede de montage d'un composant electronique traversant sur une carte a circuit imprime

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1122118B (de) * 1960-10-21 1962-01-18 Graetz Kommanditgesellschaft Vorrichtung zum Abscheren und Umbiegen fuer die Anschlussdraehte von elektrischen Schaltelementen
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Industrial Co Ltd Device for attaching chip circuit parts
FR2476428A1 (fr) * 1980-02-15 1981-08-21 Tech Electro Cie Indle Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
FR2487152A1 (fr) * 1980-07-17 1982-01-22 Ebauchesfabrik Eta Ag Procedes de fabrication d'un substrat et d'un module comprenant ce substrat
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
CA1177972A (fr) * 1982-09-23 1984-11-13 Jean P. Berger Pose de composants electroniques sur circuits imprimes

Also Published As

Publication number Publication date
FR2556550A1 (fr) 1985-06-14

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Legal Events

Date Code Title Description
ST Notification of lapse