JPS56157089A - Method of manufacturing printed circuit board - Google Patents

Method of manufacturing printed circuit board

Info

Publication number
JPS56157089A
JPS56157089A JP6085980A JP6085980A JPS56157089A JP S56157089 A JPS56157089 A JP S56157089A JP 6085980 A JP6085980 A JP 6085980A JP 6085980 A JP6085980 A JP 6085980A JP S56157089 A JPS56157089 A JP S56157089A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
manufacturing printed
manufacturing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6085980A
Other languages
Japanese (ja)
Inventor
Teruo Motoyoshi
Katsura Adachi
Yasuo Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6085980A priority Critical patent/JPS56157089A/en
Publication of JPS56157089A publication Critical patent/JPS56157089A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
JP6085980A 1980-05-08 1980-05-08 Method of manufacturing printed circuit board Pending JPS56157089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6085980A JPS56157089A (en) 1980-05-08 1980-05-08 Method of manufacturing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6085980A JPS56157089A (en) 1980-05-08 1980-05-08 Method of manufacturing printed circuit board

Publications (1)

Publication Number Publication Date
JPS56157089A true JPS56157089A (en) 1981-12-04

Family

ID=13154521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6085980A Pending JPS56157089A (en) 1980-05-08 1980-05-08 Method of manufacturing printed circuit board

Country Status (1)

Country Link
JP (1) JPS56157089A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462653B2 (en) 2003-05-09 2008-12-09 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof
DE112009000690T5 (en) 2008-03-27 2011-03-24 Nisshin Steel Co., Ltd. Inkjet ink composition for etch resists
US9453137B2 (en) 2012-03-30 2016-09-27 Taiyo Holdings Co., Ltd. Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same
WO2019189190A1 (en) 2018-03-30 2019-10-03 太陽インキ製造株式会社 Curable composition, cured product of same, and electronic component comprising said cured product

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462653B2 (en) 2003-05-09 2008-12-09 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof
DE112009000690T5 (en) 2008-03-27 2011-03-24 Nisshin Steel Co., Ltd. Inkjet ink composition for etch resists
US8425790B2 (en) 2008-03-27 2013-04-23 Nisshin Steel Co., Ltd. Ink-jet ink composition for etching resist
US9453137B2 (en) 2012-03-30 2016-09-27 Taiyo Holdings Co., Ltd. Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same
WO2019189190A1 (en) 2018-03-30 2019-10-03 太陽インキ製造株式会社 Curable composition, cured product of same, and electronic component comprising said cured product
KR20200140290A (en) 2018-03-30 2020-12-15 다이요 잉키 세이조 가부시키가이샤 Curable composition, cured product thereof, and electronic component having the same

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