JPS56157089A - Method of manufacturing printed circuit board - Google Patents
Method of manufacturing printed circuit boardInfo
- Publication number
- JPS56157089A JPS56157089A JP6085980A JP6085980A JPS56157089A JP S56157089 A JPS56157089 A JP S56157089A JP 6085980 A JP6085980 A JP 6085980A JP 6085980 A JP6085980 A JP 6085980A JP S56157089 A JPS56157089 A JP S56157089A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- manufacturing printed
- manufacturing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6085980A JPS56157089A (en) | 1980-05-08 | 1980-05-08 | Method of manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6085980A JPS56157089A (en) | 1980-05-08 | 1980-05-08 | Method of manufacturing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56157089A true JPS56157089A (en) | 1981-12-04 |
Family
ID=13154521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6085980A Pending JPS56157089A (en) | 1980-05-08 | 1980-05-08 | Method of manufacturing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56157089A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462653B2 (en) | 2003-05-09 | 2008-12-09 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof |
DE112009000690T5 (en) | 2008-03-27 | 2011-03-24 | Nisshin Steel Co., Ltd. | Inkjet ink composition for etch resists |
US9453137B2 (en) | 2012-03-30 | 2016-09-27 | Taiyo Holdings Co., Ltd. | Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same |
WO2019189190A1 (en) | 2018-03-30 | 2019-10-03 | 太陽インキ製造株式会社 | Curable composition, cured product of same, and electronic component comprising said cured product |
-
1980
- 1980-05-08 JP JP6085980A patent/JPS56157089A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462653B2 (en) | 2003-05-09 | 2008-12-09 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof |
DE112009000690T5 (en) | 2008-03-27 | 2011-03-24 | Nisshin Steel Co., Ltd. | Inkjet ink composition for etch resists |
US8425790B2 (en) | 2008-03-27 | 2013-04-23 | Nisshin Steel Co., Ltd. | Ink-jet ink composition for etching resist |
US9453137B2 (en) | 2012-03-30 | 2016-09-27 | Taiyo Holdings Co., Ltd. | Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the same |
WO2019189190A1 (en) | 2018-03-30 | 2019-10-03 | 太陽インキ製造株式会社 | Curable composition, cured product of same, and electronic component comprising said cured product |
KR20200140290A (en) | 2018-03-30 | 2020-12-15 | 다이요 잉키 세이조 가부시키가이샤 | Curable composition, cured product thereof, and electronic component having the same |
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