JP2002057238A - 集積回路パッケージ - Google Patents

集積回路パッケージ

Info

Publication number
JP2002057238A
JP2002057238A JP2001226903A JP2001226903A JP2002057238A JP 2002057238 A JP2002057238 A JP 2002057238A JP 2001226903 A JP2001226903 A JP 2001226903A JP 2001226903 A JP2001226903 A JP 2001226903A JP 2002057238 A JP2002057238 A JP 2002057238A
Authority
JP
Japan
Prior art keywords
integrated circuit
conductive
slug
substrate
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001226903A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002057238A5 (https=
Inventor
Cohn Charles
コーン チャールズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems Guardian Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems Guardian Corp filed Critical Agere Systems Guardian Corp
Publication of JP2002057238A publication Critical patent/JP2002057238A/ja
Publication of JP2002057238A5 publication Critical patent/JP2002057238A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2001226903A 2000-07-28 2001-07-27 集積回路パッケージ Pending JP2002057238A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/628,067 US6509642B1 (en) 2000-07-28 2000-07-28 Integrated circuit package
US09/628067 2000-07-28

Publications (2)

Publication Number Publication Date
JP2002057238A true JP2002057238A (ja) 2002-02-22
JP2002057238A5 JP2002057238A5 (https=) 2004-08-26

Family

ID=24517308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001226903A Pending JP2002057238A (ja) 2000-07-28 2001-07-27 集積回路パッケージ

Country Status (5)

Country Link
US (1) US6509642B1 (https=)
JP (1) JP2002057238A (https=)
KR (1) KR100675030B1 (https=)
GB (1) GB2370687B (https=)
TW (1) TW498514B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614123B2 (en) * 2001-07-31 2003-09-02 Chippac, Inc. Plastic ball grid array package with integral heatsink
TW523887B (en) 2001-11-15 2003-03-11 Siliconware Precision Industries Co Ltd Semiconductor packaged device and its manufacturing method
US6977436B2 (en) * 2002-02-14 2005-12-20 Macronix International Co. Ltd. Semiconductor packaging device
TW582100B (en) * 2002-05-30 2004-04-01 Fujitsu Ltd Semiconductor device having a heat spreader exposed from a seal resin
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
TW200828555A (en) * 2006-12-18 2008-07-01 Advanced Connection Tech Inc Package module for radio frequency identification chip
US8159828B2 (en) * 2007-02-23 2012-04-17 Alpha & Omega Semiconductor, Inc. Low profile flip chip power module and method of making
JP2010034403A (ja) * 2008-07-30 2010-02-12 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823462A (ja) 1981-08-06 1983-02-12 Mitsubishi Electric Corp 半導体装置の冷却方法
JPH04139752A (ja) 1990-09-29 1992-05-13 Toshiba Corp 冷却装置
US5294826A (en) 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
EP0848423B1 (en) * 1996-07-03 2006-03-01 Seiko Epson Corporation Resin-encapsulated semiconductor device and method of manufacturing the same
US5894166A (en) 1997-09-17 1999-04-13 Northern Telecom Limited Chip mounting scheme

Also Published As

Publication number Publication date
GB2370687A (en) 2002-07-03
GB0117917D0 (en) 2001-09-12
KR100675030B1 (ko) 2007-01-29
TW498514B (en) 2002-08-11
US6509642B1 (en) 2003-01-21
KR20020010489A (ko) 2002-02-04
GB2370687B (en) 2005-03-23

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