KR20020010489A - 집적 회로 패키지 - Google Patents
집적 회로 패키지 Download PDFInfo
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- KR20020010489A KR20020010489A KR1020010043981A KR20010043981A KR20020010489A KR 20020010489 A KR20020010489 A KR 20020010489A KR 1020010043981 A KR1020010043981 A KR 1020010043981A KR 20010043981 A KR20010043981 A KR 20010043981A KR 20020010489 A KR20020010489 A KR 20020010489A
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Abstract
Description
Claims (19)
- 집적 회로 패키지로서,전도 슬러그와;상기 전도 슬러그에 결합된 집적 회로 칩과; 및상기 집적 회로 칩으로부터 상기 전도 슬러그로 확장하는 전도 요소 (conductive element)를 포함하는, 집적 회로 패키지.
- 제 1항에 있어서, 상기 전도 슬러그에 결합된 기판 패키지를 더 포함하는 집적 회로 패키지.
- 제 2항에 있어서, 상기 기판은 상기 집적 회로 칩이 제 1 전도층에 전기적으로 결합된 적어도 상기 제 1 전도층을 포함하는, 집적 회로 패키지.
- 제 3항에 있어서, 상기 기판 패키지는 상기 전도 슬러그가 제 2 전도 층에 전기적으로 결합된 상기 제 2 전도층을 포함하는, 집적 회로 패키지.
- 제 4항에 있어서, 상기 제 1 전도층은 상기 기판 패키지내의 상기 제 2 전도층으로부터 전기적으로 분리되어 있는, 집적 회로 패키지.
- 제 4 항에 있어서, 상기 기판 패키지는 적어도 세 개의 전도층들을 포함하고 상기 집적 회로 칩은 상기 제 3 절연층에 전기적으로 연결되는, 집적 회로 패키지.
- 제 2항에 있어서, 상기 기판 패키지는 마더보드에 탑재되도록 구성되는, 집적 회로 패키지.
- 제 7항에 있어서, 상기 기판은 회로 보드(circuit board)인, 집적 회로 패키지.
- 제 2항에 있어서, 상기 기판 패키지는 도금된 쓰루 홀들을 가지며 상기 전도 슬러그는 상기 쓰루 홀들중 적어도 한 개에 전기적으로 연결되는, 집적 회로 패키지.
- 제 1 항에 있어서, 상기 집적 회로 칩은 기계적으로 및 전기적으로 상기 전도 슬러그에 결합되는, 집적 회로 패키지.
- 제 1 항에 있어서, 외부 층은 상기 전도 슬러그 위에 형성되고, 상기 외부 층은 상기 전도 슬러그의 세그먼트를 노출시키는 개구를 가지며, 상기 집적 회로 칩은 전기적으로 상기 세그먼트에 결합되는, 집적 회로 패키지.
- 제 1 항에 있어서, 상기 전도 슬러그는 히트 싱크(heat sink)를 형성하는, 집적 회로 패키지.
- 집적 회로 패키지에 있어서:전도 슬러그와;상기 전도 슬러그에 전기적으로 결합된 집적 회로 칩과;다수의 전도층들을 가지며 상기 다수의 전도층들중 적어도 한 개는 상기 집적 회로 칩에 전기적으로 결합된, 기판 패키지를 포함하는 집적 회로 패키지.
- 제 13항에 있어서, 상기 기판 패키지는 마더보드상에 탑재되도록 구성되는, 집적 회로 패키지.
- 제 14 항에 있어서, 상기 기판은 회로 보드인, 집적 회로 패키지.
- 제 13 항에 있어서, 상기 기판 패키지는 쓰루 홀들을 가지며 상기 전도 슬러그는 상기 도금된 쓰루 홀들중 적어도 한 개에 전기적으로 연결되는, 집적 회로 패키지.
- 제 13항에 있어서, 상기 집적 회로 칩은 기계적으로 및 전기적으로 상기 전도 슬러그에 결합되는, 집적 회로 패키지.
- 제 13항에 있어서, 외부층은 상기 전도 슬러그 위에 형성되고, 상기 외부층은 상기 전도 슬러그의 세그먼트를 노출시키는 개구를 가지며, 상기 집적 회로는 상기 세그먼트에 결합되는, 집적 회로 패키지.
- 제 13항에 있어서, 상기 전도 슬러그는 히트 싱크를 형성하는, 집적 회로 패키지.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/628067 | 2000-07-28 | ||
US09/628,067 US6509642B1 (en) | 2000-07-28 | 2000-07-28 | Integrated circuit package |
Publications (2)
Publication Number | Publication Date |
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KR20020010489A true KR20020010489A (ko) | 2002-02-04 |
KR100675030B1 KR100675030B1 (ko) | 2007-01-29 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020010043981A KR100675030B1 (ko) | 2000-07-28 | 2001-07-21 | 집적 회로 패키지 |
Country Status (5)
Country | Link |
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US (1) | US6509642B1 (ko) |
JP (1) | JP2002057238A (ko) |
KR (1) | KR100675030B1 (ko) |
GB (1) | GB2370687B (ko) |
TW (1) | TW498514B (ko) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6614123B2 (en) * | 2001-07-31 | 2003-09-02 | Chippac, Inc. | Plastic ball grid array package with integral heatsink |
TW523887B (en) | 2001-11-15 | 2003-03-11 | Siliconware Precision Industries Co Ltd | Semiconductor packaged device and its manufacturing method |
US6977436B2 (en) * | 2002-02-14 | 2005-12-20 | Macronix International Co. Ltd. | Semiconductor packaging device |
TW582100B (en) * | 2002-05-30 | 2004-04-01 | Fujitsu Ltd | Semiconductor device having a heat spreader exposed from a seal resin |
US9713258B2 (en) * | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
TW200828555A (en) * | 2006-12-18 | 2008-07-01 | Advanced Connection Tech Inc | Package module for radio frequency identification chip |
US8159828B2 (en) * | 2007-02-23 | 2012-04-17 | Alpha & Omega Semiconductor, Inc. | Low profile flip chip power module and method of making |
JP2010034403A (ja) * | 2008-07-30 | 2010-02-12 | Shinko Electric Ind Co Ltd | 配線基板及び電子部品装置 |
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JPS5823462A (ja) | 1981-08-06 | 1983-02-12 | Mitsubishi Electric Corp | 半導体装置の冷却方法 |
JPH04139752A (ja) | 1990-09-29 | 1992-05-13 | Toshiba Corp | 冷却装置 |
US5294826A (en) | 1993-04-16 | 1994-03-15 | Northern Telecom Limited | Integrated circuit package and assembly thereof for thermal and EMI management |
US5650593A (en) * | 1994-05-26 | 1997-07-22 | Amkor Electronics, Inc. | Thermally enhanced chip carrier package |
JP3292798B2 (ja) * | 1995-10-04 | 2002-06-17 | 三菱電機株式会社 | 半導体装置 |
KR19990044365A (ko) * | 1996-07-03 | 1999-06-25 | 야스카와 히데아키 | 수지 밀봉형 반도체 장치 및 그 제조 방법 |
US5894166A (en) | 1997-09-17 | 1999-04-13 | Northern Telecom Limited | Chip mounting scheme |
-
2000
- 2000-07-28 US US09/628,067 patent/US6509642B1/en not_active Expired - Lifetime
-
2001
- 2001-07-21 KR KR1020010043981A patent/KR100675030B1/ko active IP Right Grant
- 2001-07-23 GB GB0117917A patent/GB2370687B/en not_active Expired - Fee Related
- 2001-07-23 TW TW090117908A patent/TW498514B/zh not_active IP Right Cessation
- 2001-07-27 JP JP2001226903A patent/JP2002057238A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB0117917D0 (en) | 2001-09-12 |
TW498514B (en) | 2002-08-11 |
US6509642B1 (en) | 2003-01-21 |
JP2002057238A (ja) | 2002-02-22 |
KR100675030B1 (ko) | 2007-01-29 |
GB2370687B (en) | 2005-03-23 |
GB2370687A (en) | 2002-07-03 |
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