JP2001523585A - ２つの基板の接続面を熱的に接続する方法および装置 - Google Patents

２つの基板の接続面を熱的に接続する方法および装置

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Publication number
JP2001523585A
JP2001523585A JP2000521942A JP2000521942A JP2001523585A JP 2001523585 A JP2001523585 A JP 2001523585A JP 2000521942 A JP2000521942 A JP 2000521942A JP 2000521942 A JP2000521942 A JP 2000521942A JP 2001523585 A JP2001523585 A JP 2001523585A
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JP
Japan
Prior art keywords
connection
laser
substrate
contact
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000521942A
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English (en)
Japanese (ja)
Other versions
JP2001523585A5 (enExample
Inventor
モメニ，カヴェー
Original Assignee
ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2001523585A publication Critical patent/JP2001523585A/ja
Publication of JP2001523585A5 publication Critical patent/JP2001523585A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75253—Means for applying energy, e.g. heating means adapted for localised heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H01L2224/75262—Laser in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75986—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Laser Beam Processing (AREA)
JP2000521942A 1997-11-20 1998-11-20 ２つの基板の接続面を熱的に接続する方法および装置 Pending JP2001523585A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19751487.1 1997-11-20
DE19751487A DE19751487A1 (de) 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
PCT/DE1998/003439 WO1999026753A1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate

Publications (2)

Publication Number Publication Date
JP2001523585A true JP2001523585A (ja) 2001-11-27
JP2001523585A5 JP2001523585A5 (enExample) 2006-01-05

Family

ID=7849341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000521942A Pending JP2001523585A (ja) 1997-11-20 1998-11-20 ２つの基板の接続面を熱的に接続する方法および装置

Country Status (6)

Country Link
US (1) US6394158B1 (enExample)
EP (2) EP1283085B1 (enExample)
JP (1) JP2001523585A (enExample)
KR (1) KR100565112B1 (enExample)
DE (3) DE19751487A1 (enExample)
WO (1) WO1999026753A1 (enExample)

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JP2007514304A (ja) * 2003-12-03 2007-05-31 パック テック−パッケージング テクノロジーズ ゲーエムベーハー ２つのウェーハを相互接触させる方法および装置
JP2009522113A (ja) * 2006-01-10 2009-06-11 バレオ・エチユード・エレクトロニク 少なくとも２個の積層部材を互いにろう付けする方法
JP2010192570A (ja) * 2009-02-17 2010-09-02 Panasonic Corp レーザはんだ付け装置
JP2012004281A (ja) * 2010-06-16 2012-01-05 Toppan Printing Co Ltd レーザ溶接方法、電子部品接続構造及びレーザ溶接検査方法
US8361881B2 (en) 2003-12-03 2013-01-29 PAC Tech—Packaging Technologies GmbH Method for alternately contacting two wafers
JP2019009440A (ja) * 2017-06-20 2019-01-17 プロテック カンパニー リミテッドＰｒｏｔｅｃ Ｃｏ．， Ｌｔｄ． フリップチップレーザーボンディング装置及びフリップチップレーザーボンディング方法

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DE19901623B4 (de) * 1999-01-18 2007-08-23 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
JP3914670B2 (ja) * 1999-11-18 2007-05-16 パイオニア株式会社 半導体モジュール及び半導体モジュールの半導体レーザ素子の取り付け方法
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
EP1278240A2 (fr) 2001-07-10 2003-01-22 Koninklijke Philips Electronics N.V. Procédé de report d'un composant sur un support de connexion par soudage sans apport de matière
DE10133731C2 (de) * 2001-07-11 2003-08-14 Huf Tools Gmbh Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt-oder Schweißstellen aufweist
US6574130B2 (en) 2001-07-25 2003-06-03 Nantero, Inc. Hybrid circuit having nanotube electromechanical memory
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US7259410B2 (en) 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US6924538B2 (en) 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US7335395B2 (en) 2002-04-23 2008-02-26 Nantero, Inc. Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
EP1424156A1 (en) * 2002-11-29 2004-06-02 Leica Geosystems AG Process for soldering miniaturized components onto a base plate
US6796636B2 (en) * 2002-12-17 2004-09-28 Lexmark International, Inc. Two shot molded inkjet printhead lid for laser welding
US7205938B2 (en) * 2004-03-05 2007-04-17 Airespace, Inc. Wireless node location mechanism responsive to observed propagation characteristics of wireless network infrastructure signals
US7187066B2 (en) * 2004-09-22 2007-03-06 Intel Corporation Radiant energy heating for die attach
KR100740762B1 (ko) * 2005-02-10 2007-07-19 오므론 가부시키가이샤 접합 방법 및 접합 장치
US20060196600A1 (en) * 2005-03-03 2006-09-07 Gi-Jung Nam Apparatus and method for bonding anisotropic conductive film using laser beam
US7538295B2 (en) * 2005-04-21 2009-05-26 Hewlett-Packard Development Company, L.P. Laser welding system
KR101113850B1 (ko) * 2005-08-11 2012-02-29 삼성테크윈 주식회사 플립 칩 본딩 방법 및 이를 채택한 플립 칩 본딩 장치
JP4514722B2 (ja) * 2006-02-20 2010-07-28 富士通セミコンダクター株式会社 フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
NL2001958C (en) * 2008-09-05 2010-03-15 Stichting Energie Method of monolithic photo-voltaic module assembly.
DE102009017659A1 (de) * 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
DE102010015520A1 (de) * 2010-04-16 2011-10-20 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur Ausbildung von Lotdepots
WO2012103868A2 (de) * 2011-02-02 2012-08-09 Pac Tech - Packaging Technologies Gmbh Verfahren und vorrichtung zur elektrischen kontaktierung von anschlussflächen zweier substrate
DE102011104159A1 (de) * 2011-06-14 2012-12-20 Institut Für Solarenergieforschung Gmbh Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul
KR20130039955A (ko) * 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
US10099315B2 (en) * 2014-06-27 2018-10-16 Jabil Inc. System, apparatus and method for hybrid function micro welding
DE102015216205A1 (de) * 2015-08-25 2017-03-02 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer Steckverbindung, Verfahren zum Verstärken einer Steckverbindung und Vorrichtung
FR3061801A1 (fr) * 2017-01-12 2018-07-13 Commissariat Energie Atomique Procede de connexion electrique entre au moins deux elements
KR20180137888A (ko) 2017-06-20 2018-12-28 주식회사 프로텍 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법
KR102394825B1 (ko) 2020-04-23 2022-05-06 주식회사 프로텍 빅셀 소자를 이용한 플립칩 본딩 장치

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JPS6421997A (en) * 1987-07-16 1989-01-25 Toshiba Corp Method of soldering electronic component
JPH04237589A (ja) * 1991-01-21 1992-08-26 Nec Corp レーザ加工装置
JPH05109824A (ja) * 1991-10-15 1993-04-30 Omron Corp 電子部品のフリツプチツプ実装方法
JPH0758448A (ja) * 1993-08-09 1995-03-03 Mitsubishi Electric Corp レーザーボンディング装置及び方法
JPH0999490A (ja) * 1995-10-06 1997-04-15 Sony Corp 立体形状造形方法並びにその装置
JPH09199846A (ja) * 1996-01-19 1997-07-31 Toshiba Electron Eng Corp 電子部品実装方法および電子部品実装装置
JPH09216087A (ja) * 1996-02-06 1997-08-19 Fujikura Ltd レーザ加工装置およびこれを用いたレーザ加工方法

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DE2335517C3 (de) * 1973-07-12 1980-04-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Kompensation von Lageabweichungen eines Zifferblattes oder Schildes relativ zu einem Beschriftungsgerät
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KR20010032305A (ko) 2001-04-16
US6394158B1 (en) 2002-05-28
DE59812840D1 (de) 2005-07-07
DE59809879D1 (de) 2003-11-13
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DE19751487A1 (de) 1999-06-02

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