DE19751487A1 - Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate - Google Patents

Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate

Info

Publication number
DE19751487A1
DE19751487A1 DE19751487A DE19751487A DE19751487A1 DE 19751487 A1 DE19751487 A1 DE 19751487A1 DE 19751487 A DE19751487 A DE 19751487A DE 19751487 A DE19751487 A DE 19751487A DE 19751487 A1 DE19751487 A1 DE 19751487A1
Authority
DE
Germany
Prior art keywords
contact
laser
substrate
transparent
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19751487A
Other languages
German (de)
English (en)
Inventor
Kaveh Dr Ing Momeni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pac Tech Packaging Technologies GmbH
Original Assignee
Pac Tech Packaging Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech Packaging Technologies GmbH filed Critical Pac Tech Packaging Technologies GmbH
Priority to DE19751487A priority Critical patent/DE19751487A1/de
Priority to EP02023748A priority patent/EP1283085B1/de
Priority to DE59809879T priority patent/DE59809879D1/de
Priority to PCT/DE1998/003439 priority patent/WO1999026753A1/de
Priority to JP2000521942A priority patent/JP2001523585A/ja
Priority to EP98966159A priority patent/EP1032482B1/de
Priority to US09/554,898 priority patent/US6394158B1/en
Priority to DE59812840T priority patent/DE59812840D1/de
Priority to KR1020007005515A priority patent/KR100565112B1/ko
Publication of DE19751487A1 publication Critical patent/DE19751487A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75253—Means for applying energy, e.g. heating means adapted for localised heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H01L2224/75262—Laser in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75986—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Laser Beam Processing (AREA)
DE19751487A 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Ceased DE19751487A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19751487A DE19751487A1 (de) 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
EP02023748A EP1283085B1 (de) 1997-11-20 1998-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlussflächen zweier Substrate
DE59809879T DE59809879D1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate
PCT/DE1998/003439 WO1999026753A1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate
JP2000521942A JP2001523585A (ja) 1997-11-20 1998-11-20 ２つの基板の接続面を熱的に接続する方法および装置
EP98966159A EP1032482B1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate
US09/554,898 US6394158B1 (en) 1997-11-20 1998-11-20 Method and device for thermally bonding connecting surfaces of two substrates
DE59812840T DE59812840D1 (de) 1997-11-20 1998-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlussflächen zweier Substrate
KR1020007005515A KR100565112B1 (ko) 1997-11-20 1998-11-20 두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19751487A DE19751487A1 (de) 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate

Publications (1)

Publication Number Publication Date
DE19751487A1 true DE19751487A1 (de) 1999-06-02

Family

ID=7849341

Family Applications (3)

Application Number Title Priority Date Filing Date
DE19751487A Ceased DE19751487A1 (de) 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
DE59812840T Expired - Lifetime DE59812840D1 (de) 1997-11-20 1998-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlussflächen zweier Substrate
DE59809879T Expired - Lifetime DE59809879D1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE59812840T Expired - Lifetime DE59812840D1 (de) 1997-11-20 1998-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlussflächen zweier Substrate
DE59809879T Expired - Lifetime DE59809879D1 (de) 1997-11-20 1998-11-20 Verfahren und vorrichtung zur thermischen verbindung von anschlussflächen zweier substrate

Country Status (6)

Country Link
US (1) US6394158B1 (enExample)
EP (2) EP1283085B1 (enExample)
JP (1) JP2001523585A (enExample)
KR (1) KR100565112B1 (enExample)
DE (3) DE19751487A1 (enExample)
WO (1) WO1999026753A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1278277A1 (de) * 2001-07-11 2003-01-22 Huf Tools GmbH Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt- oder Schweissstellen aufweist
US6596964B2 (en) 2001-07-10 2003-07-22 Koninklijke Philips Electronics N.V. Method of attaching a component to a connection support by welding without the addition of material
WO2005055288A3 (de) * 2003-12-03 2006-02-02 Pac Tech Gmbh Verfahren und vorrichtung zur wechselseitigen kontaktierung von zwei wafern
WO2010118821A1 (de) * 2009-04-16 2010-10-21 Schott Ag Verfahren zur leitenden verbindung eines bauelementes auf einem transparenten substrat
EP2110850A3 (de) * 2003-12-03 2012-04-25 Pac Tech - Packaging Technologies GmbH Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
WO2012171968A1 (de) * 2011-06-14 2012-12-20 Institut Für Solarenergieforschung Gmbh Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul
DE102015216205A1 (de) * 2015-08-25 2017-03-02 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer Steckverbindung, Verfahren zum Verstärken einer Steckverbindung und Vorrichtung
CN107810084A (zh) * 2014-06-27 2018-03-16 捷普有限公司 用于混合功能微焊接的系统、装置和方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19901623B4 (de) * 1999-01-18 2007-08-23 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
JP3914670B2 (ja) * 1999-11-18 2007-05-16 パイオニア株式会社 半導体モジュール及び半導体モジュールの半導体レーザ素子の取り付け方法
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
US6574130B2 (en) 2001-07-25 2003-06-03 Nantero, Inc. Hybrid circuit having nanotube electromechanical memory
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US7259410B2 (en) 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US6924538B2 (en) 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US7335395B2 (en) 2002-04-23 2008-02-26 Nantero, Inc. Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
EP1424156A1 (en) * 2002-11-29 2004-06-02 Leica Geosystems AG Process for soldering miniaturized components onto a base plate
US6796636B2 (en) * 2002-12-17 2004-09-28 Lexmark International, Inc. Two shot molded inkjet printhead lid for laser welding
US7205938B2 (en) * 2004-03-05 2007-04-17 Airespace, Inc. Wireless node location mechanism responsive to observed propagation characteristics of wireless network infrastructure signals
US7187066B2 (en) * 2004-09-22 2007-03-06 Intel Corporation Radiant energy heating for die attach
KR100740762B1 (ko) * 2005-02-10 2007-07-19 오므론 가부시키가이샤 접합 방법 및 접합 장치
US20060196600A1 (en) * 2005-03-03 2006-09-07 Gi-Jung Nam Apparatus and method for bonding anisotropic conductive film using laser beam
US7538295B2 (en) * 2005-04-21 2009-05-26 Hewlett-Packard Development Company, L.P. Laser welding system
KR101113850B1 (ko) * 2005-08-11 2012-02-29 삼성테크윈 주식회사 플립 칩 본딩 방법 및 이를 채택한 플립 칩 본딩 장치
FR2895924B1 (fr) * 2006-01-10 2009-09-25 Valeo Electronique Sys Liaison Procede de brasage entre eux d'au moins deux organes empiles
JP4514722B2 (ja) * 2006-02-20 2010-07-28 富士通セミコンダクター株式会社 フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
NL2001958C (en) * 2008-09-05 2010-03-15 Stichting Energie Method of monolithic photo-voltaic module assembly.
JP5294916B2 (ja) * 2009-02-17 2013-09-18 パナソニック株式会社 レーザはんだ付け装置
DE102010015520A1 (de) * 2010-04-16 2011-10-20 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur Ausbildung von Lotdepots
JP5589584B2 (ja) * 2010-06-16 2014-09-17 凸版印刷株式会社 レーザ溶接方法、電子部品接続構造及びレーザ溶接検査方法
WO2012103868A2 (de) * 2011-02-02 2012-08-09 Pac Tech - Packaging Technologies Gmbh Verfahren und vorrichtung zur elektrischen kontaktierung von anschlussflächen zweier substrate
KR20130039955A (ko) * 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
FR3061801A1 (fr) * 2017-01-12 2018-07-13 Commissariat Energie Atomique Procede de connexion electrique entre au moins deux elements
KR101975103B1 (ko) 2017-06-20 2019-05-03 주식회사 프로텍 플립칩 레이저 본딩 장치 및 플립칩 레이저 본딩 방법
KR20180137888A (ko) 2017-06-20 2018-12-28 주식회사 프로텍 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법
KR102394825B1 (ko) 2020-04-23 2022-05-06 주식회사 프로텍 빅셀 소자를 이용한 플립칩 본딩 장치

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US6596964B2 (en) 2001-07-10 2003-07-22 Koninklijke Philips Electronics N.V. Method of attaching a component to a connection support by welding without the addition of material
EP1278277A1 (de) * 2001-07-11 2003-01-22 Huf Tools GmbH Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt- oder Schweissstellen aufweist
DE10133731A1 (de) * 2001-07-11 2003-01-30 Huf Tools Gmbh Verfahren zum Herstellen eines elktrischen Endprodukts, welches Löt-oder Schweißstellen aufweist
DE10133731C2 (de) * 2001-07-11 2003-08-14 Huf Tools Gmbh Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt-oder Schweißstellen aufweist
US7932611B2 (en) 2003-12-03 2011-04-26 PAC Tech—Packaging Technologies GmbH Device for alternately contacting two wafers
WO2005055288A3 (de) * 2003-12-03 2006-02-02 Pac Tech Gmbh Verfahren und vorrichtung zur wechselseitigen kontaktierung von zwei wafern
EP2110850A3 (de) * 2003-12-03 2012-04-25 Pac Tech - Packaging Technologies GmbH Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
US8361881B2 (en) 2003-12-03 2013-01-29 PAC Tech—Packaging Technologies GmbH Method for alternately contacting two wafers
WO2010118821A1 (de) * 2009-04-16 2010-10-21 Schott Ag Verfahren zur leitenden verbindung eines bauelementes auf einem transparenten substrat
WO2012171968A1 (de) * 2011-06-14 2012-12-20 Institut Für Solarenergieforschung Gmbh Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul
CN107810084A (zh) * 2014-06-27 2018-03-16 捷普有限公司 用于混合功能微焊接的系统、装置和方法
CN107810084B (zh) * 2014-06-27 2019-12-24 捷普有限公司 用于混合功能微焊接的系统、装置和方法
DE102015216205A1 (de) * 2015-08-25 2017-03-02 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer Steckverbindung, Verfahren zum Verstärken einer Steckverbindung und Vorrichtung
US10892589B2 (en) 2015-08-25 2021-01-12 Continental Teves Ag & Co. Ohg Method for producing a plug connector, method for amplifying a plug connector and device

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KR100565112B1 (ko) 2006-03-30
KR20010032305A (ko) 2001-04-16
US6394158B1 (en) 2002-05-28
DE59812840D1 (de) 2005-07-07
DE59809879D1 (de) 2003-11-13
EP1283085A1 (de) 2003-02-12
JP2001523585A (ja) 2001-11-27
EP1283085B1 (de) 2005-06-01

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