JP2001156018A5 - - Google Patents
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- Publication number
- JP2001156018A5 JP2001156018A5 JP1999338846A JP33884699A JP2001156018A5 JP 2001156018 A5 JP2001156018 A5 JP 2001156018A5 JP 1999338846 A JP1999338846 A JP 1999338846A JP 33884699 A JP33884699 A JP 33884699A JP 2001156018 A5 JP2001156018 A5 JP 2001156018A5
- Authority
- JP
- Japan
- Prior art keywords
- laser
- harmonic
- cylindrical lens
- laser beams
- different wavelengths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33884699A JP4514861B2 (ja) | 1999-11-29 | 1999-11-29 | レーザ照射装置およびレーザ照射方法および半導体装置の作製方法 |
| US09/722,745 US6693257B1 (en) | 1999-11-29 | 2000-11-28 | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
| US10/756,776 US7336685B2 (en) | 1999-11-29 | 2004-01-14 | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33884699A JP4514861B2 (ja) | 1999-11-29 | 1999-11-29 | レーザ照射装置およびレーザ照射方法および半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001156018A JP2001156018A (ja) | 2001-06-08 |
| JP2001156018A5 true JP2001156018A5 (enExample) | 2007-01-18 |
| JP4514861B2 JP4514861B2 (ja) | 2010-07-28 |
Family
ID=18321977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33884699A Expired - Fee Related JP4514861B2 (ja) | 1999-11-29 | 1999-11-29 | レーザ照射装置およびレーザ照射方法および半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US6693257B1 (enExample) |
| JP (1) | JP4514861B2 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6573162B2 (en) * | 1999-12-24 | 2003-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method of fabricating a semiconductor device |
| US7662677B2 (en) * | 2000-04-28 | 2010-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| US6970644B2 (en) * | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
| US7015422B2 (en) * | 2000-12-21 | 2006-03-21 | Mattson Technology, Inc. | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy |
| TW552645B (en) | 2001-08-03 | 2003-09-11 | Semiconductor Energy Lab | Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device |
| JP2003059858A (ja) * | 2001-08-09 | 2003-02-28 | Sony Corp | レーザアニール装置及び薄膜トランジスタの製造方法 |
| JP2003178979A (ja) * | 2001-08-30 | 2003-06-27 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP4397571B2 (ja) | 2001-09-25 | 2010-01-13 | 株式会社半導体エネルギー研究所 | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
| KR20040063079A (ko) * | 2001-12-07 | 2004-07-12 | 소니 가부시끼 가이샤 | 광 조사 장치 및 레이저 어닐 장치 |
| JP4141138B2 (ja) | 2001-12-21 | 2008-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4387099B2 (ja) * | 2001-12-28 | 2009-12-16 | 株式会社半導体エネルギー研究所 | 半導体装置の生産方法 |
| EP1326273B1 (en) | 2001-12-28 | 2012-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2004095671A (ja) * | 2002-07-10 | 2004-03-25 | Seiko Epson Corp | 薄膜トランジスタ、スイッチング回路、アクティブ素子基板、電気光学装置、電子機器、サーマルヘッド、液滴吐出ヘッド、印刷装置、薄膜トランジスタ駆動発光表示装置 |
| TWI332682B (en) * | 2002-09-19 | 2010-11-01 | Semiconductor Energy Lab | Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
| JP2004128421A (ja) * | 2002-10-07 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
| EP1468774B1 (en) * | 2003-02-28 | 2009-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device |
| US7327916B2 (en) * | 2003-03-11 | 2008-02-05 | Semiconductor Energy Laboratory Co., Ltd. | Beam Homogenizer, laser irradiation apparatus, and method of manufacturing a semiconductor device |
| JP4373115B2 (ja) * | 2003-04-04 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| SG137674A1 (en) * | 2003-04-24 | 2007-12-28 | Semiconductor Energy Lab | Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
| DE102004030268B4 (de) | 2003-06-24 | 2013-02-21 | Fuji Electric Co., Ltd | Verfahren zum Herstellen eines Halbleiterelements |
| US7208395B2 (en) * | 2003-06-26 | 2007-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device |
| US7245802B2 (en) * | 2003-08-04 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device |
| US6922279B2 (en) * | 2003-09-20 | 2005-07-26 | National Taiwan University | Harmonic generation microscopy |
| JP4013928B2 (ja) * | 2004-07-15 | 2007-11-28 | セイコーエプソン株式会社 | 照明装置、非球面レンズの設計方法、非球面レンズ及びプロジェクタ |
| KR100784497B1 (ko) * | 2004-10-06 | 2007-12-11 | 삼성전자주식회사 | 반도체 패키지용 필름기판 및 그 제조방법 |
| JP4921771B2 (ja) * | 2004-10-27 | 2012-04-25 | 株式会社半導体エネルギー研究所 | ビームホモジナイザ、それを利用するレーザ照射方法及びレーザ照射装置、並びに非単結晶半導体膜のレーザアニール方法 |
| EP1805548B1 (en) * | 2004-10-27 | 2013-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, and laser irradiation method, laser irradiation apparatus, and laser annealing method of non-single crystalline semiconductor film using the same |
| US20070063226A1 (en) * | 2004-10-29 | 2007-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and laser irradiation method |
| US7279721B2 (en) * | 2005-04-13 | 2007-10-09 | Applied Materials, Inc. | Dual wavelength thermal flux laser anneal |
| GB2427751A (en) * | 2005-06-28 | 2007-01-03 | Bookham Technology Plc | High power semiconductor opto-electronic device |
| JP5087828B2 (ja) | 2005-08-26 | 2012-12-05 | 富士電機株式会社 | 半導体装置の製造方法 |
| EP1793366A3 (en) * | 2005-12-02 | 2009-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and electronic device |
| US7615722B2 (en) * | 2006-07-17 | 2009-11-10 | Coherent, Inc. | Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers |
| KR101165029B1 (ko) * | 2007-04-24 | 2012-07-13 | 삼성테크윈 주식회사 | 칩 가열장치, 이를 구비한 플립 칩 본더 및 이를 이용한플립 칩 본딩 방법 |
| JP5146023B2 (ja) * | 2008-03-11 | 2013-02-20 | セイコーエプソン株式会社 | 半導体発光素子の駆動回路を用いた光源装置、照明装置、モニタ装置、画像表示装置 |
| TW201003285A (en) * | 2008-07-01 | 2010-01-16 | Arima Computer Corp | Projecting system |
| CN102300820B (zh) * | 2009-02-02 | 2014-02-26 | 旭硝子株式会社 | 半导体器件构件用玻璃基板及半导体器件构件用玻璃基板的制造方法 |
| US8522848B2 (en) * | 2009-04-06 | 2013-09-03 | Jayna Sheats | Methods and apparatuses for assembling components onto substrates |
| JP5518612B2 (ja) * | 2010-07-20 | 2014-06-11 | 株式会社ディスコ | 光学装置およびこれを備えるレーザー加工装置 |
| US8026519B1 (en) | 2010-10-22 | 2011-09-27 | Ultratech, Inc. | Systems and methods for forming a time-averaged line image |
| US8399808B2 (en) | 2010-10-22 | 2013-03-19 | Ultratech, Inc. | Systems and methods for forming a time-averaged line image |
| US9302348B2 (en) | 2011-06-07 | 2016-04-05 | Ultratech Inc. | Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication |
| US8309474B1 (en) | 2011-06-07 | 2012-11-13 | Ultratech, Inc. | Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication |
| US8546805B2 (en) | 2012-01-27 | 2013-10-01 | Ultratech, Inc. | Two-beam laser annealing with improved temperature performance |
| US8501638B1 (en) | 2012-04-27 | 2013-08-06 | Ultratech, Inc. | Laser annealing scanning methods with reduced annealing non-uniformities |
| SG195515A1 (en) | 2012-06-11 | 2013-12-30 | Ultratech Inc | Laser annealing systems and methods with ultra-short dwell times |
| US9558973B2 (en) | 2012-06-11 | 2017-01-31 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| US9490128B2 (en) | 2012-08-27 | 2016-11-08 | Ultratech, Inc. | Non-melt thin-wafer laser thermal annealing methods |
| CN102856173B (zh) * | 2012-09-29 | 2015-03-18 | 京东方科技集团股份有限公司 | 一种多晶硅薄膜及其制备方法、阵列基板、显示装置 |
| US9343307B2 (en) | 2013-12-24 | 2016-05-17 | Ultratech, Inc. | Laser spike annealing using fiber lasers |
| JP6193305B2 (ja) | 2014-07-29 | 2017-09-06 | ウルトラテック インク | 高性能線形成光学システム及び方法 |
| US10083843B2 (en) | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| US10247952B2 (en) * | 2015-03-04 | 2019-04-02 | Coherent Lasersystems Gmbh & Co. Kg | Polarization-controlled laser line-projector |
| US10529564B2 (en) * | 2015-08-07 | 2020-01-07 | North Carolina State University | Synthesis and processing of novel phase of boron nitride (Q-BN) |
| CN106935491B (zh) * | 2015-12-30 | 2021-10-12 | 上海微电子装备(集团)股份有限公司 | 一种激光退火装置及其退火方法 |
| WO2018005619A1 (en) | 2016-06-28 | 2018-01-04 | North Carolina State University | Synthesis and processing of pure and nv nanodiamonds and other nanostructures for quantum computing and magnetic sensing applications |
| US10705001B2 (en) * | 2018-04-23 | 2020-07-07 | Artium Technologies, Inc. | Particle field imaging and characterization using VCSEL lasers for convergent multi-beam illumination |
| US11318558B2 (en) | 2018-05-15 | 2022-05-03 | The Chancellor, Masters And Scholars Of The University Of Cambridge | Fabrication of components using shaped energy beam profiles |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01287924A (ja) * | 1988-03-30 | 1989-11-20 | Hitachi Ltd | コヒーレント制御露光装置 |
| GB8909011D0 (en) | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| DE69115353T2 (de) * | 1990-05-30 | 1996-05-09 | Hitachi Ltd | Laserbearbeitungsgerät und dessen Verfahren |
| US5930608A (en) * | 1992-02-21 | 1999-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a thin film transistor in which the channel region of the transistor consists of two portions of differing crystallinity |
| US5231641A (en) * | 1992-01-21 | 1993-07-27 | Laserscope | Crystalline slab laser with intracavity non-linear optic |
| JPH05244353A (ja) * | 1992-02-27 | 1993-09-21 | Fuji Photo Film Co Ltd | 画像読取記録装置 |
| US5643801A (en) * | 1992-11-06 | 1997-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing method and alignment |
| JP3255469B2 (ja) * | 1992-11-30 | 2002-02-12 | 三菱電機株式会社 | レーザ薄膜形成装置 |
| US6410374B1 (en) * | 1992-12-26 | 2002-06-25 | Semiconductor Energy Laborartory Co., Ltd. | Method of crystallizing a semiconductor layer in a MIS transistor |
| JP3221149B2 (ja) * | 1993-03-31 | 2001-10-22 | ソニー株式会社 | 薄膜の熱処理方法 |
| US5923962A (en) | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| JP3431033B2 (ja) | 1993-10-29 | 2003-07-28 | 株式会社半導体エネルギー研究所 | 半導体作製方法 |
| TW264575B (enExample) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
| TW299897U (en) * | 1993-11-05 | 1997-03-01 | Semiconductor Energy Lab | A semiconductor integrated circuit |
| US5611946A (en) * | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
| JPH08186268A (ja) * | 1994-12-28 | 1996-07-16 | Sony Corp | 薄膜半導体装置の製造方法 |
| JP3778456B2 (ja) * | 1995-02-21 | 2006-05-24 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型薄膜半導体装置の作製方法 |
| US6066516A (en) * | 1995-06-26 | 2000-05-23 | Seiko Epson Corporation | Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices |
| US5617492A (en) * | 1996-02-06 | 1997-04-01 | The Regents Of The University Of California | Fiber optic coupling of a microlens conditioned, stacked semiconductor laser diode array |
| US5673281A (en) * | 1996-04-20 | 1997-09-30 | Board Of Trustees Of The Leland Stanford Junior University | Solid state system for frequency conversion using raman-active media and non-linear media |
| US5736709A (en) * | 1996-08-12 | 1998-04-07 | Armco Inc. | Descaling metal with a laser having a very short pulse width and high average power |
| JPH11133463A (ja) | 1997-10-31 | 1999-05-21 | Semiconductor Energy Lab Co Ltd | アクティブマトリクス型液晶表示装置及び電子機器 |
| JP3627781B2 (ja) * | 1997-01-29 | 2005-03-09 | コニカミノルタビジネステクノロジーズ株式会社 | レーザー走査装置 |
| JPH10244392A (ja) * | 1997-03-04 | 1998-09-14 | Semiconductor Energy Lab Co Ltd | レーザー照射装置 |
| JP4159633B2 (ja) | 1997-09-19 | 2008-10-01 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法並びに電子機器 |
| JP2000068520A (ja) * | 1997-12-17 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 半導体薄膜、その製造方法、および製造装置、ならびに半導体素子、およびその製造方法 |
| JP3586558B2 (ja) * | 1998-04-17 | 2004-11-10 | 日本電気株式会社 | 薄膜の改質方法及びその実施に使用する装置 |
| AU5311699A (en) * | 1998-07-28 | 2000-02-21 | Ce Resources Pte Ltd | Optical detection system |
| US6064528A (en) * | 1998-11-20 | 2000-05-16 | Eastman Kodak Company | Multiple laser array sources combined for use in a laser printer |
| AU766727B2 (en) * | 1999-06-14 | 2003-10-23 | Kaneka Corporation | Method of fabricating thin-film photovoltaic module |
| JP2001023918A (ja) * | 1999-07-08 | 2001-01-26 | Nec Corp | 半導体薄膜形成装置 |
| JP2001044120A (ja) * | 1999-08-04 | 2001-02-16 | Mitsubishi Electric Corp | レーザ熱処理方法およびレーザ熱処理装置 |
| TW473783B (en) * | 1999-08-13 | 2002-01-21 | Semiconductor Energy Lab | Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device |
| JP4748836B2 (ja) * | 1999-08-13 | 2011-08-17 | 株式会社半導体エネルギー研究所 | レーザ照射装置 |
| US6504650B1 (en) * | 1999-10-19 | 2003-01-07 | Anthony J. Alfrey | Optical transformer and system using same |
| US6410368B1 (en) * | 1999-10-26 | 2002-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with TFT |
| ATE533212T1 (de) * | 2000-08-09 | 2011-11-15 | Santur Corp | Verstimmbarer laserdiode mit verteilter rückkopplung |
-
1999
- 1999-11-29 JP JP33884699A patent/JP4514861B2/ja not_active Expired - Fee Related
-
2000
- 2000-11-28 US US09/722,745 patent/US6693257B1/en not_active Expired - Lifetime
-
2004
- 2004-01-14 US US10/756,776 patent/US7336685B2/en not_active Expired - Fee Related
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