JP2001102626A - Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置 - Google Patents

Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置

Info

Publication number
JP2001102626A
JP2001102626A JP2000221219A JP2000221219A JP2001102626A JP 2001102626 A JP2001102626 A JP 2001102626A JP 2000221219 A JP2000221219 A JP 2000221219A JP 2000221219 A JP2000221219 A JP 2000221219A JP 2001102626 A JP2001102626 A JP 2001102626A
Authority
JP
Japan
Prior art keywords
led array
light emitting
led
insulating film
array chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000221219A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001102626A5 (enExample
Inventor
Toshiyuki Sekiya
利幸 関谷
Mitsuo Shiraishi
光生 白石
Ryuta Mine
峯　　隆太
Junji Ishikawa
潤司 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000221219A priority Critical patent/JP2001102626A/ja
Priority to US09/626,737 priority patent/US6498356B1/en
Publication of JP2001102626A publication Critical patent/JP2001102626A/ja
Publication of JP2001102626A5 publication Critical patent/JP2001102626A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Led Device Packages (AREA)
JP2000221219A 1999-07-28 2000-07-21 Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置 Pending JP2001102626A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000221219A JP2001102626A (ja) 1999-07-28 2000-07-21 Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置
US09/626,737 US6498356B1 (en) 1999-07-28 2000-07-26 LED chip, LED array chip, LED array head and image-forming apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21416699 1999-07-28
JP11-214166 1999-07-28
JP2000221219A JP2001102626A (ja) 1999-07-28 2000-07-21 Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置

Publications (2)

Publication Number Publication Date
JP2001102626A true JP2001102626A (ja) 2001-04-13
JP2001102626A5 JP2001102626A5 (enExample) 2007-01-18

Family

ID=26520175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000221219A Pending JP2001102626A (ja) 1999-07-28 2000-07-21 Ｌｅｄチップ、ｌｅｄアレイチップ、ｌｅｄアレイヘッド及び画像形成装置

Country Status (2)

Country Link
US (1) US6498356B1 (enExample)
JP (1) JP2001102626A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030007061A (ko) * 2001-07-11 2003-01-23 히다찌 케이블 리미티드 발광 다이오드 어레이
US7218298B2 (en) 2002-04-03 2007-05-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2010147463A (ja) * 2008-12-17 2010-07-01 Seoul Semiconductor Co Ltd 複数の発光セルを有する発光ダイオード及びその製造方法
US8900894B2 (en) 2004-09-30 2014-12-02 Osram Opto Semiconductor Gmbh Method of producing a radiation-emitting optoelectronic component
JP2020170760A (ja) * 2019-04-02 2020-10-15 キヤノン株式会社 半導体発光装置、露光ヘッド及び画像形成装置

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JP3957535B2 (ja) * 2002-03-14 2007-08-15 株式会社半導体エネルギー研究所 発光装置の駆動方法、電子機器
JP2005175417A (ja) * 2003-07-28 2005-06-30 Ricoh Co Ltd 発光素子アレイ、光書込ユニットおよび画像形成装置
WO2007097347A1 (ja) * 2006-02-20 2007-08-30 Kyocera Corporation 発光素子アレイ、発光装置および画像形成装置
US20090184332A1 (en) * 2008-01-23 2009-07-23 Ming-Che Wu Package structure module with high density electrical connections and method for packaging the same
CN101554803B (zh) * 2008-04-07 2012-05-16 环旭电子股份有限公司 具有高密度电连接的嵌入式构装结构模块的制作方法
US7816689B2 (en) * 2008-07-03 2010-10-19 Universal Scientific Industrial Co., Ltd. Embedded package structure module with high-density electrical connections and method for making the same
JP2010045230A (ja) * 2008-08-13 2010-02-25 Fuji Xerox Co Ltd 発光素子チップ、露光装置および画像形成装置
US8746923B2 (en) 2011-12-05 2014-06-10 Cooledge Lighting Inc. Control of luminous intensity distribution from an array of point light sources
CN103672475B (zh) * 2012-09-20 2017-10-24 欧司朗股份有限公司 照明装置及其制造方法
CN103219352B (zh) * 2013-03-28 2015-10-14 湘能华磊光电股份有限公司 阵列式结构的led组合芯片及其制作方法
JP2019102633A (ja) * 2017-12-01 2019-06-24 キヤノン株式会社 発光素子アレイ及びこれを用いた露光ヘッドと画像形成装置

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USRE31334E (en) * 1971-04-12 1983-08-02 Eastman Kodak Company Acoustooptic scanner apparatus and method
JPH0752779B2 (ja) * 1987-12-09 1995-06-05 日立電線株式会社 発光ダイオードアレイ
EP0335553B1 (en) * 1988-03-18 1999-09-15 Nippon Sheet Glass Co., Ltd. Self-scanning light-emitting element array
US5814841A (en) * 1988-03-18 1998-09-29 Nippon Sheet Glass Co., Ltd. Self-scanning light-emitting array
JP2577034B2 (ja) 1988-03-18 1997-01-29 日本板硝子株式会社 自己走査形発光素子アレイおよびその駆動方法
JP2784052B2 (ja) 1988-10-19 1998-08-06 日本板硝子株式会社 自己走査型発光素子アレイおよびその駆動方法
JPH02127053A (ja) * 1988-11-07 1990-05-15 Mitsubishi Electric Corp Ｌｅｄアレイ
JPH02126687A (ja) * 1988-11-07 1990-05-15 Mitsubishi Electric Corp Ｌｅｄアレイ
JP2784025B2 (ja) 1989-02-07 1998-08-06 日本板硝子株式会社 光走査装置
JPH068500B2 (ja) 1989-06-15 1994-02-02 株式会社ライムズ アルミナ被覆Ａ▲ｌ▼・Ａ▲ｌ▼合金部材の製造方法
DE69033837T2 (de) * 1989-07-25 2002-05-29 Nippon Sheet Glass Co., Ltd. Lichtemittierende Vorrichtung
JP2769023B2 (ja) 1990-04-23 1998-06-25 日本板硝子株式会社 発光メモリ素子アレイ、及びそれを用いた受光・発光モジュール
JP2807910B2 (ja) 1989-12-22 1998-10-08 日本板硝子株式会社 発光素子アレイ
JP2683781B2 (ja) 1990-05-14 1997-12-03 日本板硝子株式会社 発光装置
US5684523A (en) * 1990-11-15 1997-11-04 Ricoh Company, Ltd. Optical line printhead and an LED chip used therefor
JP2846136B2 (ja) 1991-03-26 1999-01-13 日本板硝子株式会社 発光素子アレイの駆動方法
JP2846135B2 (ja) 1991-03-26 1999-01-13 日本板硝子株式会社 発光素子アレイの駆動方法
JP3194978B2 (ja) 1991-05-07 2001-08-06 株式会社ユーシン コントロールノブの照明装置
JPH0890832A (ja) * 1994-09-27 1996-04-09 Oki Electric Ind Co Ltd 発光素子アレイおよび光学ヘッド
US5952680A (en) * 1994-10-11 1999-09-14 International Business Machines Corporation Monolithic array of light emitting diodes for the generation of light at multiple wavelengths and its use for multicolor display applications
JP3053750B2 (ja) * 1995-07-21 2000-06-19 沖電気工業株式会社 端面発光型ｌｅｄの製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030007061A (ko) * 2001-07-11 2003-01-23 히다찌 케이블 리미티드 발광 다이오드 어레이
US7218298B2 (en) 2002-04-03 2007-05-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
CN1332517C (zh) * 2002-04-03 2007-08-15 株式会社半导体能源研究所 光发射器
CN101079236A (zh) * 2002-04-03 2007-11-28 株式会社半导体能源研究所 光发射器
US8900894B2 (en) 2004-09-30 2014-12-02 Osram Opto Semiconductor Gmbh Method of producing a radiation-emitting optoelectronic component
US9537070B2 (en) 2004-09-30 2017-01-03 Osram Opto Semiconductors Gmbh Optoelectronic component with a wireless contacting
JP2010147463A (ja) * 2008-12-17 2010-07-01 Seoul Semiconductor Co Ltd 複数の発光セルを有する発光ダイオード及びその製造方法
JP2020170760A (ja) * 2019-04-02 2020-10-15 キヤノン株式会社 半導体発光装置、露光ヘッド及び画像形成装置
JP7245101B2 (ja) 2019-04-02 2023-03-23 キヤノン株式会社 半導体発光装置、露光ヘッド及び画像形成装置

Also Published As

Publication number Publication date
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