JP7245101B2 - 半導体発光装置、露光ヘッド及び画像形成装置 - Google Patents
半導体発光装置、露光ヘッド及び画像形成装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 266
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000012535 impurity Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 20
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 9
- 108091008695 photoreceptors Proteins 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 240000001973 Ficus microcarpa Species 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910021478 group 5 element Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- ATFCOADKYSRZES-UHFFFAOYSA-N indium;oxotungsten Chemical compound [In].[W]=O ATFCOADKYSRZES-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- -1 thickness Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
- G03G15/04036—Details of illuminating systems, e.g. lamps, reflectors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
- G03G15/04036—Details of illuminating systems, e.g. lamps, reflectors
- G03G15/04045—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers
- G03G15/04054—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers by LED arrays
-
- G—PHYSICS
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- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
- G03G15/04036—Details of illuminating systems, e.g. lamps, reflectors
- G03G15/04045—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
- H01L33/0016—Devices characterised by their operation having p-n or hi-lo junctions having at least two p-n junctions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
- G03G15/321—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image
- G03G15/323—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image by modulating charged particles through holes or a slit
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
- G03G15/326—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by application of light, e.g. using a LED array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Devices (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Facsimile Heads (AREA)
Description
本発明の第1実施形態による半導体発光装置について、図1及び図2を用いて説明する。図1は、本実施形態による半導体発光装置の構造を示す概略断面図である。図2は、参考例による半導体発光装置の構造を示す概略断面図である。
基板10は、例えばn型のGaAs基板によって構成されうる。一般に、n型の化合物半導体基板は、p型の化合物半導体基板よりも高品質であり、流通数も多く、低価格で入手することができる。したがって、n型の化合物半導体基板を用いることは、高品質な半導体発光装置を低コストで製造できる点で有利である。バッファ層としての役割を有する半導体層22は、例えば、n型のGaAs層やn型のAlGaAs層によって構成されうる。
本発明の第2実施形態による半導体発光装置について、図3を用いて説明する。第1実施形態による半導体発光装置と同様の構成要素には同一の符号を付し、説明を省略し或いは簡潔にする。
本発明の第3実施形態による半導体発光装置について、図4を用いて説明する。第1及び第2実施形態による半導体発光装置と同様の構成要素には同一の符号を付し、説明を省略し或いは簡潔にする。
本発明の第4実施形態による半導体発光装置について、図5を用いて説明する。第1乃至第3実施形態による半導体発光装置と同様の構成要素には同一の符号を付し、説明を省略し或いは簡潔にする。
本発明の第5実施形態による半導体発光装置について、図6乃至図8を用いて説明する。第1乃至第4実施形態による半導体発光装置と同様の構成要素には同一の符号を付し、説明を省略し或いは簡潔にする。
本発明の第6実施形態による画像形成装置について、図9乃至図11を用いて説明する。第1乃至第5実施形態による半導体発光装置と同様の構成要素には同一の符号を付し、説明を省略し或いは簡潔にする。図9は、本実施形態による画像形成装置の構成例を示す概略図である。図10は、本実施形態による画像形成装置の露光ヘッドの構成例を示す概略図である。図11は、本実施形態による画像形成装置の面発光素子アレイチップ群を示す概略図である。
本発明は、上記実施形態に限らず種々の変形が可能である。
例えば、いずれかの実施形態の一部の構成を他の実施形態に追加した例や、他の実施形態の一部の構成と置換した例も、本発明の実施形態である。
20…半導体積層構造
22,26,28,30,32,34,36,38…半導体層
24…DBR層
40…絶縁層
42,48,50…電極
44…密着層
46…透明電極
60,62…開口部
100…半導体発光装置
200…画像形成装置
224…露光ヘッド
Claims (11)
- 第1導電型の第1半導体層と、前記第1導電型と反対の第2導電型の第2半導体層と、前記第1導電型の第3半導体層と、前記第2導電型の第4半導体層と、がこの順に積層されてなり、発光層を有する半導体積層構造と、
前記半導体積層構造の上に設けられた金属電極と、
前記半導体積層構造と前記金属電極との間に設けられた絶縁層と、
前記半導体積層構造の上及び前記金属電極の上に設けられた透明電極と、を有し、
前記第4半導体層は、第1不純物濃度を有する第1の層と、前記第1不純物濃度より高い第2不純物濃度を有するコンタクト層としての第2の層と、を有し、前記第1の層は、前記第3半導体層と前記第2の層との間に設けられており、
前記金属電極は、平面視において、前記第1の層と重なり、前記第2の層とは重ならず、前記第2の層の周囲を囲むように設けられている
ことを特徴とする半導体発光装置。 - 前記第2の層は、前記透明電極に接しており、
前記第2の層は、平面視におけるサイズが前記第1の層よりも小さい
ことを特徴とする請求項1記載の半導体発光装置。 - 前記絶縁層は、前記第1の層と前記金属電極との間から前記第2の層の上に延在して設けられており、
前記絶縁層は、前記第2の層の上部に、平面視における前記第2の層のサイズよりも小さい開口部を有する
ことを特徴とする請求項2記載の半導体発光装置。 - 前記金属電極と前記透明電極との間に設けられた密着層を更に有する
ことを特徴とする請求項1乃至3のいずれか1項に記載の半導体発光装置。 - 前記密着層は、Ti、Cr、Ni、これらの合金又はこれら金属または合金の酸化物を含む
ことを特徴とする請求項4記載の半導体発光装置。 - 前記半導体積層構造は、サイリスタ構造を含む
ことを特徴とする請求項1乃至5のいずれか1項に記載の半導体発光装置。 - 前記金属電極は、平面視においてリング状のパターンを有する
ことを特徴とする請求項1乃至6のいずれか1項に記載の半導体発光装置。 - 前記金属電極は、平面視において枠状のパターンを有する
ことを特徴とする請求項1乃至6のいずれか1項に記載の半導体発光装置。 - シフトサイリスタのゲートと発光サイリスタのゲートとが各々に接続された複数のノードと、前記複数のノードの間を接続する複数の転送ダイオードと、を有し、
前記シフトサイリスタ、前記発光サイリスタ及び前記転送ダイオードの各々は、前記半導体積層構造の少なくとも一部によって構成されている
ことを特徴とする請求項1乃至8のいずれか1項に記載の半導体発光装置。 - 請求項1乃至9のいずれか1項に記載の半導体発光装置と、
前記半導体発光装置からの光を集光する光学系と
を有することを特徴とする露光ヘッド。 - 像担持体と、
前記像担持体の表面を帯電する帯電手段と、
請求項1乃至9のいずれか1項に記載の半導体発光装置を有する露光ヘッドであって、前記帯電手段によって帯電された前記像担持体の表面を露光し、前記像担持体の表面に静電潜像を形成する露光ヘッドと、
前記露光ヘッドによって形成された前記静電潜像を現像する現像手段と、
前記現像手段によって現像された画像を記録媒体に転写する転写手段と
を有する画像形成装置。
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JP2019070387A JP7245101B2 (ja) | 2019-04-02 | 2019-04-02 | 半導体発光装置、露光ヘッド及び画像形成装置 |
US16/829,288 US11092910B2 (en) | 2019-04-02 | 2020-03-25 | Semiconductor light-emitting device, exposure head, and image forming apparatus |
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JP7245101B2 true JP7245101B2 (ja) | 2023-03-23 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200303A (ja) | 2002-12-17 | 2004-07-15 | Sharp Corp | 発光ダイオード |
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