JP2001102523A5 - - Google Patents

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Publication number
JP2001102523A5
JP2001102523A5 JP1999274062A JP27406299A JP2001102523A5 JP 2001102523 A5 JP2001102523 A5 JP 2001102523A5 JP 1999274062 A JP1999274062 A JP 1999274062A JP 27406299 A JP27406299 A JP 27406299A JP 2001102523 A5 JP2001102523 A5 JP 2001102523A5
Authority
JP
Japan
Prior art keywords
layer
support substrate
surface support
substrate
device layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP1999274062A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001102523A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP27406299A priority Critical patent/JP2001102523A/ja
Priority claimed from JP27406299A external-priority patent/JP2001102523A/ja
Priority to TW089120014A priority patent/TW492067B/zh
Priority to DE10047963A priority patent/DE10047963A1/de
Priority to US09/670,275 priority patent/US6503778B1/en
Priority to KR1020000056962A priority patent/KR20010039935A/ko
Publication of JP2001102523A publication Critical patent/JP2001102523A/ja
Publication of JP2001102523A5 publication Critical patent/JP2001102523A5/ja
Abandoned legal-status Critical Current

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JP27406299A 1999-09-28 1999-09-28 薄膜デバイスおよびその製造方法 Abandoned JP2001102523A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP27406299A JP2001102523A (ja) 1999-09-28 1999-09-28 薄膜デバイスおよびその製造方法
TW089120014A TW492067B (en) 1999-09-28 2000-09-27 Thin film device and method of manufacturing the same
DE10047963A DE10047963A1 (de) 1999-09-28 2000-09-27 Dünnfilm-Bauteil und Verfahren zu dessen Herstellung
US09/670,275 US6503778B1 (en) 1999-09-28 2000-09-27 Thin film device and method of manufacturing the same
KR1020000056962A KR20010039935A (ko) 1999-09-28 2000-09-28 박막 디바이스 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27406299A JP2001102523A (ja) 1999-09-28 1999-09-28 薄膜デバイスおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2001102523A JP2001102523A (ja) 2001-04-13
JP2001102523A5 true JP2001102523A5 (enExample) 2006-04-06

Family

ID=17536447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27406299A Abandoned JP2001102523A (ja) 1999-09-28 1999-09-28 薄膜デバイスおよびその製造方法

Country Status (5)

Country Link
US (1) US6503778B1 (enExample)
JP (1) JP2001102523A (enExample)
KR (1) KR20010039935A (enExample)
DE (1) DE10047963A1 (enExample)
TW (1) TW492067B (enExample)

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JP4574118B2 (ja) * 2003-02-12 2010-11-04 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
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US9496255B2 (en) 2011-11-16 2016-11-15 Qualcomm Incorporated Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming same
US8946052B2 (en) * 2012-09-26 2015-02-03 Sandia Corporation Processes for multi-layer devices utilizing layer transfer
CN104716060A (zh) * 2015-03-16 2015-06-17 中国航天科技集团公司第九研究院第七七一研究所 一种tsv多层芯片键合方法
US9466729B1 (en) * 2015-05-08 2016-10-11 Qualcomm Incorporated Etch stop region based fabrication of bonded semiconductor structures
FR3051971B1 (fr) 2016-05-30 2019-12-13 Soitec Procede de fabrication d'une structure semi-conductrice comprenant un interposeur
FR3068510B1 (fr) * 2017-07-03 2019-08-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une interface destinee a assembler temporairement un support microelectronique et une poignee de manipulation, et interface d'assemblage temporaire
US11239238B2 (en) 2019-10-29 2022-02-01 Intel Corporation Thin film transistor based memory cells on both sides of a layer of logic devices
CN114746999A (zh) * 2019-12-02 2022-07-12 维耶尔公司 在用于微型器件集成的背板上创建暂存
US11817442B2 (en) 2020-12-08 2023-11-14 Intel Corporation Hybrid manufacturing for integrated circuit devices and assemblies
US11756886B2 (en) 2020-12-08 2023-09-12 Intel Corporation Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures
US12412835B2 (en) 2021-04-27 2025-09-09 Intel Corporation Back-side power delivery with glass support at the front
US20220406754A1 (en) * 2021-06-17 2022-12-22 Intel Corporation Layer transfer on non-semiconductor support structures
CN114050194A (zh) * 2021-11-03 2022-02-15 中国电子科技集团公司第十八研究所 一种柔性砷化镓太阳电池支撑衬底及粘接工艺
EP4548723A4 (en) 2022-06-29 2026-06-24 Intel Corp MEMORY MATRICES WITH BACK-MODEL COMPONENTS AND TILT-ON TRANSISTORS

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