JP2000503490A - 高密度チップパッケージに使用する寸法的に安定な芯およびその製法 - Google Patents
高密度チップパッケージに使用する寸法的に安定な芯およびその製法Info
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- JP2000503490A JP2000503490A JP10521537A JP52153798A JP2000503490A JP 2000503490 A JP2000503490 A JP 2000503490A JP 10521537 A JP10521537 A JP 10521537A JP 52153798 A JP52153798 A JP 52153798A JP 2000503490 A JP2000503490 A JP 2000503490A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.チップパッケージ基板用の寸法的に安定な芯であって、 貫通して作られた少なくとも1つのクリアランスを持つ金属の芯、 上記金属芯の上面と下面上の第一の誘電体層であって、上記少なくとも1つの クリアランスを満たしており、おのおのが上面および下面を持つ第一の誘電体層 、 上記第一の誘電体層のうちの上側のものの上記上面上および上記第一の誘電体 層のうちの下側のものの上記下面上の第一の金属キャップ層、および 上記第一の金属キャップ層、上記第一の誘電体層および上記金属芯を通り抜け て延びる第一の伝導性のバイア、を含む寸法的に安定な芯。 2.上記第一の伝導性のバイアを満たしており、上記第一の誘電体層および上 記第一の金属キャップ層の上に広がり、おのおのが上面および下面を持つ少なく とも第二の誘電体層、 上記少なくとも第二の誘電体層のうちの上側のものの上記上面および上記少な くとも第二の誘電体層のうちの下側のものの下面上の少なくとも第二の金属キャ ップ層、および 上記少なくとも第二の金属キャップ層および上記少なくとも第二の誘電体層を 通り抜けて延びる第二の伝導性のバイア、を更に含む請求項1の寸法的に安定な 芯。 3.上記金属芯が銅である請求項2の寸法的に安定な芯。 4.上記銅の芯がおよそ1.4mil以下の厚さである請求項3の寸法的に安 定な芯。 5.上記伝導性の第一および第二のバイアが上記銅の芯の上面と 下面に作られている請求項4の寸法的に安定な芯。 6.上記第一および第二の誘電体層がおよそ5μm以上の厚さである請求項5 の寸法的に安定な芯。 7.上記第一および第二の誘電体層が約25μm〜約50μmの範囲の厚さを 持つ請求項6の寸法的に安定な芯。 8.上記第一および第二の誘電体層が熱硬化性プレプレグシートを含む請求項 7の寸法的に安定な芯。 9.上記熱硬化性プレプレグシートが、ポリテトラフルオロエチレンマトリク ッス中にシアネートエステル樹脂を含む不繊材を含む請求項8の寸法的に安定な 芯。 10.上記第一および第二の誘電体層が熱可塑性材料のシートを含む請求項7 の寸法的に安定な芯。 11.上記第一の誘電体層および上記第一の金属層が一緒に積層される請求項 9の寸法的に安定な芯。 12.上記第二の誘電体層および上記第二の金属キャップ層が一緒に積層され る請求項11の寸法的に安定な芯。 13.上記第一および第二の伝導性バイアが一方閉塞バイアである請求項12 の寸法的に安定な芯。 14.上記第一および第二の伝導性バイアが貫通バイアである請求項12の寸 法的に安定な芯。 15.上記第一および第二の伝導性バイアのどちらかが、一方閉塞バイアおよ び貫通バイアである請求項12の寸法的に安定な芯。 16.上記第一および第二の伝導性バイアが上記金属芯の少なくとも1つのク リアランスを通って延びている請求項3の寸法的に安定な芯。 17.上記誘電体層が充填剤も含む請求項8の寸法的に安定な芯。 18.上記伝導性の第一および第二のバイアのそれぞれが、 上記第一および 第二のバイアの側面に作られた無電解金属の層、および、 上記無電解金属の層の上に作られた電解金属の層、を含む請求項16の寸法的 に安定な芯。 19.上記金属が銅である請求項18の寸法的に安定な芯。 20.少なくとも2つの電子パッケージを含んでいて、これらのパッケージの それぞれが請求項1の寸法的に安定な芯を含み、伝導性のZ軸材料で一緒に結合 して極めて高密度のチップパッケージを形成している、多層パッケージ。 21.伝導性のZ軸材料で一緒に結合した2〜100の電子パッケージがある 請求項20の多層パッケージ。 22.寸法的に安定なチップパッケージであって、 粗い表面およびクリアランスを持つ銅芯、 上記銅芯の上面および下面にあり、上記クリアランスを満たしていて、おのお のが上面および下面を持つ誘電体層、 上記誘電体層のうちの上側のものの上面の銅キャップ層、 上記銅キャップ層、上記誘電体層および上記銅芯を通り抜けて延びるバイア、 および、 上記バイアの側面にあり、かつ上記銅キャップ層および上記誘電体層の上に広が る金属層、を含む寸法的に安定なチップパッケージ。 23.上記銅芯がおよそ1.4mil以下の厚さを持つ請求項22のパッケー ジ。 24.上記誘電体層がおよそ5μm以上の厚さを持つ請求項22のパッケージ 。 25.上記誘電体層が約25μm〜約50pmの範囲の厚さを持つ請求項24 のパッケージ。 26.上記誘電体層が多孔質材料から作られ、接着剤充填物混合物を含む請求 項25のパッケージ。 27.上記バイアが一方閉塞バイアおよび貫通バイアである請求項26のパッ ケージ。 28.上記金属層が、 無電解金属の層、および、 上記無電解金属の層上に作られた電解金属の層、を含む請求項27のパッケー ジ。 29.上記金属が銅である請求項28のパッケージ。 30.上記金属芯が、その上面および下面に積層した銅シートを持つ、30重 量%〜42重量%のニッケルを含むニッケル合金である請求項1の芯。 31.チップパッケージ用の寸法的に安定な芯を製造する方法であって、 a)クリアランスを持つ金属芯を作る工程、 b)この金属芯の上面および下面に、上面と下面とを有する誘電体層を同時に それぞれ配置する工程、および c)上側の誘電体層の上面および下側の誘電体層の下面へ金属キャップ層を同 時に配置する工程、を含むチップパッケージ用の寸法的に安定な芯の製造方法。 32.d)上記金属芯のそれぞれの側で上記金属芯、上記誘電体層および上記 金属キャップ層を積層する工程を更に含む請求項31の方法。 33.e)上記誘電体層、上記金属キャップ層および上記金属芯を通り抜ける バイアを孔あけする工程、を更に含む請求項31の方法。 34.f)上記バイアの側面にありそして上記金属キャップ層お よび上記誘電体層上に広がる金属層を形成することにより上記バイアを金属化す る工程、を更に含む請求項31の方法。 35.g)工程b)〜f)を2〜100回繰り返す工程、を更に含む請求項3 1の方法。 36.上記金属芯が銅である請求項31の方法。 37.上記金属キャップ層が銅キャップ層である請求項31の方法。 38.上記工程b)で上記誘電体が熱硬化性プレプレグである請求項31の方 法。 39.上記熱硬化性プレプレグがポリテトラフルオロエチレンマトリクッス中 にシアネートエステル樹脂を含む不織材料である請求項38の方法。 40.上記工程b)で誘電体層が銅芯のクリアランスを完全に満たすのに十分 な厚さを持つシートである請求項39の方法。 41.上記積層工程d)が、 i)上記誘電体層および金属キャップ層へ、およそ300〜350psiの圧 力を適用する工程、 ii)177℃の温度に達するまで1分当たり5〜7℃の上昇率での加熱する 工程、 iii)177℃の温度をおよそ30分間維持する工程、 iv)温度を220℃〜225℃まで上昇させ、この温度でおよそ60分間の 保持する工程、および、 v)圧力を維持しながらチップパッケージをゆっくり冷却する工程、を含む請 求項35の方法。 42.上記工程e)が貫通バイアおよび一方閉塞バイアの孔あけを含む請求項 41の方法。 43.上記工程e)でレーザーを使用して上記バイアの孔あけを 行う請求項42の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US08/747,169 | 1996-11-08 | ||
US08/747,169 US5847327A (en) | 1996-11-08 | 1996-11-08 | Dimensionally stable core for use in high density chip packages |
PCT/US1997/019635 WO1998020559A1 (en) | 1996-11-08 | 1997-10-30 | Dimensionally stable core for use in high density chip packages and a method of fabricating same |
Publications (3)
Publication Number | Publication Date |
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JP2000503490A true JP2000503490A (ja) | 2000-03-21 |
JP2000503490A5 JP2000503490A5 (ja) | 2005-07-14 |
JP4237259B2 JP4237259B2 (ja) | 2009-03-11 |
Family
ID=25003954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52153798A Expired - Lifetime JP4237259B2 (ja) | 1996-11-08 | 1997-10-30 | チップパッケージ基板およびその製造方法 |
Country Status (4)
Country | Link |
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US (2) | US5847327A (ja) |
JP (1) | JP4237259B2 (ja) |
AU (1) | AU5094698A (ja) |
WO (1) | WO1998020559A1 (ja) |
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JP2018036545A (ja) * | 2016-09-01 | 2018-03-08 | 日本合成化学工業株式会社 | 偏光フィルムの製造方法及び偏光フィルム、偏光板 |
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- 1997-10-30 JP JP52153798A patent/JP4237259B2/ja not_active Expired - Lifetime
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JP2018036545A (ja) * | 2016-09-01 | 2018-03-08 | 日本合成化学工業株式会社 | 偏光フィルムの製造方法及び偏光フィルム、偏光板 |
Also Published As
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AU5094698A (en) | 1998-05-29 |
US20010029065A1 (en) | 2001-10-11 |
JP4237259B2 (ja) | 2009-03-11 |
US6344371B2 (en) | 2002-02-05 |
US5847327A (en) | 1998-12-08 |
WO1998020559A1 (en) | 1998-05-14 |
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