JP2000086673A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000086673A5 JP2000086673A5 JP1999259968A JP25996899A JP2000086673A5 JP 2000086673 A5 JP2000086673 A5 JP 2000086673A5 JP 1999259968 A JP1999259968 A JP 1999259968A JP 25996899 A JP25996899 A JP 25996899A JP 2000086673 A5 JP2000086673 A5 JP 2000086673A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- carbon atoms
- alkyl group
- integer
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000000217 alkyl group Chemical group 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 6
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 6
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 150000002902 organometallic compounds Chemical class 0.000 description 5
- 239000002879 Lewis base Substances 0.000 description 4
- 150000007527 lewis bases Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- JSHASCFKOSDFHY-UHFFFAOYSA-N 1-butylpyrrolidine Chemical compound CCCCN1CCCC1 JSHASCFKOSDFHY-UHFFFAOYSA-N 0.000 description 3
- AVFZOVWCLRSYKC-UHFFFAOYSA-N 1-methylpyrrolidine Chemical compound CN1CCCC1 AVFZOVWCLRSYKC-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- HTLZVHNRZJPSMI-UHFFFAOYSA-N N-ethylpiperidine Chemical compound CCN1CCCCC1 HTLZVHNRZJPSMI-UHFFFAOYSA-N 0.000 description 3
- AHVYPIQETPWLSZ-UHFFFAOYSA-N N-methyl-pyrrolidine Natural products CN1CC=CC1 AHVYPIQETPWLSZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- -1 heterocyclic amine Chemical class 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Chemical group 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 3
- 229930192474 thiophene Natural products 0.000 description 3
- IBBLKSWSCDAPIF-UHFFFAOYSA-N thiopyran Chemical compound S1C=CC=C=C1 IBBLKSWSCDAPIF-UHFFFAOYSA-N 0.000 description 3
- XULIXFLCVXWHRF-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidine Chemical compound CN1C(C)(C)CCCC1(C)C XULIXFLCVXWHRF-UHFFFAOYSA-N 0.000 description 2
- PXHHIBMOFPCBJQ-UHFFFAOYSA-N 1,2-dimethylpyrrolidine Chemical group CC1CCCN1C PXHHIBMOFPCBJQ-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR19980038572A KR100289945B1 (ko) | 1998-09-15 | 1998-09-15 | 알루미늄박막의화학증착용전구체화합물및이의제조방법 |
| KR38572/1998 | 1998-09-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000086673A JP2000086673A (ja) | 2000-03-28 |
| JP2000086673A5 true JP2000086673A5 (https=) | 2006-10-05 |
Family
ID=19551035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11259968A Pending JP2000086673A (ja) | 1998-09-15 | 1999-09-14 | 化学蒸着のための化合物およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6121443A (https=) |
| EP (1) | EP0987270B1 (https=) |
| JP (1) | JP2000086673A (https=) |
| KR (1) | KR100289945B1 (https=) |
| DE (1) | DE69904129T2 (https=) |
| SG (1) | SG79280A1 (https=) |
| TW (1) | TW486482B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100316760B1 (ko) * | 1999-06-11 | 2001-12-12 | 신현국 | 알루미나 박막의 화학 증착용 전구체 화합물 및 이의 제조방법 |
| US7098339B2 (en) * | 2005-01-18 | 2006-08-29 | Praxair Technology, Inc. | Processes for the production of organometallic compounds |
| JP4711113B2 (ja) * | 2005-03-14 | 2011-06-29 | 株式会社トリケミカル研究所 | CH3AlH2:Lの製造方法、Al系膜形成材料、Al系膜形成方法、及びAl系配線膜形成方法 |
| KR100696858B1 (ko) | 2005-09-21 | 2007-03-20 | 삼성전자주식회사 | 유기 알루미늄 전구체 및 이를 이용한 금속배선 형성방법 |
| KR100689668B1 (ko) | 2005-09-26 | 2007-03-08 | 삼성전자주식회사 | 유기 알루미늄 전구체 및 이를 이용한 알루미늄 배선형성방법 |
| KR100724084B1 (ko) * | 2005-11-16 | 2007-06-04 | 주식회사 유피케미칼 | 디알킬아미도디하이드로알루미늄 화합물을 이용한 박막증착방법 |
| KR100829472B1 (ko) * | 2006-05-18 | 2008-05-16 | (주)디엔에프 | 알루미늄 박막의 화학증착용 전구체 화합물 및 이의제조방법 |
| KR100756403B1 (ko) * | 2006-05-18 | 2007-09-10 | (주)디엔에프 | 알루미늄 박막의 화학증착용 전구체 화합물의 제조방법 |
| US8597424B2 (en) * | 2007-12-26 | 2013-12-03 | Jsr Corporation | Composition and method for forming an aluminum film |
| US8268722B2 (en) * | 2009-06-03 | 2012-09-18 | Novellus Systems, Inc. | Interfacial capping layers for interconnects |
| US20110206844A1 (en) | 2010-02-24 | 2011-08-25 | Jacob Grant Wiles | Chromium-free passivation of vapor deposited aluminum surfaces |
| US9633896B1 (en) | 2015-10-09 | 2017-04-25 | Lam Research Corporation | Methods for formation of low-k aluminum-containing etch stop films |
| SG11202005468YA (en) | 2017-12-20 | 2020-07-29 | Basf Se | Process for the generation of metal-containing films |
| TWI839372B (zh) * | 2018-07-30 | 2024-04-21 | 南韓商Up化學有限公司 | 鋁化合物和使用其形成含鋁膜的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB905985A (en) | 1959-02-24 | 1962-09-19 | Ethyl Corp | Preparing metal-alumino hydrides |
| JPS57188026A (en) | 1981-05-14 | 1982-11-18 | Minolta Camera Co Ltd | Driving device for photographing lens of automatic focusing camera |
| US4923717A (en) * | 1989-03-17 | 1990-05-08 | Regents Of The University Of Minnesota | Process for the chemical vapor deposition of aluminum |
| JP2721023B2 (ja) * | 1989-09-26 | 1998-03-04 | キヤノン株式会社 | 堆積膜形成法 |
| US5113025A (en) | 1989-10-02 | 1992-05-12 | Ethyl Corporation | Selective reducing agents |
| US5178911A (en) * | 1989-11-30 | 1993-01-12 | The President And Fellows Of Harvard College | Process for chemical vapor deposition of main group metal nitrides |
| DE69120446T2 (de) * | 1990-02-19 | 1996-11-14 | Canon Kk | Verfahren zum Herstellen von abgeschiedener Metallschicht, die Aluminium als Hauptkomponente enthält, mit Anwendung von Alkylaluminiumhydrid |
| US5130459A (en) * | 1990-06-08 | 1992-07-14 | Nec Corporation | Selective chemical vapor deposition of aluminum, aluminum CVD materials and process for preparing the same |
| US5136046A (en) | 1990-09-28 | 1992-08-04 | Ethyl Corporation | Preparation of amine alanes |
| US5191099A (en) * | 1991-09-05 | 1993-03-02 | Regents Of The University Of Minnesota | Chemical vapor deposition of aluminum films using dimethylethylamine alane |
| JPH0912581A (ja) * | 1995-04-28 | 1997-01-14 | Sumitomo Chem Co Ltd | ジメチルアルミニウムハイドライド組成物及びその製造方法ならびにジメチルアルミニウムハイドライドの粘度調製方法 |
| US5900279A (en) | 1995-11-20 | 1999-05-04 | Tri Chemical Laboratory Inc. | Processes for the chemical vapor deposition and solvent used for the processes |
| JP2913583B2 (ja) * | 1996-09-24 | 1999-06-28 | 株式会社トリケミカル研究所 | Al膜形成材料及びAl膜形成方法 |
-
1998
- 1998-09-15 KR KR19980038572A patent/KR100289945B1/ko not_active Expired - Fee Related
-
1999
- 1999-03-31 US US09/283,317 patent/US6121443A/en not_active Expired - Fee Related
- 1999-08-19 TW TW088114186A patent/TW486482B/zh not_active IP Right Cessation
- 1999-09-01 DE DE69904129T patent/DE69904129T2/de not_active Expired - Fee Related
- 1999-09-01 EP EP99306952A patent/EP0987270B1/en not_active Expired - Lifetime
- 1999-09-13 SG SG9904472A patent/SG79280A1/en unknown
- 1999-09-14 JP JP11259968A patent/JP2000086673A/ja active Pending
-
2000
- 2000-06-16 US US09/595,109 patent/US6380383B1/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000026474A5 (https=) | ||
| JP2000086673A5 (https=) | ||
| JP2579169B2 (ja) | 有機金属化合物からなる基体上金属気相沈着用材料 | |
| JP5548748B2 (ja) | ハフニウム系薄膜形成方法およびハフニウム系薄膜形成材料 | |
| US7329768B2 (en) | Chemical vapor deposition precursors for deposition of tantalum-based materials | |
| WO2003044025A1 (en) | NITROGEN ANALOGS OF COPPER II ß-DIKETONATES AS SOURCE REAGENTS FOR SEMICONDUCTOR PROCESSING | |
| CN116041392B (zh) | 一种含有磷酸基团的化合物、其制备方法及其应用 | |
| JP4198820B2 (ja) | 化学蒸着のためのアルミニウム錯体誘導体およびその製造方法 | |
| JP2002212112A (ja) | 化学気相蒸着用のルテニウム化合物並びにルテニウム薄膜及びルテニウム化合物薄膜の化学気相蒸着方法。 | |
| JPH03190884A (ja) | 異節環式有機金属化合物 | |
| JP2000086673A (ja) | 化学蒸着のための化合物およびその製造方法 | |
| KR100246155B1 (ko) | 알루미늄 화학 증착법을 위한 새로운 아마이도 알란 전구체 | |
| US20090043119A1 (en) | Tantalum compound, method for producing same, tantalum-containing thin film and method for forming same | |
| KR102327450B1 (ko) | 4족 전이금속 화합물, 이의 제조방법 및 이를 포함하는 박막증착용 조성물 | |
| KR100863063B1 (ko) | 화학 증착용 유기 알루미늄 전구체 용액 및 그 제조 방법 | |
| KR20210058370A (ko) | 텅스텐 화합물, 이의 제조방법 및 이를 이용한 텅스텐 함유 박막 및 이의 제조방법 | |
| KR20210031492A (ko) | 금속 또는 반금속-함유 필름의 제조 방법 | |
| US5259915A (en) | Organometallic compounds | |
| WO2003064437A1 (fr) | Complexes de cuivre et procede de fabrication de films minces contenant du cuivre au moyen desdits complexes de cuivre | |
| JP2006013267A (ja) | 有機ランタン化合物及び該化合物を用いたランタン含有膜の製造方法 | |
| US20250034181A1 (en) | Silicon-containing group 4 precursors and deposition of metal-containing films | |
| KR20240080329A (ko) | 이트륨 또는 스칸듐 함유 박막 형성용 전구체, 이를 이용한 이트륨 또는 스칸듐 함유 박막 형성 방법 및 상기 이트륨 또는 스칸듐 함유 박막을 포함하는 반도체 소자. | |
| JP2002220397A (ja) | ビス(シクロペンタジエニル)ルテニウム誘導体の製造方法及びその製造方法により製造されるビス(シクロペンタジエニル)ルテニウム誘導体並びにルテニウム薄膜又はルテニウム化合物薄膜の製造方法 | |
| JP4102954B2 (ja) | 有機金属化学蒸着用有機銅化合物及びこれを含む銅薄膜形成用溶液原料並びにこれから作られた銅薄膜 | |
| JP2002114796A (ja) | 化学気相蒸着用のルテニウム化合物並びにルテニウム薄膜又はルテニウム化合物薄膜の化学気相蒸着方法 |