JP2000086673A - 化学蒸着のための化合物およびその製造方法 - Google Patents

化学蒸着のための化合物およびその製造方法

Info

Publication number
JP2000086673A
JP2000086673A JP11259968A JP25996899A JP2000086673A JP 2000086673 A JP2000086673 A JP 2000086673A JP 11259968 A JP11259968 A JP 11259968A JP 25996899 A JP25996899 A JP 25996899A JP 2000086673 A JP2000086673 A JP 2000086673A
Authority
JP
Japan
Prior art keywords
formula
alkyl group
aluminum
compound
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11259968A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000086673A5 (https=
Inventor
Hyun-Koock Shin
ヒュン−クック・シン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Co
Original Assignee
Rohm and Haas Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Publication of JP2000086673A publication Critical patent/JP2000086673A/ja
Publication of JP2000086673A5 publication Critical patent/JP2000086673A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/06—Aluminium compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C23C16/20—Deposition of aluminium only
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/06—Aluminium compounds
    • C07F5/061—Aluminium compounds with C-aluminium linkage
    • C07F5/065—Aluminium compounds with C-aluminium linkage compounds with an Al-H linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/06—Aluminium compounds
    • C07F5/061—Aluminium compounds with C-aluminium linkage
    • C07F5/066—Aluminium compounds with C-aluminium linkage compounds with Al linked to an element other than Al, C, H or halogen (this includes Al-cyanide linkage)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
JP11259968A 1998-09-15 1999-09-14 化学蒸着のための化合物およびその製造方法 Pending JP2000086673A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR19980038572A KR100289945B1 (ko) 1998-09-15 1998-09-15 알루미늄박막의화학증착용전구체화합물및이의제조방법
KR38572/1998 1998-09-15

Publications (2)

Publication Number Publication Date
JP2000086673A true JP2000086673A (ja) 2000-03-28
JP2000086673A5 JP2000086673A5 (https=) 2006-10-05

Family

ID=19551035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11259968A Pending JP2000086673A (ja) 1998-09-15 1999-09-14 化学蒸着のための化合物およびその製造方法

Country Status (7)

Country Link
US (2) US6121443A (https=)
EP (1) EP0987270B1 (https=)
JP (1) JP2000086673A (https=)
KR (1) KR100289945B1 (https=)
DE (1) DE69904129T2 (https=)
SG (1) SG79280A1 (https=)
TW (1) TW486482B (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249032A (ja) * 2005-03-14 2006-09-21 Tri Chemical Laboratory Inc 新規化合物、新規化合物の製造方法、Ａｌ系膜形成材料、Ａｌ系膜形成方法、及びＡｌ系膜
US7452569B2 (en) 2005-09-26 2008-11-18 Samsung Electronics Co., Ltd. Organic aluminum precursor and method of manufacturing a metal wiring using the same
US7488684B2 (en) 2005-09-21 2009-02-10 Samsung Electronics Co., Ltd. Organic aluminum precursor and method of forming a metal wire using the same
WO2009082031A1 (ja) 2007-12-26 2009-07-02 Jsr Corporation アルミニウム膜形成用組成物及びアルミニウム膜の形成方法
JP2021533104A (ja) * 2018-07-30 2021-12-02 ユーピー ケミカル カンパニー リミテッド アルミニウム化合物及びこれを使用したアルミニウム含有膜の形成方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100316760B1 (ko) * 1999-06-11 2001-12-12 신현국 알루미나 박막의 화학 증착용 전구체 화합물 및 이의 제조방법
US7098339B2 (en) * 2005-01-18 2006-08-29 Praxair Technology, Inc. Processes for the production of organometallic compounds
KR100724084B1 (ko) * 2005-11-16 2007-06-04 주식회사 유피케미칼 디알킬아미도디하이드로알루미늄 화합물을 이용한 박막증착방법
KR100829472B1 (ko) * 2006-05-18 2008-05-16 (주)디엔에프 알루미늄 박막의 화학증착용 전구체 화합물 및 이의제조방법
KR100756403B1 (ko) * 2006-05-18 2007-09-10 (주)디엔에프 알루미늄 박막의 화학증착용 전구체 화합물의 제조방법
US8268722B2 (en) * 2009-06-03 2012-09-18 Novellus Systems, Inc. Interfacial capping layers for interconnects
US20110206844A1 (en) 2010-02-24 2011-08-25 Jacob Grant Wiles Chromium-free passivation of vapor deposited aluminum surfaces
US9633896B1 (en) 2015-10-09 2017-04-25 Lam Research Corporation Methods for formation of low-k aluminum-containing etch stop films
SG11202005468YA (en) 2017-12-20 2020-07-29 Basf Se Process for the generation of metal-containing films

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912581A (ja) * 1995-04-28 1997-01-14 Sumitomo Chem Co Ltd ジメチルアルミニウムハイドライド組成物及びその製造方法ならびにジメチルアルミニウムハイドライドの粘度調製方法
JPH1096079A (ja) * 1996-09-24 1998-04-14 Tori Chem Kenkyusho:Kk Ａｌ膜形成材料及びＡｌ膜形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB905985A (en) 1959-02-24 1962-09-19 Ethyl Corp Preparing metal-alumino hydrides
JPS57188026A (en) 1981-05-14 1982-11-18 Minolta Camera Co Ltd Driving device for photographing lens of automatic focusing camera
US4923717A (en) * 1989-03-17 1990-05-08 Regents Of The University Of Minnesota Process for the chemical vapor deposition of aluminum
JP2721023B2 (ja) * 1989-09-26 1998-03-04 キヤノン株式会社 堆積膜形成法
US5113025A (en) 1989-10-02 1992-05-12 Ethyl Corporation Selective reducing agents
US5178911A (en) * 1989-11-30 1993-01-12 The President And Fellows Of Harvard College Process for chemical vapor deposition of main group metal nitrides
DE69120446T2 (de) * 1990-02-19 1996-11-14 Canon Kk Verfahren zum Herstellen von abgeschiedener Metallschicht, die Aluminium als Hauptkomponente enthält, mit Anwendung von Alkylaluminiumhydrid
US5130459A (en) * 1990-06-08 1992-07-14 Nec Corporation Selective chemical vapor deposition of aluminum, aluminum CVD materials and process for preparing the same
US5136046A (en) 1990-09-28 1992-08-04 Ethyl Corporation Preparation of amine alanes
US5191099A (en) * 1991-09-05 1993-03-02 Regents Of The University Of Minnesota Chemical vapor deposition of aluminum films using dimethylethylamine alane
US5900279A (en) 1995-11-20 1999-05-04 Tri Chemical Laboratory Inc. Processes for the chemical vapor deposition and solvent used for the processes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912581A (ja) * 1995-04-28 1997-01-14 Sumitomo Chem Co Ltd ジメチルアルミニウムハイドライド組成物及びその製造方法ならびにジメチルアルミニウムハイドライドの粘度調製方法
JPH1096079A (ja) * 1996-09-24 1998-04-14 Tori Chem Kenkyusho:Kk Ａｌ膜形成材料及びＡｌ膜形成方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249032A (ja) * 2005-03-14 2006-09-21 Tri Chemical Laboratory Inc 新規化合物、新規化合物の製造方法、Ａｌ系膜形成材料、Ａｌ系膜形成方法、及びＡｌ系膜
US7488684B2 (en) 2005-09-21 2009-02-10 Samsung Electronics Co., Ltd. Organic aluminum precursor and method of forming a metal wire using the same
US7452569B2 (en) 2005-09-26 2008-11-18 Samsung Electronics Co., Ltd. Organic aluminum precursor and method of manufacturing a metal wiring using the same
WO2009082031A1 (ja) 2007-12-26 2009-07-02 Jsr Corporation アルミニウム膜形成用組成物及びアルミニウム膜の形成方法
US8597424B2 (en) 2007-12-26 2013-12-03 Jsr Corporation Composition and method for forming an aluminum film
JP2021533104A (ja) * 2018-07-30 2021-12-02 ユーピー ケミカル カンパニー リミテッド アルミニウム化合物及びこれを使用したアルミニウム含有膜の形成方法
JP7401928B2 (ja) 2018-07-30 2023-12-20 ユーピー ケミカル カンパニー リミテッド アルミニウム化合物及びこれを使用したアルミニウム含有膜の形成方法

Also Published As

Publication number Publication date
SG79280A1 (en) 2001-03-20
DE69904129T2 (de) 2003-05-08
DE69904129D1 (de) 2003-01-09
TW486482B (en) 2002-05-11
EP0987270A3 (en) 2001-06-06
KR20000020137A (ko) 2000-04-15
KR100289945B1 (ko) 2001-09-17
EP0987270B1 (en) 2002-11-27
EP0987270A2 (en) 2000-03-22
US6380383B1 (en) 2002-04-30
US6121443A (en) 2000-09-19

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