DE69904129T2 - Aluminiumverbindungen zur Herstellung von Aluminiumschichten durch chemische Gasphasen-Abscheidung und deren Herstellung - Google Patents
Aluminiumverbindungen zur Herstellung von Aluminiumschichten durch chemische Gasphasen-Abscheidung und deren HerstellungInfo
- Publication number
- DE69904129T2 DE69904129T2 DE69904129T DE69904129T DE69904129T2 DE 69904129 T2 DE69904129 T2 DE 69904129T2 DE 69904129 T DE69904129 T DE 69904129T DE 69904129 T DE69904129 T DE 69904129T DE 69904129 T2 DE69904129 T2 DE 69904129T2
- Authority
- DE
- Germany
- Prior art keywords
- aluminum
- formula
- hydride
- vapor deposition
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 51
- 229910052782 aluminium Inorganic materials 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000005229 chemical vapour deposition Methods 0.000 title description 13
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 title description 7
- 150000001875 compounds Chemical class 0.000 claims description 61
- 239000002243 precursor Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 42
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- -1 heterocyclic amine Chemical class 0.000 claims description 30
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims description 19
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 18
- 238000007740 vapor deposition Methods 0.000 claims description 18
- 239000002879 Lewis base Substances 0.000 claims description 17
- 150000007527 lewis bases Chemical class 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 claims description 14
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 14
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 239000000725 suspension Substances 0.000 claims description 11
- AVFZOVWCLRSYKC-UHFFFAOYSA-N 1-methylpyrrolidine Chemical compound CN1CCCC1 AVFZOVWCLRSYKC-UHFFFAOYSA-N 0.000 claims description 10
- AHVYPIQETPWLSZ-UHFFFAOYSA-N N-methyl-pyrrolidine Natural products CN1CC=CC1 AHVYPIQETPWLSZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000012280 lithium aluminium hydride Substances 0.000 claims description 10
- 150000002902 organometallic compounds Chemical class 0.000 claims description 10
- HTLZVHNRZJPSMI-UHFFFAOYSA-N N-ethylpiperidine Chemical compound CCN1CCCCC1 HTLZVHNRZJPSMI-UHFFFAOYSA-N 0.000 claims description 9
- JSHASCFKOSDFHY-UHFFFAOYSA-N 1-butylpyrrolidine Chemical compound CCCCN1CCCC1 JSHASCFKOSDFHY-UHFFFAOYSA-N 0.000 claims description 8
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000003574 free electron Substances 0.000 claims description 7
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 7
- 229930192474 thiophene Natural products 0.000 claims description 7
- IBBLKSWSCDAPIF-UHFFFAOYSA-N thiopyran Chemical compound S1C=CC=C=C1 IBBLKSWSCDAPIF-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- XULIXFLCVXWHRF-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidine Chemical compound CN1C(C)(C)CCCC1(C)C XULIXFLCVXWHRF-UHFFFAOYSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- PXHHIBMOFPCBJQ-UHFFFAOYSA-N 1,2-dimethylpyrrolidine Chemical compound CC1CCCN1C PXHHIBMOFPCBJQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 238000001947 vapour-phase growth Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 18
- 239000007788 liquid Substances 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 150000004678 hydrides Chemical class 0.000 description 17
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 17
- 230000008021 deposition Effects 0.000 description 12
- TUTOKIOKAWTABR-UHFFFAOYSA-N dimethylalumane Chemical compound C[AlH]C TUTOKIOKAWTABR-UHFFFAOYSA-N 0.000 description 12
- 238000011161 development Methods 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 11
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000005019 vapor deposition process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000005481 NMR spectroscopy Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- JRZWKWLLFXBMEF-UHFFFAOYSA-N C[AlH]C.CN1CCCCC1 Chemical compound C[AlH]C.CN1CCCCC1 JRZWKWLLFXBMEF-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 239000000706 filtrate Substances 0.000 description 6
- 150000002431 hydrogen Chemical class 0.000 description 6
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- AYCGOXXHRCXEFT-UHFFFAOYSA-N C[AlH]C.C(C)N1CCCCC1 Chemical compound C[AlH]C.C(C)N1CCCCC1 AYCGOXXHRCXEFT-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RWRDLPDLKQPQOW-UHFFFAOYSA-N tetrahydropyrrole Natural products C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 229910000086 alane Inorganic materials 0.000 description 3
- 235000011089 carbon dioxide Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 3
- 229910010082 LiAlH Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000005234 alkyl aluminium group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IGNGFGXAWDQJGP-UHFFFAOYSA-N 1,3-dimethylpyrrolidine Chemical compound CC1CCN(C)C1 IGNGFGXAWDQJGP-UHFFFAOYSA-N 0.000 description 1
- AXSSJSFXWMOTEN-UHFFFAOYSA-N 1,4-dimethylpyrrolidin-2-one Chemical compound CC1CN(C)C(=O)C1 AXSSJSFXWMOTEN-UHFFFAOYSA-N 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001399 aluminium compounds Chemical class 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
- C23C16/20—Deposition of aluminium only
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/061—Aluminium compounds with C-aluminium linkage
- C07F5/065—Aluminium compounds with C-aluminium linkage compounds with an Al-H linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/061—Aluminium compounds with C-aluminium linkage
- C07F5/066—Aluminium compounds with C-aluminium linkage compounds with Al linked to an element other than Al, C, H or halogen (this includes Al-cyanide linkage)
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR19980038572A KR100289945B1 (ko) | 1998-09-15 | 1998-09-15 | 알루미늄박막의화학증착용전구체화합물및이의제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69904129D1 DE69904129D1 (de) | 2003-01-09 |
| DE69904129T2 true DE69904129T2 (de) | 2003-05-08 |
Family
ID=19551035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69904129T Expired - Fee Related DE69904129T2 (de) | 1998-09-15 | 1999-09-01 | Aluminiumverbindungen zur Herstellung von Aluminiumschichten durch chemische Gasphasen-Abscheidung und deren Herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6121443A (https=) |
| EP (1) | EP0987270B1 (https=) |
| JP (1) | JP2000086673A (https=) |
| KR (1) | KR100289945B1 (https=) |
| DE (1) | DE69904129T2 (https=) |
| SG (1) | SG79280A1 (https=) |
| TW (1) | TW486482B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100316760B1 (ko) * | 1999-06-11 | 2001-12-12 | 신현국 | 알루미나 박막의 화학 증착용 전구체 화합물 및 이의 제조방법 |
| US7098339B2 (en) * | 2005-01-18 | 2006-08-29 | Praxair Technology, Inc. | Processes for the production of organometallic compounds |
| JP4711113B2 (ja) * | 2005-03-14 | 2011-06-29 | 株式会社トリケミカル研究所 | ＣＨ３ＡｌＨ２：Ｌの製造方法、Ａｌ系膜形成材料、Ａｌ系膜形成方法、及びＡｌ系配線膜形成方法 |
| KR100696858B1 (ko) | 2005-09-21 | 2007-03-20 | 삼성전자주식회사 | 유기 알루미늄 전구체 및 이를 이용한 금속배선 형성방법 |
| KR100689668B1 (ko) | 2005-09-26 | 2007-03-08 | 삼성전자주식회사 | 유기 알루미늄 전구체 및 이를 이용한 알루미늄 배선형성방법 |
| KR100724084B1 (ko) * | 2005-11-16 | 2007-06-04 | 주식회사 유피케미칼 | 디알킬아미도디하이드로알루미늄 화합물을 이용한 박막증착방법 |
| KR100829472B1 (ko) * | 2006-05-18 | 2008-05-16 | (주)디엔에프 | 알루미늄 박막의 화학증착용 전구체 화합물 및 이의제조방법 |
| KR100756403B1 (ko) * | 2006-05-18 | 2007-09-10 | (주)디엔에프 | 알루미늄 박막의 화학증착용 전구체 화합물의 제조방법 |
| US8597424B2 (en) * | 2007-12-26 | 2013-12-03 | Jsr Corporation | Composition and method for forming an aluminum film |
| US8268722B2 (en) * | 2009-06-03 | 2012-09-18 | Novellus Systems, Inc. | Interfacial capping layers for interconnects |
| US20110206844A1 (en) | 2010-02-24 | 2011-08-25 | Jacob Grant Wiles | Chromium-free passivation of vapor deposited aluminum surfaces |
| US9633896B1 (en) | 2015-10-09 | 2017-04-25 | Lam Research Corporation | Methods for formation of low-k aluminum-containing etch stop films |
| SG11202005468YA (en) | 2017-12-20 | 2020-07-29 | Basf Se | Process for the generation of metal-containing films |
| TWI839372B (zh) * | 2018-07-30 | 2024-04-21 | 南韓商Ｕｐ化學有限公司 | 鋁化合物和使用其形成含鋁膜的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB905985A (en) | 1959-02-24 | 1962-09-19 | Ethyl Corp | Preparing metal-alumino hydrides |
| JPS57188026A (en) | 1981-05-14 | 1982-11-18 | Minolta Camera Co Ltd | Driving device for photographing lens of automatic focusing camera |
| US4923717A (en) * | 1989-03-17 | 1990-05-08 | Regents Of The University Of Minnesota | Process for the chemical vapor deposition of aluminum |
| JP2721023B2 (ja) * | 1989-09-26 | 1998-03-04 | キヤノン株式会社 | 堆積膜形成法 |
| US5113025A (en) | 1989-10-02 | 1992-05-12 | Ethyl Corporation | Selective reducing agents |
| US5178911A (en) * | 1989-11-30 | 1993-01-12 | The President And Fellows Of Harvard College | Process for chemical vapor deposition of main group metal nitrides |
| DE69120446T2 (de) * | 1990-02-19 | 1996-11-14 | Canon Kk | Verfahren zum Herstellen von abgeschiedener Metallschicht, die Aluminium als Hauptkomponente enthält, mit Anwendung von Alkylaluminiumhydrid |
| US5130459A (en) * | 1990-06-08 | 1992-07-14 | Nec Corporation | Selective chemical vapor deposition of aluminum, aluminum CVD materials and process for preparing the same |
| US5136046A (en) | 1990-09-28 | 1992-08-04 | Ethyl Corporation | Preparation of amine alanes |
| US5191099A (en) * | 1991-09-05 | 1993-03-02 | Regents Of The University Of Minnesota | Chemical vapor deposition of aluminum films using dimethylethylamine alane |
| JPH0912581A (ja) * | 1995-04-28 | 1997-01-14 | Sumitomo Chem Co Ltd | ジメチルアルミニウムハイドライド組成物及びその製造方法ならびにジメチルアルミニウムハイドライドの粘度調製方法 |
| US5900279A (en) | 1995-11-20 | 1999-05-04 | Tri Chemical Laboratory Inc. | Processes for the chemical vapor deposition and solvent used for the processes |
| JP2913583B2 (ja) * | 1996-09-24 | 1999-06-28 | 株式会社トリケミカル研究所 | Ａｌ膜形成材料及びＡｌ膜形成方法 |
-
1998
- 1998-09-15 KR KR19980038572A patent/KR100289945B1/ko not_active Expired - Fee Related
-
1999
- 1999-03-31 US US09/283,317 patent/US6121443A/en not_active Expired - Fee Related
- 1999-08-19 TW TW088114186A patent/TW486482B/zh not_active IP Right Cessation
- 1999-09-01 DE DE69904129T patent/DE69904129T2/de not_active Expired - Fee Related
- 1999-09-01 EP EP99306952A patent/EP0987270B1/en not_active Expired - Lifetime
- 1999-09-13 SG SG9904472A patent/SG79280A1/en unknown
- 1999-09-14 JP JP11259968A patent/JP2000086673A/ja active Pending
-
2000
- 2000-06-16 US US09/595,109 patent/US6380383B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| SG79280A1 (en) | 2001-03-20 |
| DE69904129D1 (de) | 2003-01-09 |
| TW486482B (en) | 2002-05-11 |
| JP2000086673A (ja) | 2000-03-28 |
| EP0987270A3 (en) | 2001-06-06 |
| KR20000020137A (ko) | 2000-04-15 |
| KR100289945B1 (ko) | 2001-09-17 |
| EP0987270B1 (en) | 2002-11-27 |
| EP0987270A2 (en) | 2000-03-22 |
| US6380383B1 (en) | 2002-04-30 |
| US6121443A (en) | 2000-09-19 |
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